US3582392A - Method for preparing non-metallic surface for metallizing - Google Patents
Method for preparing non-metallic surface for metallizing Download PDFInfo
- Publication number
- US3582392A US3582392A US752132A US3582392DA US3582392A US 3582392 A US3582392 A US 3582392A US 752132 A US752132 A US 752132A US 3582392D A US3582392D A US 3582392DA US 3582392 A US3582392 A US 3582392A
- Authority
- US
- United States
- Prior art keywords
- solution
- sensitizing
- metallizing
- metallic surface
- aqueous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title abstract description 9
- 239000000243 solution Substances 0.000 abstract description 18
- RGHNJXZEOKUKBD-SQOUGZDYSA-N Gluconic acid Natural products OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 abstract description 8
- 230000001235 sensitizing effect Effects 0.000 abstract description 6
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 abstract description 5
- 239000000174 gluconic acid Substances 0.000 abstract description 5
- 235000012208 gluconic acid Nutrition 0.000 abstract description 5
- 238000005507 spraying Methods 0.000 abstract description 5
- 239000007864 aqueous solution Substances 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 abstract description 3
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
- 239000002738 chelating agent Substances 0.000 description 2
- 238000005234 chemical deposition Methods 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 150000001879 copper Chemical class 0.000 description 2
- 229960001484 edetic acid Drugs 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910001961 silver nitrate Inorganic materials 0.000 description 2
- AEQDJSLRWYMAQI-UHFFFAOYSA-N 2,3,9,10-tetramethoxy-6,8,13,13a-tetrahydro-5H-isoquinolino[2,1-b]isoquinoline Chemical compound C1CN2CC(C(=C(OC)C=C3)OC)=C3CC2C2=C1C=C(OC)C(OC)=C2 AEQDJSLRWYMAQI-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 1
- TVQLLNFANZSCGY-UHFFFAOYSA-N disodium;dioxido(oxo)tin Chemical compound [Na+].[Na+].[O-][Sn]([O-])=O TVQLLNFANZSCGY-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- ZGCHATBSUIJLRL-UHFFFAOYSA-N hydrazine sulfate Chemical compound NN.OS(O)(=O)=O ZGCHATBSUIJLRL-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 150000002940 palladium Chemical class 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000176 sodium gluconate Substances 0.000 description 1
- 229940005574 sodium gluconate Drugs 0.000 description 1
- 235000012207 sodium gluconate Nutrition 0.000 description 1
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 1
- 229940079864 sodium stannate Drugs 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229940071182 stannate Drugs 0.000 description 1
- 125000005402 stannate group Chemical group 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
Definitions
- This invention relates to the chemical deposition of metallic films on non-metallic surfaces, as, for example, copper on plastic. Such films are used as such, or are built up in thickness electrolytically or are plated with other metals, depending upon the particular end use. Such chemically deposited metallic films are used in the production of printed circuits, decorative and ornamental devices, and in formation of printing elements such as electrotypes.
- One object of this present invention is to provide a means for accomplishing sensitizing and super-sensitizing in one single step.
- This invention comprises generally achieving a single step method for accomplishing sensitizing and supersensitizing of a non-metallic surface so as to adherently receive a metal film from a metallizing solution, by simultaneously spraying the surface with both an aqueous alkaline solution of stannic acid and an aqueous solution of silver salt and gluconic acid, followed by rinsing.
- a first solution is prepared by dissolving six grams of sodium stannate in one liter of water and a second solution formed by dissolving four grams of silver nitrate and 48 grams of a 50% solution of gluconic acid in one liter of water. Each of these solutions is then placed in separate reservoirs of a Binks double-nozzle spray gun. The two solutions are sprayed simultaneously onto a vinyl plastic sheet for about five to fifteen seconds. The surface so treated is then rinsed with water at room temperature. Within about 30 seconds after spraying a brownish deposit forms on the surface.
- a coppering solution is then sprayed onto the treated surface.
- a typical coppering solution comprises copper salt, chelating agent, reducing agent and alkali in water.
- Suitable copper salts include copper sulphate and copper acetate.
- Suitable chelating agents include ethylenediamine tetra acetic acid (EDTA) and salts thereof, sodium gluconate and Rochelle salt.
- Suitable reducing agents include formaldehyde and hydrazine sulphate. Specific examples of such coppering solutions are illustrated in US. Pat. 3,093,509, as for Examples IX, XIII, XIV and XV.
- a method for treating a non-metallic surface so as to render it receptive to an electroless coppering solution comprising the step of simultaneously spraying said surface with both an aqueous, alkaline stannate solution and an aqueous solution of gluconic acid and silver nitrate.
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
A SINGLE-STEP PROCESS IS DESCRIBED TO REPLACE THE CONVENTIONAL CONSECUTIVE STEPS OF SENSITIZING AND SUPER-SENSITIZING A NON-METALLIC SURFACE PRIOR TO APPLICATION OF A METALLIZING SOLUTION SUCH AS ALKALINE CHELATED COPPER. THE NEW PROCESS COMPRISES SIMULTANEOUS SPRAYING OF AQUEOUS ALKALINE TIN SOLUTION AND AN AQUEOUS SOLUTION OF GLUCONIC ACID AND SILVER SALT.
Description
United States Patent 3,582,392 METHOD FOR PREPARING NON-METALLIC SURFACE FOR METALLIZING Samuel Wein, deceased, late of Quincy, Mass; by Donald W. Berman, executor, 56 Plain St., South Braintree, Mass. 02185 No Drawing. Filed Aug. 13, 1968, Ser. No. 752,132 Int. Cl. B44d 1/092; C23c 3/02 US. Cl. 117-47 1 Claim ABSTRACT OF THE DISCLOSURE A single-step process is described to replace the conventional consecutive steps of sensitizing and super-sensitizing a non-metallic surface prior to application of a metallizing solution such as alkaline chelated copper. The new process comprises simultaneous spraying of aqueous alkaline tin solution and an aqueous solution of gluconic acid and silver salt.
BACKGROUND OF INVENTION This invention relates to the chemical deposition of metallic films on non-metallic surfaces, as, for example, copper on plastic. Such films are used as such, or are built up in thickness electrolytically or are plated with other metals, depending upon the particular end use. Such chemically deposited metallic films are used in the production of printed circuits, decorative and ornamental devices, and in formation of printing elements such as electrotypes.
The prior art in chemical deposition of metallic films is exemplified by US. Pats. 2,190,121 and 3,093,509. As taught by this prior art, the non-metallic surface must be first treated with a sensitizing agent usually containing a tin salt and then treated with a super-sensitizing agent containing gold, silver, platinum or palladium salts in solution. Only after these two steps is the surface ready to adherently receive the metallizing solution such as the coppering solution.
However, the necessity for the two consecutive separate steps of sensitizing and super-sensitizing is time-consuming and, hence, raises the cost of the process. Accordingly, attempts have been made in the past to either avoid one or more of these two steps or substitute a single step. To my knowledge, none of these attempts has been satisfactory.
One object of this present invention is to provide a means for accomplishing sensitizing and super-sensitizing in one single step.
Patented June 1, 1971 Other objects and advantages of this invention will be apparent from the description and claims which follow.
SUMMARY OF INVENTION This invention comprises generally achieving a single step method for accomplishing sensitizing and supersensitizing of a non-metallic surface so as to adherently receive a metal film from a metallizing solution, by simultaneously spraying the surface with both an aqueous alkaline solution of stannic acid and an aqueous solution of silver salt and gluconic acid, followed by rinsing.
SPECIFIC EXAMPLE OF INVENTION A first solution is prepared by dissolving six grams of sodium stannate in one liter of water and a second solution formed by dissolving four grams of silver nitrate and 48 grams of a 50% solution of gluconic acid in one liter of water. Each of these solutions is then placed in separate reservoirs of a Binks double-nozzle spray gun. The two solutions are sprayed simultaneously onto a vinyl plastic sheet for about five to fifteen seconds. The surface so treated is then rinsed with water at room temperature. Within about 30 seconds after spraying a brownish deposit forms on the surface.
A coppering solution is then sprayed onto the treated surface. A typical coppering solution comprises copper salt, chelating agent, reducing agent and alkali in water. Suitable copper salts include copper sulphate and copper acetate. Suitable chelating agents include ethylenediamine tetra acetic acid (EDTA) and salts thereof, sodium gluconate and Rochelle salt. Suitable reducing agents include formaldehyde and hydrazine sulphate. Specific examples of such coppering solutions are illustrated in US. Pat. 3,093,509, as for Examples IX, XIII, XIV and XV.
I claim:
1. A method for treating a non-metallic surface so as to render it receptive to an electroless coppering solution, comprising the step of simultaneously spraying said surface with both an aqueous, alkaline stannate solution and an aqueous solution of gluconic acid and silver nitrate.
ALFRED L. LEAVITT, Primary Examiner I. A. BELL, Assistant Examiner US. Cl. X.R. "5 117-1055, 106-1; 20430; 11 7-71
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US75213268A | 1968-08-13 | 1968-08-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3582392A true US3582392A (en) | 1971-06-01 |
Family
ID=25025014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US752132A Expired - Lifetime US3582392A (en) | 1968-08-13 | 1968-08-13 | Method for preparing non-metallic surface for metallizing |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US3582392A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2248693A1 (en) * | 1972-07-13 | 1974-01-24 | London Laboratories | PROCESS FOR ELECTRONIC DEPOSITION OF METALLIC SILVER |
-
1968
- 1968-08-13 US US752132A patent/US3582392A/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2248693A1 (en) * | 1972-07-13 | 1974-01-24 | London Laboratories | PROCESS FOR ELECTRONIC DEPOSITION OF METALLIC SILVER |
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