DE2108850C2 - Verfahren zur Befestigung von Zuleitungen an Halbleiterplättchen - Google Patents

Verfahren zur Befestigung von Zuleitungen an Halbleiterplättchen

Info

Publication number
DE2108850C2
DE2108850C2 DE2108850A DE2108850A DE2108850C2 DE 2108850 C2 DE2108850 C2 DE 2108850C2 DE 2108850 A DE2108850 A DE 2108850A DE 2108850 A DE2108850 A DE 2108850A DE 2108850 C2 DE2108850 C2 DE 2108850C2
Authority
DE
Germany
Prior art keywords
plate
semiconductor
leads
semiconductor wafers
alignment plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2108850A
Other languages
German (de)
English (en)
Other versions
DE2108850A1 (de
Inventor
Edwin Herbert Syracuse N.Y. Lederer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of DE2108850A1 publication Critical patent/DE2108850A1/de
Application granted granted Critical
Publication of DE2108850C2 publication Critical patent/DE2108850C2/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0444—Apparatus for wiring semiconductor or solid-state device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49799—Providing transitory integral holding or handling portion

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE2108850A 1970-02-26 1971-02-25 Verfahren zur Befestigung von Zuleitungen an Halbleiterplättchen Expired DE2108850C2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US1437670A 1970-02-26 1970-02-26

Publications (2)

Publication Number Publication Date
DE2108850A1 DE2108850A1 (de) 1971-09-09
DE2108850C2 true DE2108850C2 (de) 1983-11-24

Family

ID=21765106

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2108850A Expired DE2108850C2 (de) 1970-02-26 1971-02-25 Verfahren zur Befestigung von Zuleitungen an Halbleiterplättchen

Country Status (9)

Country Link
US (1) US3706409A (enExample)
JP (1) JPS545262B1 (enExample)
BE (1) BE763365A (enExample)
DE (1) DE2108850C2 (enExample)
FR (1) FR2080789B1 (enExample)
GB (1) GB1349183A (enExample)
IE (1) IE34943B1 (enExample)
NL (1) NL172606C (enExample)
SE (2) SE372138B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2431987C2 (de) * 1974-07-03 1983-09-01 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Verbinden eines mit höckerförmigen Anschlußelektroden versehenen Halbleiterbauelements mit einem Träger
DE2436600A1 (de) * 1974-07-30 1976-02-19 Semikron Gleichrichterbau Verfahren zur erzielung einer oberflaechenstabilisierenden schutzschicht bei halbleiterbauelementen
US4140265A (en) * 1975-06-26 1979-02-20 Kollmorgen Technologies Corporation Method and apparatus for positioning the end of a conductive filament at a predetermined and repeatable geometric location for coupling to a predetermined terminal area of an element
JPS608426Y2 (ja) * 1976-12-08 1985-03-25 シャープ株式会社 半導体ウエハ−の保持基板
US4624724A (en) * 1985-01-17 1986-11-25 General Electric Company Method of making integrated circuit silicon die composite having hot melt adhesive on its silicon base
DE3621796A1 (de) * 1986-06-30 1988-01-07 Siemens Ag Verfahren zur verbesserung der nebensprechdaempfung bei einer optisch-elektronischen sensoranordnung
KR930010072B1 (ko) * 1990-10-13 1993-10-14 금성일렉트론 주식회사 Ccd패키지 및 그 제조방법
SG52223A1 (en) * 1992-01-08 1998-09-28 Murata Manufacturing Co Component supply method
DE4426809A1 (de) * 1994-07-28 1996-02-08 Siemens Ag Verfahren zum Bestücken eines Trägers mit Chips, insbesondere zum Herstellen von Sensoren zur Luftmassenmessung
KR0141952B1 (ko) * 1994-12-19 1998-06-01 문정환 반도체 패키지 및 그 제조방법
JP3772954B2 (ja) * 1999-10-15 2006-05-10 株式会社村田製作所 チップ状部品の取扱方法
US7576656B2 (en) * 2005-09-15 2009-08-18 Alien Technology Corporation Apparatuses and methods for high speed bonding

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2762954A (en) * 1950-09-09 1956-09-11 Sylvania Electric Prod Method for assembling transistors
US3014447A (en) * 1956-06-08 1961-12-26 Sylvania Electric Prod Soldering machine and method
DE1163977B (de) * 1962-05-15 1964-02-27 Intermetall Sperrfreier Kontakt an einer Zone des Halbleiterkoerpers eines Halbleiterbauelementes
US3180551A (en) * 1963-03-27 1965-04-27 Kenneth L Richard Machine for soldering coils

Also Published As

Publication number Publication date
GB1349183A (en) 1974-03-27
NL172606B (nl) 1983-04-18
DE2108850A1 (de) 1971-09-09
NL7102435A (enExample) 1971-08-30
US3706409A (en) 1972-12-19
FR2080789A1 (enExample) 1971-11-19
BE763365A (fr) 1971-07-16
IE34943L (en) 1971-08-26
NL172606C (nl) 1983-09-16
SE389225B (sv) 1976-10-25
SE372138B (enExample) 1974-12-09
JPS545262B1 (enExample) 1979-03-15
IE34943B1 (en) 1975-10-01
FR2080789B1 (enExample) 1977-06-17

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Legal Events

Date Code Title Description
OD Request for examination
8120 Willingness to grant licences paragraph 23
D2 Grant after examination
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Free format text: SCHUELER, H., DIPL.-CHEM. DR.RER.NAT., PAT.-ANW., 6000 FRANKFURT

8339 Ceased/non-payment of the annual fee