JPS545262B1 - - Google Patents

Info

Publication number
JPS545262B1
JPS545262B1 JP990571A JP990571A JPS545262B1 JP S545262 B1 JPS545262 B1 JP S545262B1 JP 990571 A JP990571 A JP 990571A JP 990571 A JP990571 A JP 990571A JP S545262 B1 JPS545262 B1 JP S545262B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP990571A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS545262B1 publication Critical patent/JPS545262B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0444—Apparatus for wiring semiconductor or solid-state device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49799—Providing transitory integral holding or handling portion

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP990571A 1970-02-26 1971-02-26 Pending JPS545262B1 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US1437670A 1970-02-26 1970-02-26

Publications (1)

Publication Number Publication Date
JPS545262B1 true JPS545262B1 (enExample) 1979-03-15

Family

ID=21765106

Family Applications (1)

Application Number Title Priority Date Filing Date
JP990571A Pending JPS545262B1 (enExample) 1970-02-26 1971-02-26

Country Status (9)

Country Link
US (1) US3706409A (enExample)
JP (1) JPS545262B1 (enExample)
BE (1) BE763365A (enExample)
DE (1) DE2108850C2 (enExample)
FR (1) FR2080789B1 (enExample)
GB (1) GB1349183A (enExample)
IE (1) IE34943B1 (enExample)
NL (1) NL172606C (enExample)
SE (2) SE372138B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2431987C2 (de) * 1974-07-03 1983-09-01 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Verbinden eines mit höckerförmigen Anschlußelektroden versehenen Halbleiterbauelements mit einem Träger
DE2436600A1 (de) * 1974-07-30 1976-02-19 Semikron Gleichrichterbau Verfahren zur erzielung einer oberflaechenstabilisierenden schutzschicht bei halbleiterbauelementen
US4140265A (en) * 1975-06-26 1979-02-20 Kollmorgen Technologies Corporation Method and apparatus for positioning the end of a conductive filament at a predetermined and repeatable geometric location for coupling to a predetermined terminal area of an element
JPS608426Y2 (ja) * 1976-12-08 1985-03-25 シャープ株式会社 半導体ウエハ−の保持基板
US4624724A (en) * 1985-01-17 1986-11-25 General Electric Company Method of making integrated circuit silicon die composite having hot melt adhesive on its silicon base
DE3621796A1 (de) * 1986-06-30 1988-01-07 Siemens Ag Verfahren zur verbesserung der nebensprechdaempfung bei einer optisch-elektronischen sensoranordnung
KR930010072B1 (ko) * 1990-10-13 1993-10-14 금성일렉트론 주식회사 Ccd패키지 및 그 제조방법
SG52223A1 (en) * 1992-01-08 1998-09-28 Murata Manufacturing Co Component supply method
DE4426809A1 (de) * 1994-07-28 1996-02-08 Siemens Ag Verfahren zum Bestücken eines Trägers mit Chips, insbesondere zum Herstellen von Sensoren zur Luftmassenmessung
KR0141952B1 (ko) * 1994-12-19 1998-06-01 문정환 반도체 패키지 및 그 제조방법
JP3772954B2 (ja) * 1999-10-15 2006-05-10 株式会社村田製作所 チップ状部品の取扱方法
US7576656B2 (en) * 2005-09-15 2009-08-18 Alien Technology Corporation Apparatuses and methods for high speed bonding

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2762954A (en) * 1950-09-09 1956-09-11 Sylvania Electric Prod Method for assembling transistors
US3014447A (en) * 1956-06-08 1961-12-26 Sylvania Electric Prod Soldering machine and method
DE1163977B (de) * 1962-05-15 1964-02-27 Intermetall Sperrfreier Kontakt an einer Zone des Halbleiterkoerpers eines Halbleiterbauelementes
US3180551A (en) * 1963-03-27 1965-04-27 Kenneth L Richard Machine for soldering coils

Also Published As

Publication number Publication date
GB1349183A (en) 1974-03-27
NL172606B (nl) 1983-04-18
DE2108850A1 (de) 1971-09-09
NL7102435A (enExample) 1971-08-30
US3706409A (en) 1972-12-19
FR2080789A1 (enExample) 1971-11-19
BE763365A (fr) 1971-07-16
IE34943L (en) 1971-08-26
NL172606C (nl) 1983-09-16
SE389225B (sv) 1976-10-25
SE372138B (enExample) 1974-12-09
IE34943B1 (en) 1975-10-01
FR2080789B1 (enExample) 1977-06-17
DE2108850C2 (de) 1983-11-24

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