DE2716729C3 - Verfahren zum Katalysieren von Oberflächen - Google Patents
Verfahren zum Katalysieren von OberflächenInfo
- Publication number
- DE2716729C3 DE2716729C3 DE2716729A DE2716729A DE2716729C3 DE 2716729 C3 DE2716729 C3 DE 2716729C3 DE 2716729 A DE2716729 A DE 2716729A DE 2716729 A DE2716729 A DE 2716729A DE 2716729 C3 DE2716729 C3 DE 2716729C3
- Authority
- DE
- Germany
- Prior art keywords
- solution
- copper
- water
- catalytic
- organic solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 38
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 22
- 229910052802 copper Inorganic materials 0.000 claims description 22
- 239000010949 copper Substances 0.000 claims description 22
- 230000003197 catalytic effect Effects 0.000 claims description 21
- 239000003638 chemical reducing agent Substances 0.000 claims description 12
- -1 copper (I) ion compound Chemical class 0.000 claims description 12
- 238000001465 metallisation Methods 0.000 claims description 10
- 239000003054 catalyst Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 7
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 claims description 6
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 6
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 5
- 238000006555 catalytic reaction Methods 0.000 claims description 4
- 229910052736 halogen Inorganic materials 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 229920003002 synthetic resin Polymers 0.000 claims description 3
- 239000000057 synthetic resin Substances 0.000 claims description 3
- 230000003213 activating effect Effects 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims description 2
- 239000004615 ingredient Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000003960 organic solvent Substances 0.000 claims 7
- 238000000454 electroless metal deposition Methods 0.000 claims 4
- 239000002245 particle Substances 0.000 claims 4
- 239000005749 Copper compound Substances 0.000 claims 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims 2
- 238000004873 anchoring Methods 0.000 claims 2
- 150000001879 copper Chemical class 0.000 claims 2
- 150000001880 copper compounds Chemical class 0.000 claims 2
- LTYZGLKKXZXSEC-UHFFFAOYSA-N copper dihydride Chemical compound [CuH2] LTYZGLKKXZXSEC-UHFFFAOYSA-N 0.000 claims 2
- 229910000050 copper hydride Inorganic materials 0.000 claims 2
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims 2
- 238000001035 drying Methods 0.000 claims 2
- 230000007062 hydrolysis Effects 0.000 claims 2
- 238000006460 hydrolysis reaction Methods 0.000 claims 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims 2
- 239000011810 insulating material Substances 0.000 claims 2
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 229920001169 thermoplastic Polymers 0.000 claims 2
- 229920001187 thermosetting polymer Polymers 0.000 claims 2
- 239000004416 thermosoftening plastic Substances 0.000 claims 2
- 238000009736 wetting Methods 0.000 claims 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims 1
- 239000005751 Copper oxide Substances 0.000 claims 1
- VMQMZMRVKUZKQL-UHFFFAOYSA-N Cu+ Chemical class [Cu+] VMQMZMRVKUZKQL-UHFFFAOYSA-N 0.000 claims 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims 1
- 206010070834 Sensitisation Diseases 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 239000000470 constituent Substances 0.000 claims 1
- 229910001431 copper ion Inorganic materials 0.000 claims 1
- 229910000431 copper oxide Inorganic materials 0.000 claims 1
- 238000004090 dissolution Methods 0.000 claims 1
- 239000011152 fibreglass Substances 0.000 claims 1
- 230000006870 function Effects 0.000 claims 1
- 230000035784 germination Effects 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 239000002648 laminated material Substances 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 239000004033 plastic Substances 0.000 claims 1
- 229920003023 plastic Polymers 0.000 claims 1
- 238000002360 preparation method Methods 0.000 claims 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 230000008313 sensitization Effects 0.000 claims 1
- 230000001235 sensitizing effect Effects 0.000 claims 1
- 235000011150 stannous chloride Nutrition 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 230000008961 swelling Effects 0.000 claims 1
- AXZWODMDQAVCJE-UHFFFAOYSA-L tin(II) chloride (anhydrous) Chemical compound [Cl-].[Cl-].[Sn+2] AXZWODMDQAVCJE-UHFFFAOYSA-L 0.000 claims 1
- 239000000243 solution Substances 0.000 description 31
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 24
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 8
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 8
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 8
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 7
- 239000010410 layer Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 238000007654 immersion Methods 0.000 description 4
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- 101100496858 Mus musculus Colec12 gene Proteins 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000012279 sodium borohydride Substances 0.000 description 2
- 229910000033 sodium borohydride Inorganic materials 0.000 description 2
- 235000002906 tartaric acid Nutrition 0.000 description 2
- 239000011975 tartaric acid Substances 0.000 description 2
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 229910021589 Copper(I) bromide Inorganic materials 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical class B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 description 1
- 229910000085 borane Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- ZCCIPPOKBCJFDN-UHFFFAOYSA-N calcium nitrate Chemical compound [Ca+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O ZCCIPPOKBCJFDN-UHFFFAOYSA-N 0.000 description 1
- JZULKTSSLJNBQJ-UHFFFAOYSA-N chromium;sulfuric acid Chemical compound [Cr].OS(O)(=O)=O JZULKTSSLJNBQJ-UHFFFAOYSA-N 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 210000002837 heart atrium Anatomy 0.000 description 1
- DKAGJZJALZXOOV-UHFFFAOYSA-N hydrate;hydrochloride Chemical compound O.Cl DKAGJZJALZXOOV-UHFFFAOYSA-N 0.000 description 1
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000005340 laminated glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- UPIDXCYJXHFCOZ-UHFFFAOYSA-N n,n-dimethylformamide;sodium Chemical compound [Na].CN(C)C=O UPIDXCYJXHFCOZ-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Inorganic materials [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 1
- 235000010333 potassium nitrate Nutrition 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- MNWBNISUBARLIT-UHFFFAOYSA-N sodium cyanide Chemical compound [Na+].N#[C-] MNWBNISUBARLIT-UHFFFAOYSA-N 0.000 description 1
- 229910001631 strontium chloride Inorganic materials 0.000 description 1
- AHBGXTDRMVNFER-UHFFFAOYSA-L strontium dichloride Chemical compound [Cl-].[Cl-].[Sr+2] AHBGXTDRMVNFER-UHFFFAOYSA-L 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Surface Treatment Of Glass (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US67652776A | 1976-04-13 | 1976-04-13 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| DE2716729A1 DE2716729A1 (de) | 1977-10-20 |
| DE2716729B2 DE2716729B2 (de) | 1979-03-08 |
| DE2716729C3 true DE2716729C3 (de) | 1979-10-25 |
Family
ID=24714893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2716729A Expired DE2716729C3 (de) | 1976-04-13 | 1977-04-13 | Verfahren zum Katalysieren von Oberflächen |
Country Status (15)
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4327125A (en) * | 1974-10-04 | 1982-04-27 | Nathan Feldstein | Colloidal compositions for electroless deposition comprising colloidal copper-stannic oxide product |
| US4239538A (en) * | 1976-03-30 | 1980-12-16 | Surface Technology, Inc. | Catalytic primer |
| US4259376A (en) * | 1977-09-16 | 1981-03-31 | Nathan Feldstein | Catalytic promoters in electroless plating catalysts applied as an emulsion |
| US4233344A (en) * | 1978-07-20 | 1980-11-11 | Learonal, Inc. | Method of improving the adhesion of electroless metal deposits employing colloidal copper activator |
| SU921124A1 (ru) * | 1979-06-19 | 1982-04-15 | Институт Физико-Химических Основ Переработки Минерального Сырья Со Ан Ссср | Способ металлизации отверстий печатных плат |
| US4604299A (en) * | 1983-06-09 | 1986-08-05 | Kollmorgen Technologies Corporation | Metallization of ceramics |
| US4574094A (en) * | 1983-06-09 | 1986-03-04 | Kollmorgen Technologies Corporation | Metallization of ceramics |
| DE3574270D1 (en) * | 1984-06-29 | 1989-12-21 | Hitachi Chemical Co Ltd | Sensitizing agent for electroless plating and method for sensitizing substrate with the agent |
| JP2965569B2 (ja) * | 1987-09-25 | 1999-10-18 | ハーシヨー・ケミカルズ・リミテツド | プラスチック基材のエツチング前処理 |
| US4775557A (en) * | 1987-11-09 | 1988-10-04 | Enthone, Incorporated | Composition and process for conditioning the surface of polycarbonate resins prior to metal plating |
| JPH01136056U (enrdf_load_stackoverflow) * | 1987-11-26 | 1989-09-18 | ||
| JPH01104850U (enrdf_load_stackoverflow) * | 1987-12-29 | 1989-07-14 | ||
| FR2646583B1 (fr) * | 1989-05-01 | 1992-01-24 | Enthone Corp | Procede pour fabriquer des plaquettes a circuits imprimes |
| US5108786A (en) * | 1989-05-01 | 1992-04-28 | Enthone-Omi, Inc. | Method of making printed circuit boards |
| JP2002309376A (ja) * | 2001-04-10 | 2002-10-23 | Okuno Chem Ind Co Ltd | 無電解銅めっき用触媒付与方法 |
| US8172627B2 (en) * | 2008-12-03 | 2012-05-08 | Tyco Electronics Corporation | Electrical connector with plated plug and receptacle |
| JP5570285B2 (ja) * | 2010-04-19 | 2014-08-13 | 株式会社日本表面処理研究所 | 無電解めっき法で用いる触媒水溶液、その触媒水溶液の調製方法及びその触媒水溶液を用いた無電解めっき法並びにその無電解めっき法を用いて形成した金属皮膜を備える金属層付被めっき物 |
| CN105164311A (zh) * | 2012-02-02 | 2015-12-16 | 新纳米有限公司 | 材料上的薄涂层 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3011920A (en) * | 1959-06-08 | 1961-12-05 | Shipley Co | Method of electroless deposition on a substrate and catalyst solution therefor |
| US3347724A (en) * | 1964-08-19 | 1967-10-17 | Photocircuits Corp | Metallizing flexible substrata |
| AT310285B (de) * | 1966-02-22 | 1973-09-25 | Photocircuits Corp | Verfahren zur Herstellung eines Schichtkörpers für gedruckte Schaltungen |
| US3425946A (en) * | 1966-08-26 | 1969-02-04 | William M Emons Jr | Electroless plating composition |
| US3524754A (en) * | 1967-04-28 | 1970-08-18 | Shell Oil Co | Metal plating of plastics |
| US3672938A (en) * | 1969-02-20 | 1972-06-27 | Kollmorgen Corp | Novel precious metal sensitizing solutions |
| US3682671A (en) * | 1970-02-05 | 1972-08-08 | Kollmorgen Corp | Novel precious metal sensitizing solutions |
| US3672923A (en) * | 1970-06-29 | 1972-06-27 | Kollmorgen Corp | Solid precious metal sensitizing compositions |
| US3772056A (en) * | 1971-07-29 | 1973-11-13 | Kollmorgen Photocircuits | Sensitized substrates for chemical metallization |
| US3772078A (en) * | 1971-07-29 | 1973-11-13 | Kollmorgen Photocircuits | Process for the formation of real images and products produced thereby |
| CA1000453A (en) * | 1972-07-11 | 1976-11-30 | Francis J. Nuzzi | Process and composition for sensitizing articles for metallization |
| CA1058457A (en) * | 1973-10-18 | 1979-07-17 | Francis J. Nuzzi | Process for sensitizing surface of nonmetallic article for electroless deposition |
| JPS50113423A (enrdf_load_stackoverflow) * | 1973-12-07 | 1975-09-05 | Surface Technology Corp | |
| US3993491A (en) * | 1973-12-07 | 1976-11-23 | Surface Technology, Inc. | Electroless plating |
| ZA75565B (en) * | 1974-10-31 | 1976-01-28 | Kollmorgen Corp | Process for sensitizing articles for metallization and resulting articles |
-
1977
- 1977-02-15 ZA ZA770897A patent/ZA77897B/xx unknown
- 1977-02-18 US US05/770,063 patent/US4160050A/en not_active Expired - Lifetime
- 1977-03-29 CA CA275,033A patent/CA1093540A/en not_active Expired
- 1977-03-30 AU AU23783/77A patent/AU505928B2/en not_active Expired
- 1977-03-30 IL IL51786A patent/IL51786A/xx unknown
- 1977-04-07 GB GB14750/77A patent/GB1523426A/en not_active Expired
- 1977-04-12 DK DK161777A patent/DK147377C/da not_active IP Right Cessation
- 1977-04-12 SE SE7704185A patent/SE7704185L/ unknown
- 1977-04-12 AT AT253977A patent/AT351334B/de not_active IP Right Cessation
- 1977-04-13 NL NL7704031A patent/NL7704031A/xx not_active Application Discontinuation
- 1977-04-13 FR FR7711045A patent/FR2348279A1/fr active Granted
- 1977-04-13 DE DE2716729A patent/DE2716729C3/de not_active Expired
- 1977-04-13 IT IT48937/77A patent/IT1115853B/it active
- 1977-04-13 JP JP4311077A patent/JPS52134825A/ja active Granted
- 1977-04-13 CH CH458677A patent/CH629853A5/de not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| FR2348279A1 (fr) | 1977-11-10 |
| JPS5710950B2 (enrdf_load_stackoverflow) | 1982-03-01 |
| FR2348279B1 (enrdf_load_stackoverflow) | 1978-11-03 |
| DK147377B (da) | 1984-07-09 |
| IL51786A0 (en) | 1977-05-31 |
| IL51786A (en) | 1981-10-30 |
| CA1093540A (en) | 1981-01-13 |
| NL7704031A (nl) | 1977-10-17 |
| DK147377C (da) | 1985-01-28 |
| JPS52134825A (en) | 1977-11-11 |
| DE2716729B2 (de) | 1979-03-08 |
| AU2378377A (en) | 1978-10-05 |
| DK161777A (da) | 1977-10-14 |
| ZA77897B (en) | 1977-12-28 |
| ATA253977A (de) | 1978-12-15 |
| AU505928B2 (en) | 1979-12-06 |
| AT351334B (de) | 1979-07-25 |
| CH629853A5 (de) | 1982-05-14 |
| GB1523426A (en) | 1978-08-31 |
| US4160050A (en) | 1979-07-03 |
| IT1115853B (it) | 1986-02-10 |
| DE2716729A1 (de) | 1977-10-20 |
| SE7704185L (sv) | 1977-10-14 |
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