DE19581288T1 - Automatisches Testsystem und -verfahren für Halbleitervorrichtungen - Google Patents

Automatisches Testsystem und -verfahren für Halbleitervorrichtungen

Info

Publication number
DE19581288T1
DE19581288T1 DE19581288T DE19581288T DE19581288T1 DE 19581288 T1 DE19581288 T1 DE 19581288T1 DE 19581288 T DE19581288 T DE 19581288T DE 19581288 T DE19581288 T DE 19581288T DE 19581288 T1 DE19581288 T1 DE 19581288T1
Authority
DE
Germany
Prior art keywords
semiconductor devices
test system
automatic test
automatic
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19581288T
Other languages
English (en)
Inventor
Takeshi Onishi
Tadashi Kainuma
Katsumi Kojima
Kuniaki Bannai
Koichi Tanaka
Naruhito Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP6254361A external-priority patent/JPH0894707A/ja
Priority claimed from JP6268231A external-priority patent/JPH08105938A/ja
Priority claimed from JP33891494A external-priority patent/JP3492793B2/ja
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of DE19581288T1 publication Critical patent/DE19581288T1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
    • G01R31/68—Testing of releasable connections, e.g. of terminals mounted on a printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
DE19581288T 1994-09-22 1995-09-04 Automatisches Testsystem und -verfahren für Halbleitervorrichtungen Withdrawn DE19581288T1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP6254361A JPH0894707A (ja) 1994-09-22 1994-09-22 Ｉｃハンドラ装置
JP6268231A JPH08105938A (ja) 1994-10-06 1994-10-06 Ｉｃテストハンドラ
JP33891494A JP3492793B2 (ja) 1994-12-28 1994-12-28 Ｉｃテスタ用ハンドラにおける再検査方法
PCT/JP1995/001751 WO1996009556A1 (fr) 1994-09-22 1995-09-04 Procede et appareil d'inspection automatique de dispositifs semiconducteurs

Publications (1)

Publication Number Publication Date
DE19581288T1 true DE19581288T1 (de) 1996-11-14

Family

ID=27334325

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19581288T Withdrawn DE19581288T1 (de) 1994-09-22 1995-09-04 Automatisches Testsystem und -verfahren für Halbleitervorrichtungen

Country Status (5)

Country Link
US (1) US5788084A (de)
KR (1) KR100206644B1 (de)
DE (1) DE19581288T1 (de)
MY (1) MY111843A (de)
WO (1) WO1996009556A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19838491B4 (de) * 1998-01-15 2006-06-01 Samsung Electronics Co., Ltd., Suwon Verfahren zur Analyse der Meßstetigkeit von Testgeräten für Halbleiterbauteile

Families Citing this family (45)

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WO1997005496A1 (fr) 1995-07-28 1997-02-13 Advantest Corporation Testeur de dispositif a semiconducteur et systeme de test de dispositif a semiconducteur comportant plusieurs testeurs
KR100187727B1 (ko) * 1996-02-29 1999-06-01 윤종용 처리기 접촉 불량을 확인할 수 있는 접촉 점검 장치 및 이를 내장한 집적회로 소자 검사 시스템
JP3417528B2 (ja) * 1996-04-05 2003-06-16 株式会社アドバンテスト Ｉｃ試験装置
JPH10142293A (ja) * 1996-11-12 1998-05-29 Advantest Corp Ｉｃ試験装置
JP3503860B2 (ja) * 1997-03-18 2004-03-08 株式会社アドバンテスト Ｉｃ試験方法およびこの方法を実施する装置
US6593761B1 (en) * 1997-11-28 2003-07-15 Kabushiki Kaisha Toshiba Test handler for semiconductor device
US6043443A (en) * 1998-01-23 2000-03-28 Lucent Technologies Inc. Fabrication of semiconductor devices
JP3805888B2 (ja) * 1998-03-20 2006-08-09 株式会社アドバンテスト Ｉｃ試験装置
JP3951436B2 (ja) * 1998-04-01 2007-08-01 株式会社アドバンテスト Ｉｃ試験装置
JPH11297791A (ja) * 1998-04-14 1999-10-29 Advantest Corp トレイ移送アーム及びこれを用いたトレイの移載装置、ｉｃ試験装置並びにトレイの取り廻し方法
US6607071B1 (en) * 1998-10-19 2003-08-19 Mirae Corporation Sealed test chamber for module IC handler
US6204679B1 (en) 1998-11-04 2001-03-20 Teradyne, Inc. Low cost memory tester with high throughput
KR100361810B1 (ko) * 1999-11-12 2002-11-23 미래산업 주식회사 모듈램 실장 테스트 핸들러 및 이를 이용한 모듈램 테스트 방법
KR100349942B1 (ko) * 1999-12-06 2002-08-24 삼성전자 주식회사 램버스 핸들러
JP3584845B2 (ja) * 2000-03-16 2004-11-04 日立ハイテク電子エンジニアリング株式会社 Ｉｃデバイスの試験装置及び試験方法
US7079960B2 (en) * 2002-11-02 2006-07-18 Taiwan Semiconductor Manufacturing Company, Ltd. Auto classification shipping system
DE10256692A1 (de) * 2002-12-04 2004-06-24 Infineon Technologies Ag Test-Gerät, Test-System und Test-Verfahren, insbesondere zum Testen der Kontaktierung zwischen einem Halbleiter-Bauelement und einem Carrier
US7171587B2 (en) * 2003-04-28 2007-01-30 Teradyne, Inc. Automatic test system with easily modified software
KR100517074B1 (ko) * 2003-06-05 2005-09-26 삼성전자주식회사 트레이 트랜스퍼 유닛 및 그를 포함하는 자동 테스트 핸들러
KR100541546B1 (ko) * 2003-07-14 2006-01-10 삼성전자주식회사 반도체 디바이스 테스트장치
KR20050009912A (ko) * 2003-07-18 2005-01-26 삼성전자주식회사 성능측정 시스템
JP2005345262A (ja) * 2004-06-03 2005-12-15 Niigata Seimitsu Kk 半導体検査装置およびこれに用いる被検査部品トレー
WO2005121739A1 (ja) * 2004-06-08 2005-12-22 Advantest Corporation イメージセンサ用試験装置
US7292023B2 (en) * 2004-06-30 2007-11-06 Intel Corporation Apparatus and method for linked slot-level burn-in
US7151388B2 (en) * 2004-09-30 2006-12-19 Kes Systems, Inc. Method for testing semiconductor devices and an apparatus therefor
US7091737B2 (en) * 2004-10-01 2006-08-15 Intel Corporation Apparatus and methods for self-heating burn-in processes
US7355386B2 (en) * 2005-11-18 2008-04-08 Delta Design, Inc. Method of automatically carrying IC-chips, on a planar array of vacuum nozzles, to a variable target in a chip tester
KR100790988B1 (ko) * 2006-04-11 2008-01-03 삼성전자주식회사 테스트 환경의 안정적 온도유지가 가능한 반도체 소자검사용 핸들러
KR100792728B1 (ko) * 2006-05-12 2008-01-11 미래산업 주식회사 번인 테스트용 소팅 핸들러의 트레이 반송장치
WO2008012889A1 (en) * 2006-07-27 2008-01-31 Advantest Corporation Electronic component transfer method and electronic component handling device
KR101104291B1 (ko) * 2006-10-12 2012-01-12 가부시키가이샤 아드반테스트 트레이 반송장치 및 이를 구비한 전자부품 시험장치
US7589520B2 (en) * 2006-12-05 2009-09-15 Delta Design, Inc. Soak profiling
US8866488B2 (en) 2011-03-22 2014-10-21 Taiwan Semiconductor Manufacturing Company, Ltd. Power compensation in 3DIC testing
KR101936348B1 (ko) * 2012-09-17 2019-01-08 삼성전자주식회사 급속 온도 변환이 가능한 테스트 핸들러 및 그를 이용한 반도체 소자의 테스트 방법
TWI472778B (zh) * 2013-08-30 2015-02-11 Chroma Ate Inc System - level IC test machine automatic retest method and the test machine
CN103792485B (zh) * 2014-02-17 2016-12-07 大唐微电子技术有限公司 自动化测试设备和测试方法
US9618570B2 (en) * 2014-06-06 2017-04-11 Advantest Corporation Multi-configurable testing module for automated testing of a device
US9678148B2 (en) * 2014-06-06 2017-06-13 Advantest Corporation Customizable tester having testing modules for automated testing of devices
US9618574B2 (en) 2014-06-06 2017-04-11 Advantest Corporation Controlling automated testing of devices
US9995767B2 (en) 2014-06-06 2018-06-12 Advantest Corporation Universal container for device under test
US9638749B2 (en) 2014-06-06 2017-05-02 Advantest Corporation Supporting automated testing of devices in a test floor system
KR102391516B1 (ko) 2015-10-08 2022-04-27 삼성전자주식회사 반도체 테스트 장치
KR101877667B1 (ko) * 2017-02-28 2018-07-11 세메스 주식회사 반도체 패키지 테스트 방법
US10677842B2 (en) 2017-05-26 2020-06-09 Advantest Corporation DUT testing with configurable cooling control using DUT internal temperature data
CN114415002A (zh) * 2022-03-31 2022-04-29 佛山市联动科技股份有限公司 基于多台测试机数据处理的硬件系统及方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5313156A (en) * 1991-12-04 1994-05-17 Advantest Corporation Apparatus for automatic handling

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JPH071301B2 (ja) * 1988-01-08 1995-01-11 新明和工業株式会社 電子部品の搬送装置
US5024978A (en) * 1989-05-30 1991-06-18 Corning Incorporated Compositions and methods for making ceramic matrix composites
JPH0317574A (ja) * 1989-06-14 1991-01-25 Graphtec Corp バーインボードテスタ
US5307011A (en) * 1991-12-04 1994-04-26 Advantest Corporation Loader and unloader for test handler

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
US5313156A (en) * 1991-12-04 1994-05-17 Advantest Corporation Apparatus for automatic handling

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Schnitzlein, T.: Flexibel bei einheitlichen Daten in Z.: productronic 6-1991, Die Fachzeitschrift für Elektronik-Fertigung und Test, S. 26-28 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19838491B4 (de) * 1998-01-15 2006-06-01 Samsung Electronics Co., Ltd., Suwon Verfahren zur Analyse der Meßstetigkeit von Testgeräten für Halbleiterbauteile

Also Published As

Publication number Publication date
US5788084A (en) 1998-08-04
MY111843A (en) 2001-01-31
KR960706080A (ko) 1996-11-08
WO1996009556A1 (fr) 1996-03-28
KR100206644B1 (ko) 1999-07-01

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8139 Disposal/non-payment of the annual fee