DE69628813D1 - Laserbearbeitungsvorrichtung und laserbearbeitungsverfahren - Google Patents

Laserbearbeitungsvorrichtung und laserbearbeitungsverfahren

Info

Publication number
DE69628813D1
DE69628813D1 DE69628813T DE69628813T DE69628813D1 DE 69628813 D1 DE69628813 D1 DE 69628813D1 DE 69628813 T DE69628813 T DE 69628813T DE 69628813 T DE69628813 T DE 69628813T DE 69628813 D1 DE69628813 D1 DE 69628813D1
Authority
DE
Germany
Prior art keywords
laser processing
processing device
processing method
laser
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69628813T
Other languages
English (en)
Other versions
DE69628813T2 (de
Inventor
Atsushi Mori
Yoshinori Nakata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fanuc Corp
Original Assignee
Fanuc Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fanuc Corp filed Critical Fanuc Corp
Publication of DE69628813D1 publication Critical patent/DE69628813D1/de
Application granted granted Critical
Publication of DE69628813T2 publication Critical patent/DE69628813T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/388—Trepanning, i.e. boring by moving the beam spot about an axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
DE69628813T 1995-10-02 1996-10-02 Laserbearbeitungsvorrichtung und laserbearbeitungsverfahren Expired - Lifetime DE69628813T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP25488395A JP3515838B2 (ja) 1995-10-02 1995-10-02 レーザ加工装置、レーザ加工方法、及びプログラム作成装置
PCT/JP1996/002862 WO1997012717A1 (fr) 1995-10-02 1996-10-02 Dispositif d'usinage a laser et procede associe

Publications (2)

Publication Number Publication Date
DE69628813D1 true DE69628813D1 (de) 2003-07-31
DE69628813T2 DE69628813T2 (de) 2003-12-18

Family

ID=17271167

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69628813T Expired - Lifetime DE69628813T2 (de) 1995-10-02 1996-10-02 Laserbearbeitungsvorrichtung und laserbearbeitungsverfahren

Country Status (5)

Country Link
US (1) US5910261A (de)
EP (1) EP0795375B1 (de)
JP (1) JP3515838B2 (de)
DE (1) DE69628813T2 (de)
WO (1) WO1997012717A1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3500071B2 (ja) * 1998-07-23 2004-02-23 株式会社日平トヤマ レーザ加工方法及びレーザ加工装置
WO2001050404A1 (en) * 1999-12-30 2001-07-12 Abb Power T & D Company Inc. Parametric programming of laser cutting system
GB2383769B (en) * 2001-10-06 2004-10-13 Rolls Royce Plc Method of laser drilling a hole
DE10251480B4 (de) * 2002-11-05 2008-01-24 Hitachi Via Mechanics, Ltd., Ebina Verfahren zum Bohren von Löchern mittels eines Laserstrahls in einem elektrischen Schaltungssubstrat
US7259354B2 (en) * 2004-08-04 2007-08-21 Electro Scientific Industries, Inc. Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
JP5122833B2 (ja) * 2007-02-20 2013-01-16 ファナック株式会社 レーザ加工方法及びレーザ加工装置
US20090312859A1 (en) * 2008-06-16 2009-12-17 Electro Scientific Industries, Inc. Modifying entry angles associated with circular tooling actions to improve throughput in part machining
US20110150371A1 (en) * 2008-07-28 2011-06-23 Sonoco Development, Inc. Flexible Pouch With Easy-Opening Features
US8230664B2 (en) * 2008-07-28 2012-07-31 Sonoco Development, Inc. Pouch opening feature and method for making the same
US9434025B2 (en) 2011-07-19 2016-09-06 Pratt & Whitney Canada Corp. Laser drilling methods of shallow-angled holes
US8631557B2 (en) 2011-07-19 2014-01-21 Pratt & Whitney Canada Corp. Laser drilling methods of shallow-angled holes
US8624151B2 (en) 2011-07-19 2014-01-07 Pratt & Whitney Canada Corp. Laser drilling methods of shallow-angled holes
US8716625B2 (en) * 2012-02-03 2014-05-06 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Workpiece cutting
CN104759753B (zh) * 2015-03-30 2016-08-31 江苏大学 多系统自动化协调工作提高激光诱导空化强化的方法
WO2019003513A1 (ja) * 2017-06-29 2019-01-03 パナソニックＩｐマネジメント株式会社 レーザ加工システムおよびレーザ加工システムの制御方法
KR20200120794A (ko) 2019-04-11 2020-10-22 삼성디스플레이 주식회사 표시 모듈, 표시 모듈 제조 방법, 및 레이저 가공 방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57206588A (en) * 1981-06-11 1982-12-17 Nec Corp Laser working method
JPH01197084A (ja) * 1988-01-29 1989-08-08 Fanuc Ltd Ｃｎｃレーザ加工機のパワー制御方式
JPH0463616A (ja) * 1990-07-04 1992-02-28 Mitsubishi Electric Corp 自動プログラミング装置
JPH0519825A (ja) * 1990-12-26 1993-01-29 Amada Co Ltd Ｎｃ装置付レーザ加工機の円弧切断加工の制御方法
JP2743698B2 (ja) * 1992-04-22 1998-04-22 三菱電機株式会社 補間点生成方法および裁断機
JPH07112287A (ja) * 1993-10-15 1995-05-02 Fanuc Ltd Ｎｃレーザ装置
JP3162255B2 (ja) * 1994-02-24 2001-04-25 三菱電機株式会社 レーザ加工方法及びその装置
JP3372339B2 (ja) * 1994-02-25 2003-02-04 ファナック株式会社 レーザ加工装置

Also Published As

Publication number Publication date
JPH0999384A (ja) 1997-04-15
EP0795375B1 (de) 2003-06-25
JP3515838B2 (ja) 2004-04-05
EP0795375A1 (de) 1997-09-17
US5910261A (en) 1999-06-08
DE69628813T2 (de) 2003-12-18
EP0795375A4 (de) 1998-12-02
WO1997012717A1 (fr) 1997-04-10

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