US3582392A - Method for preparing non-metallic surface for metallizing - Google Patents
Method for preparing non-metallic surface for metallizing Download PDFInfo
- Publication number
- US3582392A US3582392A US752132A US3582392DA US3582392A US 3582392 A US3582392 A US 3582392A US 752132 A US752132 A US 752132A US 3582392D A US3582392D A US 3582392DA US 3582392 A US3582392 A US 3582392A
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- US
- United States
- Prior art keywords
- solution
- sensitizing
- metallizing
- metallic surface
- aqueous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
Definitions
- This invention relates to the chemical deposition of metallic films on non-metallic surfaces, as, for example, copper on plastic. Such films are used as such, or are built up in thickness electrolytically or are plated with other metals, depending upon the particular end use. Such chemically deposited metallic films are used in the production of printed circuits, decorative and ornamental devices, and in formation of printing elements such as electrotypes.
- One object of this present invention is to provide a means for accomplishing sensitizing and super-sensitizing in one single step.
- This invention comprises generally achieving a single step method for accomplishing sensitizing and supersensitizing of a non-metallic surface so as to adherently receive a metal film from a metallizing solution, by simultaneously spraying the surface with both an aqueous alkaline solution of stannic acid and an aqueous solution of silver salt and gluconic acid, followed by rinsing.
- a first solution is prepared by dissolving six grams of sodium stannate in one liter of water and a second solution formed by dissolving four grams of silver nitrate and 48 grams of a 50% solution of gluconic acid in one liter of water. Each of these solutions is then placed in separate reservoirs of a Binks double-nozzle spray gun. The two solutions are sprayed simultaneously onto a vinyl plastic sheet for about five to fifteen seconds. The surface so treated is then rinsed with water at room temperature. Within about 30 seconds after spraying a brownish deposit forms on the surface.
- a coppering solution is then sprayed onto the treated surface.
- a typical coppering solution comprises copper salt, chelating agent, reducing agent and alkali in water.
- Suitable copper salts include copper sulphate and copper acetate.
- Suitable chelating agents include ethylenediamine tetra acetic acid (EDTA) and salts thereof, sodium gluconate and Rochelle salt.
- Suitable reducing agents include formaldehyde and hydrazine sulphate. Specific examples of such coppering solutions are illustrated in US. Pat. 3,093,509, as for Examples IX, XIII, XIV and XV.
- a method for treating a non-metallic surface so as to render it receptive to an electroless coppering solution comprising the step of simultaneously spraying said surface with both an aqueous, alkaline stannate solution and an aqueous solution of gluconic acid and silver nitrate.
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- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
A SINGLE-STEP PROCESS IS DESCRIBED TO REPLACE THE CONVENTIONAL CONSECUTIVE STEPS OF SENSITIZING AND SUPER-SENSITIZING A NON-METALLIC SURFACE PRIOR TO APPLICATION OF A METALLIZING SOLUTION SUCH AS ALKALINE CHELATED COPPER. THE NEW PROCESS COMPRISES SIMULTANEOUS SPRAYING OF AQUEOUS ALKALINE TIN SOLUTION AND AN AQUEOUS SOLUTION OF GLUCONIC ACID AND SILVER SALT.
Description
United States Patent 3,582,392 METHOD FOR PREPARING NON-METALLIC SURFACE FOR METALLIZING Samuel Wein, deceased, late of Quincy, Mass; by Donald W. Berman, executor, 56 Plain St., South Braintree, Mass. 02185 No Drawing. Filed Aug. 13, 1968, Ser. No. 752,132 Int. Cl. B44d 1/092; C23c 3/02 US. Cl. 117-47 1 Claim ABSTRACT OF THE DISCLOSURE A single-step process is described to replace the conventional consecutive steps of sensitizing and super-sensitizing a non-metallic surface prior to application of a metallizing solution such as alkaline chelated copper. The new process comprises simultaneous spraying of aqueous alkaline tin solution and an aqueous solution of gluconic acid and silver salt.
BACKGROUND OF INVENTION This invention relates to the chemical deposition of metallic films on non-metallic surfaces, as, for example, copper on plastic. Such films are used as such, or are built up in thickness electrolytically or are plated with other metals, depending upon the particular end use. Such chemically deposited metallic films are used in the production of printed circuits, decorative and ornamental devices, and in formation of printing elements such as electrotypes.
The prior art in chemical deposition of metallic films is exemplified by US. Pats. 2,190,121 and 3,093,509. As taught by this prior art, the non-metallic surface must be first treated with a sensitizing agent usually containing a tin salt and then treated with a super-sensitizing agent containing gold, silver, platinum or palladium salts in solution. Only after these two steps is the surface ready to adherently receive the metallizing solution such as the coppering solution.
However, the necessity for the two consecutive separate steps of sensitizing and super-sensitizing is time-consuming and, hence, raises the cost of the process. Accordingly, attempts have been made in the past to either avoid one or more of these two steps or substitute a single step. To my knowledge, none of these attempts has been satisfactory.
One object of this present invention is to provide a means for accomplishing sensitizing and super-sensitizing in one single step.
Patented June 1, 1971 Other objects and advantages of this invention will be apparent from the description and claims which follow.
SUMMARY OF INVENTION This invention comprises generally achieving a single step method for accomplishing sensitizing and supersensitizing of a non-metallic surface so as to adherently receive a metal film from a metallizing solution, by simultaneously spraying the surface with both an aqueous alkaline solution of stannic acid and an aqueous solution of silver salt and gluconic acid, followed by rinsing.
SPECIFIC EXAMPLE OF INVENTION A first solution is prepared by dissolving six grams of sodium stannate in one liter of water and a second solution formed by dissolving four grams of silver nitrate and 48 grams of a 50% solution of gluconic acid in one liter of water. Each of these solutions is then placed in separate reservoirs of a Binks double-nozzle spray gun. The two solutions are sprayed simultaneously onto a vinyl plastic sheet for about five to fifteen seconds. The surface so treated is then rinsed with water at room temperature. Within about 30 seconds after spraying a brownish deposit forms on the surface.
A coppering solution is then sprayed onto the treated surface. A typical coppering solution comprises copper salt, chelating agent, reducing agent and alkali in water. Suitable copper salts include copper sulphate and copper acetate. Suitable chelating agents include ethylenediamine tetra acetic acid (EDTA) and salts thereof, sodium gluconate and Rochelle salt. Suitable reducing agents include formaldehyde and hydrazine sulphate. Specific examples of such coppering solutions are illustrated in US. Pat. 3,093,509, as for Examples IX, XIII, XIV and XV.
I claim:
1. A method for treating a non-metallic surface so as to render it receptive to an electroless coppering solution, comprising the step of simultaneously spraying said surface with both an aqueous, alkaline stannate solution and an aqueous solution of gluconic acid and silver nitrate.
ALFRED L. LEAVITT, Primary Examiner I. A. BELL, Assistant Examiner US. Cl. X.R. "5 117-1055, 106-1; 20430; 11 7-71
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US75213268A | 1968-08-13 | 1968-08-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3582392A true US3582392A (en) | 1971-06-01 |
Family
ID=25025014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US752132A Expired - Lifetime US3582392A (en) | 1968-08-13 | 1968-08-13 | Method for preparing non-metallic surface for metallizing |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US3582392A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2248693A1 (en) * | 1972-07-13 | 1974-01-24 | London Laboratories | PROCESS FOR ELECTRONIC DEPOSITION OF METALLIC SILVER |
-
1968
- 1968-08-13 US US752132A patent/US3582392A/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2248693A1 (en) * | 1972-07-13 | 1974-01-24 | London Laboratories | PROCESS FOR ELECTRONIC DEPOSITION OF METALLIC SILVER |
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