DE19580444T1 - Laserbearbeitungsvorrichtung, Laserbearbeitungsverfahren und Hemmsteg-Bearbeitungsverfahren - Google Patents

Laserbearbeitungsvorrichtung, Laserbearbeitungsverfahren und Hemmsteg-Bearbeitungsverfahren

Info

Publication number
DE19580444T1
DE19580444T1 DE19580444T DE19580444T DE19580444T1 DE 19580444 T1 DE19580444 T1 DE 19580444T1 DE 19580444 T DE19580444 T DE 19580444T DE 19580444 T DE19580444 T DE 19580444T DE 19580444 T1 DE19580444 T1 DE 19580444T1
Authority
DE
Germany
Prior art keywords
processing method
laser processing
laser
processing device
inhibitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19580444T
Other languages
English (en)
Other versions
DE19580444C2 (de
Inventor
Yoshiaki Shimomura
Naoki Miyanagi
Nobuhiko Tada
Yoshinari Nagano
Shinya Okumura
Shigeyuki Sakurai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Construction Machinery Co Ltd
Original Assignee
Hitachi Construction Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP06081875A external-priority patent/JP3106054B2/ja
Priority claimed from JP6244112A external-priority patent/JP2991623B2/ja
Application filed by Hitachi Construction Machinery Co Ltd filed Critical Hitachi Construction Machinery Co Ltd
Publication of DE19580444T1 publication Critical patent/DE19580444T1/de
Application granted granted Critical
Publication of DE19580444C2 publication Critical patent/DE19580444C2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
DE19580444T 1994-04-20 1995-04-06 Laserbearbeitungsvorrichtung, Laserbearbeitungsverfahren und Hemmsteg-Bearbeitungsverfahren Expired - Fee Related DE19580444C2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP06081875A JP3106054B2 (ja) 1994-04-20 1994-04-20 レーザ加工装置及びレーザ加工方法
JP8187694 1994-04-20
JP6244112A JP2991623B2 (ja) 1994-04-20 1994-10-07 レーザ加工装置及びダムバー加工方法
PCT/JP1995/000674 WO1995029035A1 (fr) 1994-04-20 1995-04-06 Appareil et procede d'usinage au faisceau laser et procede d'usinage de barres de retenue

Publications (2)

Publication Number Publication Date
DE19580444T1 true DE19580444T1 (de) 1997-08-21
DE19580444C2 DE19580444C2 (de) 1998-04-16

Family

ID=27303727

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19580444T Expired - Fee Related DE19580444C2 (de) 1994-04-20 1995-04-06 Laserbearbeitungsvorrichtung, Laserbearbeitungsverfahren und Hemmsteg-Bearbeitungsverfahren

Country Status (4)

Country Link
US (1) US5763853A (de)
KR (1) KR0177005B1 (de)
DE (1) DE19580444C2 (de)
WO (1) WO1995029035A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19852302A1 (de) * 1998-11-12 2000-05-25 Fraunhofer Ges Forschung Verfahren und Vorrichtung zum Bearbeiten von Werkstücken mit Hochenergiestrahlung
DE10126725A1 (de) * 2001-05-31 2002-12-05 Volkswagen Ag Verfahren und Vorrichtung zur Laserbearbeitung
AU2003220835A1 (en) * 2002-03-12 2003-09-22 Mitsuboshi Diamond Industrial Co., Ltd. Method and system for machining fragile material
JP2005144487A (ja) * 2003-11-13 2005-06-09 Seiko Epson Corp レーザ加工装置及びレーザ加工方法
US7977601B2 (en) * 2005-11-28 2011-07-12 Electro Scientific Industries, Inc. X and Y orthogonal cut direction processing with set beam separation using 45 degree beam split orientation apparatus and method
JP5027606B2 (ja) * 2007-09-26 2012-09-19 株式会社キーエンス レーザ加工装置、加工データ生成方法及びコンピュータプログラム
DE102011004117A1 (de) 2011-02-15 2012-08-16 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zur Kontrolle einer schneidenden Bearbeitung an einem Werkstück
DE102016109909A1 (de) * 2016-05-30 2017-11-30 Precitec Gmbh & Co. Kg Vorrichtung zur Prozessüberwachung bei der Laserbearbeitung
EP4140633A4 (de) * 2020-04-22 2024-01-10 Nikon Corp Verarbeitungssystem

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH846469A4 (de) * 1969-06-03 1972-05-31
JPS5643838B2 (de) * 1973-12-21 1981-10-15
JPS569090A (en) * 1979-07-05 1981-01-29 Shinwa Boeki Kk Piercing and cutting method of ceramics using laser light
JPS5643838A (en) * 1979-09-18 1981-04-22 Nippon Telegr & Teleph Corp <Ntt> Busy incoming system
US4769523A (en) * 1985-03-08 1988-09-06 Nippon Kogaku K.K. Laser processing apparatus
JP2503388B2 (ja) * 1985-04-17 1996-06-05 株式会社ニコン レ−ザ−加工用光学装置
JPS63136546A (ja) * 1986-11-27 1988-06-08 Nec Corp レ−ザ−・トリミング装置
JPH07105330B2 (ja) * 1987-09-17 1995-11-13 オリンパス光学工業株式会社 半導体露光装置の照明光学系
JPS6483390A (en) * 1987-09-24 1989-03-29 Nec Corp Laser beam machine
GB2236846B (en) * 1988-11-22 1992-10-14 Fiat Auto Spa Laser welding monitoring systems.
JP2917375B2 (ja) * 1990-03-19 1999-07-12 日本電気株式会社 樹脂封止型半導体装置の製造方法
DE4013195A1 (de) * 1990-04-25 1991-10-31 Lambda Physik Forschung Vorrichtung und verfahren zum ueberwachen der bearbeitung eines werkstueckes mit gepulster laserstrahlung
JPH0441092A (ja) * 1990-06-06 1992-02-12 Nec Corp レーザ加工装置
JPH05211260A (ja) * 1991-11-20 1993-08-20 Nec Corp 半導体装置のタイバー切断方法
JPH05315381A (ja) * 1992-05-07 1993-11-26 Nec Corp 半導体製造装置
JP2963588B2 (ja) * 1992-10-30 1999-10-18 日立建機株式会社 パルスレーザ加工機及びパルスレーザ加工方法
JP2720744B2 (ja) * 1992-12-28 1998-03-04 三菱電機株式会社 レーザ加工機
US5340975A (en) * 1993-01-29 1994-08-23 Minnesota Mining And Manufacturing Company Method and apparatus for reducing the effects of laser noise and for improving modulation transfer function in scanning a photoconductive surface
DE4320408C2 (de) * 1993-06-21 1998-02-19 Fraunhofer Ges Forschung Verfahren zur Prozeßkontrolle und -regelung bei der Oberflächenbearbeitung von Werkstücken mit gepulster Laserstrahlung

Also Published As

Publication number Publication date
KR960703361A (ko) 1996-08-17
KR0177005B1 (ko) 1999-02-18
DE19580444C2 (de) 1998-04-16
US5763853A (en) 1998-06-09
WO1995029035A1 (fr) 1995-11-02

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee