DE69426732T2 - Sich selbstbeschleunigendes und sich selbst auffrischendes Verfahren zur Tauchbeschichtung ohne Formaldehyd - Google Patents

Sich selbstbeschleunigendes und sich selbst auffrischendes Verfahren zur Tauchbeschichtung ohne Formaldehyd

Info

Publication number
DE69426732T2
DE69426732T2 DE69426732T DE69426732T DE69426732T2 DE 69426732 T2 DE69426732 T2 DE 69426732T2 DE 69426732 T DE69426732 T DE 69426732T DE 69426732 T DE69426732 T DE 69426732T DE 69426732 T2 DE69426732 T2 DE 69426732T2
Authority
DE
Germany
Prior art keywords
metal
self
compsn
accelerating
formaldehyde
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69426732T
Other languages
English (en)
Other versions
DE69426732D1 (de
DE69426732T3 (de
Inventor
Nayan Harsukhrai Joshi
John Edward Mccaskie
Michael Thomas Boyle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech USA LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26711015&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69426732(T2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Atotech USA LLC filed Critical Atotech USA LLC
Publication of DE69426732D1 publication Critical patent/DE69426732D1/de
Publication of DE69426732T2 publication Critical patent/DE69426732T2/de
Application granted granted Critical
Publication of DE69426732T3 publication Critical patent/DE69426732T3/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/50Electroplating: Baths therefor from solutions of platinum group metals
    • C25D3/52Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/423Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03Metal processing
    • H05K2203/0392Pretreatment of metal, e.g. before finish plating, etching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
DE69426732T 1993-03-18 1994-03-15 Sich selbstbeschleunigendes und sich selbst auffrischendes Verfahren zur Tauchbeschichtung ohne Formaldehyd Expired - Lifetime DE69426732T3 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US3448593A 1993-03-18 1993-03-18
US34485 1993-03-18
US12145593A 1993-09-16 1993-09-16
US121455 1993-09-16

Publications (3)

Publication Number Publication Date
DE69426732D1 DE69426732D1 (de) 2001-04-05
DE69426732T2 true DE69426732T2 (de) 2001-06-13
DE69426732T3 DE69426732T3 (de) 2010-11-25

Family

ID=26711015

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69434619T Expired - Lifetime DE69434619T2 (de) 1993-03-18 1994-03-15 Sich selbstbeschleunigendes und sich selbst auffrischendes Verfahren zur Tauchbeschichtung ohne Formaldehyd, sowie die entsprechende Zusammensetzung
DE69426732T Expired - Lifetime DE69426732T3 (de) 1993-03-18 1994-03-15 Sich selbstbeschleunigendes und sich selbst auffrischendes Verfahren zur Tauchbeschichtung ohne Formaldehyd

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69434619T Expired - Lifetime DE69434619T2 (de) 1993-03-18 1994-03-15 Sich selbstbeschleunigendes und sich selbst auffrischendes Verfahren zur Tauchbeschichtung ohne Formaldehyd, sowie die entsprechende Zusammensetzung

Country Status (12)

Country Link
US (2) US5543182A (de)
EP (2) EP1054081B1 (de)
JP (1) JP3009326B2 (de)
KR (1) KR100226178B1 (de)
AT (2) ATE199413T1 (de)
CA (2) CA2119050C (de)
CZ (2) CZ287924B6 (de)
DE (2) DE69434619T2 (de)
DK (1) DK0616053T3 (de)
ES (2) ES2257987T3 (de)
GR (1) GR3035822T3 (de)
PT (1) PT616053E (de)

Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9425031D0 (en) * 1994-12-09 1995-02-08 Alpha Metals Ltd Printed circuit board manufacture
GB9425030D0 (en) 1994-12-09 1995-02-08 Alpha Metals Ltd Silver plating
DE19510855C2 (de) * 1995-03-17 1998-04-30 Atotech Deutschland Gmbh Verfahren zum selektiven oder partiellen elektrolytischen Metallisieren von Substraten aus nichtleitenden Materialien
US6905587B2 (en) 1996-03-22 2005-06-14 Ronald Redline Method for enhancing the solderability of a surface
US6544397B2 (en) 1996-03-22 2003-04-08 Ronald Redline Method for enhancing the solderability of a surface
DE69703798T2 (de) * 1997-02-03 2001-08-02 Okuno Chem Ind Co Verfahren zum elektrobeschichten nichtleitender materialien
DE69735999T2 (de) 1997-04-07 2007-05-03 Okuno Chemical Industries Co., Ltd. Verfahren zur elektrobeschichtung eines nichtleitenden geformten kunststoffgegenstands
US6121678A (en) * 1997-12-19 2000-09-19 Stmicroelectronics, Inc. Wrap-around interconnect for fine pitch ball grid array
US6555170B2 (en) 1998-01-30 2003-04-29 Duratech Industries, Inc. Pre-plate treating system
JP2000096252A (ja) * 1998-09-18 2000-04-04 C Uyemura & Co Ltd ハードディスク基板へのめっき方法
USRE45842E1 (en) 1999-02-17 2016-01-12 Ronald Redline Method for enhancing the solderability of a surface
DE19918833C2 (de) * 1999-04-22 2002-10-31 Atotech Deutschland Gmbh Verfahren zum elektrolytischen Abscheiden einer Metallschicht auf Oberflächen eines elektrisch nichtleitenden Substrats und Anwendung des Verfahrens
WO2001059185A2 (en) * 2000-02-08 2001-08-16 Duratech Industries, Inc. Pre-plate treating system
DE10054544A1 (de) 2000-11-01 2002-05-08 Atotech Deutschland Gmbh Verfahren zum chemischen Metallisieren von Oberflächen
KR20030026470A (ko) * 2001-09-25 2003-04-03 전정식 비전도성 물질의 금 도금을 위한 전처리 방법
US6645557B2 (en) 2001-10-17 2003-11-11 Atotech Deutschland Gmbh Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions
US20050006339A1 (en) 2003-07-11 2005-01-13 Peter Mardilovich Electroless deposition methods and systems
US7078816B2 (en) * 2004-03-31 2006-07-18 Endicott Interconnect Technologies, Inc. Circuitized substrate
US20060024481A1 (en) * 2004-07-29 2006-02-02 Eastman Kodak Company Jet printing of patterned metal
JP2006342428A (ja) * 2005-06-10 2006-12-21 Enthone Inc 非導電性の基板に直接金属被覆する方法
WO2007063732A1 (ja) 2005-11-30 2007-06-07 Techno Polymer Co., Ltd. ダイレクト鍍金用樹脂組成物、成形品及び鍍金成形品
JP2007239003A (ja) * 2006-03-07 2007-09-20 Univ Nagoya Auメッキ方法及びAuメッキによるAu回路の製造方法
PL1988192T3 (pl) * 2007-05-03 2013-04-30 Atotech Deutschland Gmbh Sposób nakładania powłoki metalicznej na nieprzewodzące podłoże
US8440916B2 (en) 2007-06-28 2013-05-14 Intel Corporation Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method
US8877565B2 (en) * 2007-06-28 2014-11-04 Intel Corporation Method of forming a multilayer substrate core structure using sequential microvia laser drilling and substrate core structure formed according to the method
EP2244285A1 (de) 2009-04-24 2010-10-27 ATOTECH Deutschland GmbH Verfahren zur Formung von Lötablagerungen auf Substraten
EP2180770A1 (de) 2008-10-21 2010-04-28 Atotech Deutschland Gmbh Verfahren zur Formung von Lötablagerungen auf Substraten
JP5371393B2 (ja) 2008-11-27 2013-12-18 ユーエムジー・エービーエス株式会社 めっき用樹脂組成物、及び樹脂めっき製品
CN102264537B (zh) * 2008-12-26 2014-07-16 富士胶片株式会社 表面金属膜材料、表面金属膜材料的制作方法、金属图案材料的制作方法及金属图案材料
EP2305856A1 (de) * 2009-09-28 2011-04-06 ATOTECH Deutschland GmbH Verfahren zum Aufbringen einer Metallbeschichtung auf ein nichtleitfähiges Substrat
PT2360294E (pt) 2010-02-12 2013-06-28 Atotech Deutschland Gmbh Processo para a metalização de objectos apresentando no mínimo duas matérias plásticas diferentes à superfície
US8497359B2 (en) * 2010-02-26 2013-07-30 Ppg Industries Ohio, Inc. Cationic electrodepositable coating composition comprising lignin
DE102010012204B4 (de) 2010-03-19 2019-01-24 MacDermid Enthone Inc. (n.d.Ges.d. Staates Delaware) Verbessertes Verfahren zur Direktmetallisierung von nicht leitenden Substraten
EP2405468A1 (de) 2010-07-05 2012-01-11 ATOTECH Deutschland GmbH Verfahren zur Formung von Lötablagerungen auf Substraten
EP2405469B1 (de) 2010-07-05 2016-09-21 ATOTECH Deutschland GmbH Verfahren zur Formung von Lötlegierungsablagerungen auf Substraten
EP2416634A1 (de) 2010-08-02 2012-02-08 ATOTECH Deutschland GmbH Verfahren zur Formung von Lötablagerungen auf Substraten
WO2012016932A1 (en) 2010-08-02 2012-02-09 Atotech Deutschland Gmbh Method to form solder deposits and non-melting bump structures on substrates
EP2506690A1 (de) 2011-03-28 2012-10-03 Atotech Deutschland GmbH Verfahren zum Bilden von Lotdepots und nichtschmelzenden Höckerstrukturen auf Substraten
WO2012019982A1 (en) 2010-08-09 2012-02-16 Basf Se Thermoplastic moulding compositions with improved adhesion of electroplated metal layer
KR101842312B1 (ko) 2010-12-16 2018-03-26 이네오스 스티롤루션 유럽 게엠베하 반복된 충격에 대한 개선된 내성을 갖는 금속 도금 물품을 위한 열가소성 성형 조성물
EP2602357A1 (de) 2011-12-05 2013-06-12 Atotech Deutschland GmbH Neuartiges Haftmittel zur Metallisierung von Substratoberflächen
CA2860596C (en) 2012-02-01 2020-08-18 Atotech Deutschland Gmbh Electroless nickel plating bath
EP2639334A1 (de) 2012-03-15 2013-09-18 Atotech Deutschland GmbH Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen
EP2644744A1 (de) 2012-03-29 2013-10-02 Atotech Deutschland GmbH Verfahren zur Förderung der Haftung zwischen dielektrischen Substraten und Metallschichten
ES2573137T3 (es) 2012-09-14 2016-06-06 Atotech Deutschland Gmbh Método de metalización de sustratos de célula solar
JP6035540B2 (ja) 2012-12-21 2016-11-30 奥野製薬工業株式会社 導電性皮膜形成浴
WO2015043975A1 (en) * 2013-09-25 2015-04-02 Atotech Deutschland Gmbh Method for depositing a copper seed layer onto a barrier layer and copper plating bath
US10487404B2 (en) 2013-09-26 2019-11-26 Atotech Deutschland Gmbh Adhesion promoting process for metallisation of substrate surfaces
WO2015111291A1 (ja) 2014-01-27 2015-07-30 奥野製薬工業株式会社 導電性皮膜形成浴
US10174250B2 (en) 2014-04-01 2019-01-08 Atotech Deutschland Gmbh Composition and process for metallizing nonconductive plastic surfaces
CN104668232A (zh) * 2015-03-05 2015-06-03 苏州市凯业金属制品有限公司 一种塑胶制品表面处理方法
CN105112966A (zh) * 2015-09-22 2015-12-02 太仓市金鹿电镀有限公司 一种高耐磨洗衣机门圈表面环保塑料电镀工艺
JP7143303B2 (ja) 2016-12-23 2022-09-28 アトテック ドイチュラント ゲー・エム・ベー・ハー ウント コー. カー・ゲー コンタクトパッド上へのはんだ付け可能なはんだ堆積物の形成方法
WO2020223106A1 (en) 2019-05-01 2020-11-05 Fujifilm Electronic Materials U.S.A., Inc. Etching compositions
US11268025B2 (en) 2019-06-13 2022-03-08 Fujifilm Electronic Materials U.S.A., Inc. Etching compositions
CN111018273A (zh) * 2020-01-16 2020-04-17 泉州南京大学环保产业研究院 一种电催化-生物联合处理甲醛废水的方法

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2702253A (en) 1950-11-01 1955-02-15 Gasaccumulator Svenska Ab Surface metallizing method
US3011920A (en) 1959-06-08 1961-12-05 Shipley Co Method of electroless deposition on a substrate and catalyst solution therefor
US3099608A (en) 1959-12-30 1963-07-30 Ibm Method of electroplating on a dielectric base
US3340164A (en) * 1963-12-26 1967-09-05 Sperry Rand Corp Method of copper plating anodized aluminum
USRE29015E (en) * 1968-04-09 1976-10-26 Western Electric Company, Inc. Method of generating precious metal-reducing patterns
US3748109A (en) 1968-05-06 1973-07-24 Hooker Chemical Corp Conductive designs and process for their manufacture
US3817774A (en) * 1969-08-14 1974-06-18 Macdermid Inc Preparation of plastic substrates for electroless plating
US3682671A (en) 1970-02-05 1972-08-08 Kollmorgen Corp Novel precious metal sensitizing solutions
US3682786A (en) * 1970-02-18 1972-08-08 Macdermid Inc Method of treating plastic substrates and process for plating thereon
US3874882A (en) * 1972-02-09 1975-04-01 Shipley Co Catalyst solution for electroless deposition of metal on substrate
US3904792A (en) * 1972-02-09 1975-09-09 Shipley Co Catalyst solution for electroless metal deposition on a substrate
US3793038A (en) * 1973-01-02 1974-02-19 Crown City Plating Co Process for electroless plating
US4035227A (en) * 1973-09-21 1977-07-12 Oxy Metal Industries Corporation Method for treating plastic substrates prior to plating
US3984290A (en) 1973-10-01 1976-10-05 Georgy Avenirovich Kitaev Method of forming intralayer junctions in a multilayer structure
AT331943B (de) 1973-11-05 1976-08-25 Erz & Stahl Ges M B H Losungsmittel fur lacke
US3962497A (en) * 1975-03-11 1976-06-08 Oxy Metal Industries Corporation Method for treating polymeric substrates prior to plating
US4279948A (en) * 1978-05-25 1981-07-21 Macdermid Incorporated Electroless copper deposition solution using a hypophosphite reducing agent
US4229218A (en) * 1979-02-05 1980-10-21 Shipley Company Inc. Self-monitoring electroless plating solution
US4311551A (en) * 1979-04-12 1982-01-19 Philip A. Hunt Chemical Corp. Composition and method for etching copper substrates
DE3149919A1 (de) * 1981-12-11 1983-06-23 Schering Ag, 1000 Berlin Und 4619 Bergkamen Verfahren zum haftfesten metallisieren von polyimid
US4863758A (en) * 1982-05-26 1989-09-05 Macdermid, Incorporated Catalyst solutions for activating non-conductive substrates and electroless plating process
US4683036A (en) 1983-06-10 1987-07-28 Kollmorgen Technologies Corporation Method for electroplating non-metallic surfaces
US4525390A (en) * 1984-03-09 1985-06-25 International Business Machines Corporation Deposition of copper from electroless plating compositions
US4725314A (en) * 1984-05-07 1988-02-16 Shipley Company Inc. Catalytic metal of reduced particle size
US4617205A (en) * 1984-12-21 1986-10-14 Omi International Corporation Formaldehyde-free autocatalytic electroless copper plating
US4639380A (en) * 1985-05-06 1987-01-27 International Business Machines Corporation Process for preparing a substrate for subsequent electroless deposition of a metal
US5202151A (en) * 1985-10-14 1993-04-13 Hitachi, Ltd. Electroless gold plating solution, method of plating with gold by using the same, and electronic device plated with gold by using the same
US4891069A (en) 1986-06-06 1990-01-02 Techno Instruments Investments 1983 Ltd. Composition for the electrolytic coating of circuit boards without an electroless metal coating
ATE66498T1 (de) * 1986-08-06 1991-09-15 Macdermid Inc Verfahren zur herstellung von gedruckten schaltungsbrettern.
US4751106A (en) * 1986-09-25 1988-06-14 Shipley Company Inc. Metal plating process
US4814009A (en) * 1986-11-14 1989-03-21 Nippondenso Co., Ltd. Electroless copper plating solution
US4810333A (en) 1987-12-14 1989-03-07 Shipley Company Inc. Electroplating process
US4895739A (en) 1988-02-08 1990-01-23 Shipley Company Inc. Pretreatment for electroplating process
US4818286A (en) * 1988-03-08 1989-04-04 International Business Machines Corporation Electroless copper plating bath
US4919768A (en) 1989-09-22 1990-04-24 Shipley Company Inc. Electroplating process
US5071517A (en) 1989-11-21 1991-12-10 Solution Technology Systems Method for directly electroplating a dielectric substrate and plated substrate so produced
US5015339A (en) * 1990-03-26 1991-05-14 Olin Hunt Sub Iii Corp. Process for preparing nonconductive substrates
US5213841A (en) * 1990-05-15 1993-05-25 Shipley Company Inc. Metal accelerator
ATE179761T1 (de) * 1991-06-20 1999-05-15 Harnden Eric F Basische beschleunigerlösung zur direkten elektrobeschichtung
JPH0544075A (ja) * 1991-08-15 1993-02-23 Nippon Riironaale Kk 無電解銅めつき代替銅ストライクめつき方法
US5376248A (en) * 1991-10-15 1994-12-27 Enthone-Omi, Inc. Direct metallization process

Also Published As

Publication number Publication date
CA2222158A1 (en) 1994-09-19
DE69434619D1 (de) 2006-04-13
CZ64194A3 (en) 1995-08-16
ES2155075T3 (es) 2001-05-01
EP1054081B1 (de) 2006-02-01
GR3035822T3 (en) 2001-07-31
EP0616053B9 (de) 2010-09-15
DE69426732D1 (de) 2001-04-05
ATE199413T1 (de) 2001-03-15
EP0616053B1 (de) 2001-02-28
KR940021765A (ko) 1994-10-19
CA2119050C (en) 1999-11-23
PT616053E (pt) 2001-07-31
JPH0711487A (ja) 1995-01-13
JP3009326B2 (ja) 2000-02-14
DE69434619T2 (de) 2006-08-17
CA2222158C (en) 2001-01-30
EP1054081A3 (de) 2001-12-05
CZ287924B6 (cs) 2001-03-14
EP1054081A2 (de) 2000-11-22
KR100226178B1 (ko) 1999-10-15
ATE317026T1 (de) 2006-02-15
EP0616053A1 (de) 1994-09-21
ES2257987T3 (es) 2006-08-16
DK0616053T3 (da) 2001-06-18
CZ290390B6 (cs) 2002-07-17
DE69426732T3 (de) 2010-11-25
EP0616053B3 (de) 2010-05-05
US5543182A (en) 1996-08-06
US5725640A (en) 1998-03-10
CA2119050A1 (en) 1994-09-19

Similar Documents

Publication Publication Date Title
DE69426732D1 (de) Sich selbstbeschleunigendes und sich selbst auffrischendes Verfahren zur Tauchbeschichtung ohne Formaldehyd
EP0288491B1 (de) Verfahren zur selektiven metallisierung, additive methode zur herstellung gedruckter träger von schaltkreisen und dabei verwendete materialmischung
GB2164063B (en) Selective electroless deposition on insulating substrates
EP0350161A3 (en) Method for rendering a substrate surface antithrombogenic
SE9500571L (sv) Förfarande för katalytisk förbehandling av ett underlag vid strömfri plätering
DK0633949T3 (de)
ES8200930A1 (es) Un procedimiento para obtener una capa adherente no electro-litica de metal sobre un sustrato vitreo o ceramico
FI95816C (fi) Antimikrobinen esine ja menetelmä sen valmistamiseksi
US4001470A (en) Process and bath for the metallization of synthetic-resin
DE59802372D1 (de) Verfahren und lösung zur herstellung von goldschichten
US20040253450A1 (en) Formaldehyde-free electroless copper plating process and solution for use in the process
ES2027496A6 (es) Metodo para precipitar una capa metalica no electrica lisa sobre un substrato de aluminio.
DE58909586D1 (de) Verfahren zur elektrophoretischen Tauchlackierung von chromatierbaren Metalloberflächen
JPH0218386B2 (de)
ES8504270A1 (es) Procedimiento para la disposicion de recubrimientos de fosfato sobre superficies metalicas
ES479913A1 (es) Procedimiento para revestir simultaneamente la superficie de una estructura compuesta de cojinete.
ES378720A1 (es) Perfeccionamientos en los procedimientos de recubrimiento quimico.
DE3780078D1 (de) Korrosionsbestaendige beschichtung.
US3582392A (en) Method for preparing non-metallic surface for metallizing
GB1507782A (en) Electrodeposition of gold
Gerhardt et al. EN for EMI/RFI Shielding: an Exciting Market Potential
JPS6473082A (en) Plating paint and plating method using said paint
Morgan et al. Viscous Electroless Plating Solutions
JPS57200425A (en) Metal film deposition on polyamide resin molding

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8310 Action for declaration of annulment
8327 Change in the person/name/address of the patent owner

Owner name: ATOTECH DEUTSCHLAND GMBH, 10553 BERLIN, DE

8313 Request for invalidation rejected/withdrawn