CN104759753B - 多系统自动化协调工作提高激光诱导空化强化的方法 - Google Patents

多系统自动化协调工作提高激光诱导空化强化的方法 Download PDF

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CN104759753B
CN104759753B CN201510141582.XA CN201510141582A CN104759753B CN 104759753 B CN104759753 B CN 104759753B CN 201510141582 A CN201510141582 A CN 201510141582A CN 104759753 B CN104759753 B CN 104759753B
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任旭东
左成亚
袁寿其
佟艳群
王德顺
吴坤
卢加兴
何浩
周睿
王杰
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Yangzhou (Jiangdu) New Energy Automobile Industry Research Institute of Jiangsu University
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Abstract

本发明涉及一种多系统自动化协调工作提高激光诱导空化强化的方法，该方法中用到的装置是由多个系统组成，分别有夹紧系统、升降系统、成像系统、计算机控制系统、激光器系统、能量密度放大系统等。包括激光空化装置和固定台，所述固定台内设有水槽，所述水槽内装有垫块，所述水槽的槽壁上设有温度传感器，所述温度传感器与计算机连接；所述固定台位于升降装置上，所述升降装置位于二轴联动平台上，所述激光空化装置发出的激光穿过所述水槽的侧壁后在水槽内聚焦；所述激光空化装置与计算机连接，所述升降装置和所述二轴联动平台通过CNC伺服系统与计算机连接。多个系统之间协调工作，利用激光诱导产生空化泡对材料进行强化，从而起到延长材料寿命的作用，使操作者能够快速而准确地获得相应的数据，快速高效对这类材料进行强化。

Description

多系统自动化协调工作提高激光诱导空化强化的方法
技术领域
本发明涉及一种多系统自动化协调工作提高激光诱导空化强化的方法，适用于利用高能量密度的激光在水中诱导产生空化泡，利用空化泡改善靶材表面的残余应力分布的表面改性方法的场合。
背景技术
在高功率激光辐射下，当激光的能量密度超过液体的击穿阈值，液体介质会被“光击穿”，在击穿区域产生高温高压的等离子体。等离子体膨胀，形成以超音速传播的冲击波。同时伴随着空化气泡的产生，即激光空化泡。激光空化泡是研究空泡现象的有力工具，有助于开展水下冲击强化、水下打孔、空化空蚀特性等研究。
早在1753年欧拉(Euler)就注意到当水管中某处的压强降低至蒸汽压甚至负值时，水与管壁分离，并在该处形成一个真空空间，通常人们将这种现象称为空化。随后，人们发现在液体流动和液力机械中，即从液体流动到水泵、水轮机或船舶螺旋桨都可能发生空化现象。空化现象是高速运动的液体所特有的物理现象，它的初生与发展取决于很多复杂的因素，一方面对水利机械、液体流动特性等有着严重的影响，如侵蚀破坏液力机械的叶片，在血液流动中损坏内脏等；另一方面合理利用空化现象也能对生产、生活产生帮助，如减少水污染，提高眼科手术的疗效及水中激光打孔的效率等。因此，几十年来，空化现象以及对于如何合理利用空化现象来为社会的生产、生活服务一直是科研工作者研究的热点问题之一。
在翻阅相关文献后，发现各种空化装置中对水槽不具备易换性和夹固性，不能实现计算机控制系统与各系统自动化，不利于实验的连续性、精确性和有效性。鉴于此不足，本人提出了上文所述装置。
发明内容
本发明的目的是提供一种激光诱导空化强化的方法，可以更方便地研究空化强化机制，为其工业推广提供设备保障。
为实现上述目的，本发明采取的技术方案为：
一种多系统自动化协调工作提高激光诱导空化强化的方法，该方法基于一种多系统自动化协调工作提高激光诱导空化强化的装置，包括激光空化装置和固定台，所述固定台内设有水槽，所述水槽内装有垫块，所述水槽的槽壁上设有温度传感器，所述温度传感器与计算机连接；所述固定台位于升降装置上，所述升降装置位于二轴联动平台上，所述激光空化装置发出的激光穿过所述水槽的侧壁后在水槽内聚焦；所述激光空化装置与计算机连接，所述升降装置和所述二轴联动平台通过CNC伺服系统与计算机连接。
，所述固定台上端设有导向杆，所述导向杆上安装有活动板，所述活动板与所述导向杆移动副连接，所述活动板与气缸的活塞杆连接，所述气缸通过电磁阀与氮气瓶连接。所述升降装置包括升降台，所述固定台位于所述升降台上，所述升降台依次通过轴、联轴器和伺服电机与所述CNC伺服系统连接。所述激光空化装置包括激光控制器，YAG激光器，45°全反镜，扩束镜和聚焦镜，所述激光器控制器控制YAG激光器发射激光，通过45°全反镜、扩束镜和聚焦镜后穿过水槽的侧壁后射入水槽中聚焦。具体步骤如下：
S1用无水乙醇或丙酮对靶材和垫块表面进行擦拭，除去其表面的油污和灰层，防止对实验造成干扰，影响实验精度；将靶材和垫块一起放入水槽中，再放入固定台中，向水槽中加适量纯净水将靶材和垫块淹没；
S2计算机控制电磁阀，利用气缸，活动板、导向杆、氮气瓶和电磁阀组成的夹紧系统对水槽进行夹紧固定；
S3激光器控制器控制YAG激光器发射激光，通过45°全反镜、扩束镜和聚焦镜组成的能量密度放大系统射入水槽的水中；
S4计算机控制CNC伺服系统，通过升降台、联轴器、伺服电机和轴组成的升降系统实现对水槽的升降；其中，升降台是通过齿轮齿条机构实现上下运动的，利用已知的齿轮齿条传动比，根据伺服电机的转数可得出升降距离，将数值显示在计算机屏幕上，避免人工读数带来的误差；同时温度传感器向计算机实时反馈当冲击过程中的水温，并将数值显示在计算机屏幕上；
S5通过清洗靶材表面，分析其残余应力分布，来确定激光空化强化的效果；
S6调节升降系统，改变水温，重复上述操作，直至得到激光空化强化的最优残余应力分布，确定最优残余应力分布下的水温及最佳强化距离ds；所述ds为靶材强化表面与激光在水槽中聚焦点之间的距离；
S7保持最佳强化距离ds和水温不变，计算机控制二轴联动平台对靶材整个待强化表面进行强化。
进一步的，还包括对激光空化过程进行监控的步骤：将高速摄像机、照明闪光灯及CCD组成的成像系统与计算机相连，并将水听器放入水槽，计算机控制照明闪光灯开关，并实时接收水听器反馈的声波信号与成像系统的信号；通过对声波信号和成像系统的信号进行分析，为研究最优残余应力分布下的水温及最佳强化距离ds下的激光空化过程提供数据支撑。
本发明的优点在于：(1)利用气缸可对多种大小的水槽进行灵活装夹固定，具备易换性；(2)带有齿轮齿条机构的升降系统实现了数控性和精确性，避免了使用五轴联动工作台、数控操作台等大型昂贵的机械，既方便快捷又减少成本；(3)将上述各系统与计算机相连实现了自动化，保证了实验的连续性，准确性和方便快捷。(4)该强化方法和装置相对于传统具有无污染，利用率高等优点，可用于工业推广。
附图说明
图1为本发明方法中的多系统自动化协调工作提高激光诱导空化强化的装置主视图。
图2为本发明方法中的多系统自动化协调工作提高激光诱导空化强化的装置俯视图。
图中，1、升降台，2、气缸，3、活动板，4、水听器，5、导向杆，6、水槽，7、固定台，8、靶材，9、温度传感器，10、垫块，11、联轴器，12、伺服电机，13、二轴联动平台，14、轴，15、照明闪关灯，16、高速摄像机，17、CCD，18、CNC伺服系统，19、计算机，20、激光控制器，21、YAG激光器，22、45°全反镜，23、扩束镜，24、聚焦镜，25、氮气瓶，26、电磁阀。
具体实施方法
如图1和图2所示，本方法用到的多系统自动化协调工作提高激光诱导空化强化的装置，包括激光空化装置和固定台7，所述激光空化装置包括激光控制器20，YAG激光器21，45°全反镜22，扩束镜23和聚焦镜24，所述激光器控制器20控制YAG激光器21发射激光，通过45°全反镜22、扩束镜23和聚焦镜24后穿过水槽6的侧壁后射入水槽6中聚焦。所述固定台7内设有水槽6，所述水槽6内装有垫块10，所述固定台7上端设有导向杆5，所述导向杆5上安装有活动板3，所述活动板3与所述导向杆5移动副连接，所述活动板3与气缸2的活塞杆连接，所述气缸2通过电磁阀26与氮气瓶25连接。所述水槽6的槽壁上设有温度传感器9，所述温度传感器9与计算机19连接；所述水槽6的上方还装有水听器4，所述水听器4与所述计算机19连接，用于监控空化泡的声波信息，还包括一个成像系统，所述成像系统包括照明闪光灯15，高速摄像机16和CCD17、照明闪光灯15、高速摄像机16和CCD17均与计算机19连接，用于记录空化泡的脉动及溃灭过程。所述固定台7位于升降装置上，升降装置包括升降台1，所述固定台7位于所述升降台1上，所述升降台1依次通过轴14、联轴器11和伺服电机12与所述CNC伺服系统18连接。所述升降装置位于二轴联动平台13上，所述激光空化装置发出的激光穿过所述水槽6的侧壁后在水槽6内聚焦；所述激光空化装置与计算机19连接，所述升降装置和所述二轴联动平台13通过CNC伺服系统18与计算机19连接。
操作时，先用无水乙醇或丙酮对靶材8和垫块10表面进行擦拭；将靶材8和垫块10一起放入水槽6的适当位置后，再放入固定台7中，向水槽中加适量纯净水将靶材8和垫块10淹没，从计算机上看到温度传感器9实时反馈的当前以及冲击过程中的水温；计算机19分别调节加紧系统和升降系统；在激光器控制器20上设置好激光参数后(包括激光能量、输出波长、光斑直径)，控制YAG激光器21发射激光经能量密度放大后产生空泡，分析实验数据，清洗靶材8表面，分析其残余应力分布；调节升降系统，改变水温，重复上述操作，直至得出最佳强化距离ds(所述ds为靶材8强化表面与激光在水槽6中聚焦点之间的距离)；保持ds不变，计算机19控制二轴联动平台13对靶材8整个表面进行强化。同时为了更深入的研究激光空化在最佳环境下的空化过程，水听器和成像系统工作及时将信号反馈到计算机19，便于科研人员对空化过程进行更详细的观察和研究。
最后应当说明的是，以上内容仅用以说明本发明的技术方案，而非对本发明保护范围的限制，本领域的普通技术人员对本发明的技术方案进行的简单修改或者等同替换，均不脱离本发明技术方案的实质和范围。

Claims (2)

1.一种多系统自动化协调工作提高激光诱导空化强化的方法，该方法基于一种多系统自动化协调工作提高激光诱导空化强化的装置，包括激光空化装置和固定台(7)，所述固定台(7)内设有水槽(6)，所述水槽(6)内装有垫块(10)，所述水槽(6)的槽壁上设有温度传感器(9)，所述温度传感器(9)与计算机(19)连接；所述固定台(7)位于升降装置上，所述升降装置位于二轴联动平台(13)上，所述激光空化装置发出的激光穿过所述水槽(6)的侧壁后在水槽(6)内聚焦；所述激光空化装置与计算机(19)连接，所述升降装置和所述二轴联动平台(13)通过CNC伺服系统(18)与计算机(19)连接；所述固定台(7)上端设有导向杆(5)，所述导向杆(5)上安装有活动板(3)，所述活动板(3)与所述导向杆(5)移动副连接，所述活动板(3)与气缸(2)的活塞杆连接，所述气缸(2)通过电磁阀(26)与氮气瓶(25)连接；所述升降装置包括升降台(1)，所述固定台(7)位于所述升降台(1)上，所述升降台(1)依次通过轴(14)、联轴器(11)和伺服电机(12)与所述CNC伺服系统(18)连接；所述激光空化装置包括激光控制器(20)，YAG激光器(21)，45°全反镜(22)，扩束镜(23)和聚焦镜(24)，所述激光器控制器(20)控制YAG激光器(21)发射激光，通过45°全反镜(22)、扩束镜(23)和聚焦镜(24)后穿过水槽(6)的侧壁后射入水槽(6)中聚焦；具体步骤如下：
S1用无水乙醇或丙酮对靶材(8)和垫块(10)表面进行擦拭，除去其表面的油污和灰层，防止对实验造成干扰，影响实验精度；将靶材(8)和垫块(10)一起放入水槽(6)中，再放入固定台(7)中，向水槽中加适量纯净水将靶材(8)和垫块(10)淹没；
S2计算机(19)控制电磁阀(26)，利用气缸(2)，活动板(3)、导向杆(5)、氮气瓶(25)和电磁阀(26)组成的夹紧系统对水槽(6)进行夹紧固定；
S3激光控制器(20)控制YAG激光器(21)发射激光，通过45°全反镜(22)、扩束镜(23)和聚焦镜(24)组成的能量密度放大系统射入水槽的水中；
S4计算机(19)控制CNC伺服系统(18)，通过升降台(1)、联轴器(11)、伺服电机(12)和轴(14)组成的升降系统实现对水槽的升降；其中，升降台(1)是通过齿轮齿条机构实现上下运动的，利用已知的齿轮齿条传动比，根据伺服电机(12)的转数可得出升降距离，将数值显示在计算机屏幕上，避免人工读数带来的误差；同时温度传感器(9)向计算机(19)实时反馈当冲击过程中的水温，并将数值显示在计算机屏幕上；
S5通过清洗靶材(8)表面，分析其残余应力分布，来确定激光空化强化的效果；
S6调节升降系统，改变水温，重复上述操作，直至得到激光空化强化的最优残余应力分布，确定最优残余应力分布下的水温及最佳强化距离ds；所述ds为靶材(8)强化表面与激光在水槽(6)中聚焦点之间的距离；
S7保持最佳强化距离ds和水温不变，计算机(19)控制二轴联动平台(13)对靶材(8)整个待强化表面进行强化。
2.根据权利要求1所述的一种多系统自动化协调工作提高激光诱导空化强化的方法，其特征在于，还包括对激光空化过程进行监控的步骤：将高速摄像机(16)、照明闪光灯(15)及CCD(17)组成的成像系统与计算机(19)相连，并将水听器(4)放入水槽(6)，计算机(19)控制照明闪光灯(15)开关，并实时接收水听器反馈的声波信号与成像系统的信号；通过对声波信号和成像系统的信号进行分析，为研究最优残余应力分布下的水温及最佳强化距离ds下的激光空化过程提供数据支撑。
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Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3517256A (en) * 1966-02-22 1970-06-23 Comp Generale Electricite Shock-wave generator
CN101685065A (zh) * 2008-09-24 2010-03-31 中国科学院工程热物理研究所 一种声空化强化传热与防除垢测量装置及测量方法
CN101722361A (zh) * 2009-11-05 2010-06-09 江苏大学 一种控制金属微结构表面残余应力的装置及方法
CN103849757A (zh) * 2014-03-10 2014-06-11 广东工业大学 一种基于激光诱导空化的金属表面强化装置及方法

Family Cites Families (200)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3588737A (en) * 1968-04-22 1971-06-28 Electro Nuclear Lab Inc Thermally stabilized laser
US3836950A (en) * 1970-03-05 1974-09-17 Trw Inc Acousto-optical multi-constituent flow monitoring method and apparatus
US5504719A (en) * 1974-09-19 1996-04-02 Martin Marietta Corporation Laser hydrophone and virtual array of laser hydrophones
US4541055A (en) * 1982-09-01 1985-09-10 Westinghouse Electric Corp. Laser machining system
US4492843A (en) * 1982-09-01 1985-01-08 Westinghouse Electric Corp. Apparatus and method for laser machining in a non-reactive environment
US4501949A (en) * 1982-09-01 1985-02-26 Westinghouse Electric Corp. Movable machining chamber with rotatable work piece fixture
US4555610A (en) * 1983-09-13 1985-11-26 Data Card Corporation Laser machining system
JPH01168084A (ja) * 1987-12-24 1989-07-03 Toshiba Corp 金属蒸気レーザ装置
JPH01197084A (ja) * 1988-01-29 1989-08-08 Fanuc Ltd Ｃｎｃレーザ加工機のパワー制御方式
US4904340A (en) * 1988-10-31 1990-02-27 Microelectronics And Computer Technology Corporation Laser-assisted liquid-phase etching of copper conductors
US5037431A (en) * 1989-11-03 1991-08-06 The Curators Of The University Of Missouri Surgical liquid lance apparatus
US4986656A (en) * 1989-11-30 1991-01-22 Gte Government Systems Corporation Method of remotely measuring diffuse attenuation coefficient of sea water
US4986655A (en) * 1989-11-30 1991-01-22 Gte Government Systems Corporation Apparatus for measuring diffuse attenuation coefficient of sea water
US5057184A (en) * 1990-04-06 1991-10-15 International Business Machines Corporation Laser etching of materials in liquids
DE4021541C1 (zh) * 1990-07-06 1991-12-19 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung Ev, 8000 Muenchen, De
US5053602A (en) * 1990-08-22 1991-10-01 Robomatix, Ltd. Laser beam delivery system
US5142120A (en) * 1990-12-21 1992-08-25 Hewlett-Packard Company Contact cooling of a projection mask
WO1993007453A1 (en) * 1991-10-03 1993-04-15 Iowa State University Research Foundation, Inc. Mobile inductively coupled plasma system
GB9200622D0 (en) * 1992-01-13 1992-03-11 Duley Walter W Improved means of co2 laser welding of a1 7075
US5814784A (en) * 1992-01-13 1998-09-29 Powerlasers Ltd. Laser-welding techniques using pre-heated tool and enlarged beam
US5486264A (en) * 1992-03-25 1996-01-23 The Trustees Of Columbia University Laser etching of semiconductors
US5238530A (en) * 1992-04-20 1993-08-24 Texas Instruments Incorporated Anisotropic titanate etch
US5374330A (en) * 1992-04-20 1994-12-20 Texas Instruments Incorporated Anisotropic barium strontium titanate etch
US5312516A (en) * 1992-04-20 1994-05-17 Texas Instruments Incorporated Anisotropic tantalum pentoxide etch
US5238529A (en) * 1992-04-20 1993-08-24 Texas Instruments Incorporated Anisotropic metal oxide etch
US5201989A (en) * 1992-04-20 1993-04-13 Texas Instruments Incorporated Anisotropic niobium pentoxide etch
JPH0729141A (ja) * 1993-07-15 1995-01-31 Yamaha Corp 磁気ヘッドのレール面加工方法
US5749830A (en) * 1993-12-03 1998-05-12 Olympus Optical Co., Ltd. Fluorescent endoscope apparatus
WO1995025821A1 (en) * 1994-03-22 1995-09-28 Battelle Memorial Institute Reducing edge effects of laser shock peening
US5526110A (en) * 1994-07-08 1996-06-11 Iowa State University Research Foundation, Inc. In situ calibration of inductively coupled plasma-atomic emission and mass spectroscopy
US5560843A (en) * 1994-07-13 1996-10-01 Koike Sanso Kogyo Co., Ltd. Frame construction and a machining device provided with it
US5593606A (en) * 1994-07-18 1997-01-14 Electro Scientific Industries, Inc. Ultraviolet laser system and method for forming vias in multi-layered targets
US5683601A (en) * 1994-10-24 1997-11-04 Panasonic Technologies, Inc. Laser ablation forward metal deposition with electrostatic assisted bonding
US5567336A (en) * 1994-10-24 1996-10-22 Matsushita Electric Industrial Co., Ltd. Laser ablation forward metal deposition with electrostatic assisted bonding
US5935462A (en) * 1994-10-24 1999-08-10 Matsushita Electric Industrial Co., Ltd. Repair of metal lines by electrostatically assisted laser ablative deposition
DE29505985U1 (de) * 1995-04-06 1995-07-20 Bestenlehrer Alexander Vorrichtung zum Bearbeiten, insbesondere zum Polieren und Strukturieren von beliebigen 3D-Formflächen mittels eines Laserstrahls
JP3515838B2 (ja) * 1995-10-02 2004-04-05 ファナック株式会社 レーザ加工装置、レーザ加工方法、及びプログラム作成装置
GB2309180A (en) * 1996-01-16 1997-07-23 Aqualisa Products Ltd Spray nozzle for aerating liquids
JPH09201691A (ja) * 1996-01-24 1997-08-05 Fanuc Ltd レーザ加工装置
US5631425A (en) * 1996-03-07 1997-05-20 Integrated Device Technology, Inc. Method for identifying molding compound using an acoustic microscope
US6073337A (en) * 1996-06-12 2000-06-13 Seagate Technology, Inc. Compressive stress treatment method for controlling curvature of a hydrodynamic bearing slider
US5751416A (en) * 1996-08-29 1998-05-12 Mississippi State University Analytical method using laser-induced breakdown spectroscopy
US6163012A (en) * 1996-09-27 2000-12-19 Kabushiki Kaisha Toshiba Laser maintaining and repairing apparatus
US6211080B1 (en) * 1996-10-30 2001-04-03 Matsushita Electric Industrial Co., Ltd. Repair of dielectric-coated electrode or circuit defects
US6041020A (en) * 1997-04-21 2000-03-21 University Of Delaware Gas-coupled laser acoustic detection
US5947051A (en) * 1997-06-04 1999-09-07 Geiger; Michael B. Underwater self-propelled surface adhering robotically operated vehicle
EA002888B1 (ru) * 1997-07-22 2002-10-31 Блэклайт Пауэр, Инк. Неорганические водородные соединения, способы получения и применение
US20090142257A1 (en) * 1997-07-22 2009-06-04 Blacklight Power, Inc. Inorganic hydrogen compounds and applications thereof
US5982535A (en) * 1997-08-07 1999-11-09 Marine Biological Laboratory Centrifuge microscope capable of realizing polarized light observation
US5956253A (en) * 1997-09-09 1999-09-21 Glassline Corporation Camera controlled CNC apparatus for processing blanks
GB9802688D0 (en) * 1998-02-06 1998-07-29 Marconi Gec Ltd Improvements in or relating to sound detection
US6060127A (en) * 1998-03-31 2000-05-09 Matsushita Electric Industrial Co., Ltd. Mechanically restricted laser deposition
US6037564A (en) * 1998-03-31 2000-03-14 Matsushita Electric Industrial Co., Ltd. Method for scanning a beam and an apparatus therefor
US6180912B1 (en) * 1998-03-31 2001-01-30 Matsushita Electric Industrial Co., Ltd. Fan-out beams for repairing an open defect
TW405160B (en) * 1998-05-15 2000-09-11 Nippon Kogaku Kk Light-exposure method, light-exposure apparatus and the manufacture method thereof
US6144007A (en) * 1998-10-26 2000-11-07 Levin; Theodore L. Method and apparatus for forming a perforated non-planar object using a pulsed energy beam
US6948843B2 (en) * 1998-10-28 2005-09-27 Covaris, Inc. Method and apparatus for acoustically controlling liquid solutions in microfluidic devices
JP2000176761A (ja) * 1998-12-10 2000-06-27 Fanuc Ltd 垂直軸直動機構
US6327290B1 (en) * 1999-02-12 2001-12-04 Lambda Physik Ag Beam delivery system for molecular fluorine (F2) laser
DE19915426A1 (de) * 1999-04-06 2000-11-09 Pein Andreas Medizintech Gmbh Wasserstrahleinrichtung zum Trennen einer biologischen Struktur
US6653971B1 (en) * 1999-05-14 2003-11-25 David L. Guice Airborne biota monitoring and control system
US6300592B1 (en) * 1999-07-23 2001-10-09 Lillbacka Jetair Oy Laser cutting system
US6284999B1 (en) * 1999-07-23 2001-09-04 Lillbacka Jetair Oy Laser cutting system
US6326586B1 (en) * 1999-07-23 2001-12-04 Lillbacka Jetair Oy Laser cutting system
US6588738B1 (en) * 1999-07-23 2003-07-08 Lillbacka Jetair Oy Laser cutting system
US6376798B1 (en) * 1999-07-23 2002-04-23 Lillbacka Jetair Oy Laser cutting system
US6472295B1 (en) * 1999-08-27 2002-10-29 Jmar Research, Inc. Method and apparatus for laser ablation of a target material
US6325697B1 (en) * 1999-11-24 2001-12-04 Glassline Corporation CNC machine tools
US6795456B2 (en) * 1999-12-20 2004-09-21 Lambda Physik Ag 157 nm laser system and method for multi-layer semiconductor failure analysis
US6430465B2 (en) * 2000-01-11 2002-08-06 Electro Scientific Industries, Inc. Abbe error correction system and method
US6772040B1 (en) * 2000-04-10 2004-08-03 Hypertherm, Inc. Centralized control architecture for a plasma arc system
US6947802B2 (en) * 2000-04-10 2005-09-20 Hypertherm, Inc. Centralized control architecture for a laser materials processing system
US6622058B1 (en) * 2000-04-10 2003-09-16 Tate S. Picard Centralized control architecture for a plasma arc system
JP3484396B2 (ja) * 2000-05-09 2004-01-06 新光電気工業株式会社 ウェハーの切断方法
US20020122525A1 (en) * 2000-07-27 2002-09-05 Stefan Rosenberger Removal and collection of particulate from water filled tanks
JP2002045371A (ja) * 2000-08-01 2002-02-12 Nidek Co Ltd レーザ治療装置
US6720522B2 (en) * 2000-10-26 2004-04-13 Kabushiki Kaisha Toshiba Apparatus and method for laser beam machining, and method for manufacturing semiconductor devices using laser beam machining
CN1286146C (zh) * 2001-03-09 2006-11-22 株式会社东芝 电子装置的制造系统
US6608282B2 (en) * 2001-04-12 2003-08-19 W.A. Whitney Co. Machine tool loading apparatus
US6566626B2 (en) * 2001-07-03 2003-05-20 Laserglass Ltd. Method and apparatus for generating color images in a transparent medium
US8204618B2 (en) * 2008-03-24 2012-06-19 Hypertherm, Inc. Method and apparatus for operating an automated high temperature thermal cutting system
SG121697A1 (en) * 2001-10-25 2006-05-26 Inst Data Storage A method of patterning a substrate
US7994450B2 (en) * 2002-01-07 2011-08-09 International Business Machines Corporation Debris minimization and improved spatial resolution in pulsed laser ablation of materials
US20040004055A1 (en) * 2002-01-18 2004-01-08 Barros Emanuel F. Method and apparatus for the controlled formation of cavitation bubbles
US6932914B2 (en) * 2002-01-18 2005-08-23 Leclair Mark L. Method and apparatus for the controlled formation of cavitation bubbles using target bubbles
US6960307B2 (en) * 2002-01-18 2005-11-01 Leclair Mark L Method and apparatus for the controlled formation of cavitation bubbles
WO2003070441A1 (en) * 2002-02-21 2003-08-28 Arvindbhai Lavjibhai Patel A novel laser diamond sawing machine
JP2004001067A (ja) * 2002-03-28 2004-01-08 Fanuc Ltd レーザ加工機及びレーザ加工方法
US6777641B2 (en) * 2002-04-16 2004-08-17 W.A. Whitney Co. Method and apparatus for laser piercing and cutting metal sheet and plate
US6835912B2 (en) * 2002-05-28 2004-12-28 Trumpf, Inc. Laser cutting machine with two Y-axis drives
SG114560A1 (en) * 2002-07-31 2005-09-28 Inst Data Storage A method and apparatus for cleaning surfaces
US7367948B2 (en) * 2002-08-29 2008-05-06 The Regents Of The University Of Michigan Acoustic monitoring method and system in laser-induced optical breakdown (LIOB)
US6770568B2 (en) * 2002-09-12 2004-08-03 Intel Corporation Selective etching using sonication
US6746967B2 (en) * 2002-09-30 2004-06-08 Intel Corporation Etching metal using sonication
US7020539B1 (en) * 2002-10-01 2006-03-28 Southern Methodist University System and method for fabricating or repairing a part
US7045738B1 (en) * 2002-10-01 2006-05-16 Southern Methodist University Powder delivery system and method
US6945114B2 (en) * 2002-11-25 2005-09-20 The Johns Hopkins University Laser-air, hybrid, ultrasonic testing of railroad tracks
US6862936B2 (en) * 2002-11-27 2005-03-08 The Johns Hopkins University Laser-air, hybrid, ultrasonic testing of railroad wheels
US20050064137A1 (en) * 2003-01-29 2005-03-24 Hunt Alan J. Method for forming nanoscale features and structures produced thereby
CN100427994C (zh) * 2003-03-24 2008-10-22 株式会社尼康 光学元件、光学系统、激光器装置、曝光设备、掩模检测装置和高分子晶体加工设备
US7361171B2 (en) * 2003-05-20 2008-04-22 Raydiance, Inc. Man-portable optical ablation system
US7238085B2 (en) * 2003-06-06 2007-07-03 P.C.T. Systems, Inc. Method and apparatus to process substrates with megasonic energy
TW200503057A (en) * 2003-06-11 2005-01-16 Adv Lcd Tech Dev Ct Co Ltd Crystallization apparatus, crystallization method, method of manufacturing thin film transistor, thin film transistor, and display apparatus
CA2949524C (en) * 2003-07-18 2017-07-04 Bio-Rad Laboratories, Inc. System and method for multi-analyte detection
US8012768B2 (en) * 2003-07-18 2011-09-06 Bio-Rad Laboratories, Inc. System and method for multi-analyte detection
US9022037B2 (en) * 2003-08-11 2015-05-05 Raydiance, Inc. Laser ablation method and apparatus having a feedback loop and control unit
US6995334B1 (en) * 2003-08-25 2006-02-07 Southern Methodist University System and method for controlling the size of the molten pool in laser-based additive manufacturing
US6940037B1 (en) * 2003-08-25 2005-09-06 Southern Methodist University System and method for controlling welding parameters in welding-based deposition processes
JP4784930B2 (ja) * 2003-09-11 2011-10-05 株式会社ニコン 高分子結晶の加工方法、高分子結晶の加工装置、及び高分子結晶の観察装置
US7460223B2 (en) * 2003-09-19 2008-12-02 Applied Biosystems Inc. Inverted orientation for a microplate
US20050237528A1 (en) * 2003-09-19 2005-10-27 Oldham Mark F Transparent heater for thermocycling
US20050221358A1 (en) * 2003-09-19 2005-10-06 Carrillo Albert L Pressure chamber clamp mechanism
US20060024690A1 (en) * 2003-09-19 2006-02-02 Kao H P Normalization of data using controls
US20050232821A1 (en) * 2003-09-19 2005-10-20 Carrillo Albert L High density plate filler
US20050226771A1 (en) * 2003-09-19 2005-10-13 Lehto Dennis A High speed microplate transfer
US20050226779A1 (en) * 2003-09-19 2005-10-13 Oldham Mark F Vacuum assist for a microplate
US20060011305A1 (en) * 2003-09-19 2006-01-19 Donald Sandell Automated seal applicator
US20050232818A1 (en) * 2003-09-19 2005-10-20 Donald Sandell Single sheet seal applicator and cartridge
US7407630B2 (en) * 2003-09-19 2008-08-05 Applera Corporation High density plate filler
US20050226782A1 (en) * 2003-09-19 2005-10-13 Reed Mark T High density plate filler
WO2005028110A2 (en) * 2003-09-19 2005-03-31 Applera Corporation Microplates useful for conducting thermocycled nucleotide amplification
US7570443B2 (en) * 2003-09-19 2009-08-04 Applied Biosystems, Llc Optical camera alignment
US20060013984A1 (en) * 2003-09-19 2006-01-19 Donald Sandell Film preparation for seal applicator
US20060029948A1 (en) * 2003-09-19 2006-02-09 Gary Lim Sealing cover and dye compatibility selection
US20050233472A1 (en) * 2003-09-19 2005-10-20 Kao H P Spotting high density plate using a banded format
US20070015289A1 (en) * 2003-09-19 2007-01-18 Kao H P Dispenser array spotting
US7695688B2 (en) * 2003-09-19 2010-04-13 Applied Biosystems, Llc High density plate filler
US20050220675A1 (en) * 2003-09-19 2005-10-06 Reed Mark T High density plate filler
US20050280811A1 (en) * 2003-09-19 2005-12-22 Donald Sandell Grooved high density plate
US20070014694A1 (en) * 2003-09-19 2007-01-18 Beard Nigel P High density plate filler
US7417726B2 (en) * 2003-09-19 2008-08-26 Applied Biosystems Inc. Normalization of data using controls
US20050225751A1 (en) * 2003-09-19 2005-10-13 Donald Sandell Two-piece high density plate
US20050226780A1 (en) * 2003-09-19 2005-10-13 Donald Sandell Manual seal applicator
JP2005294801A (ja) * 2004-03-11 2005-10-20 Advanced Lcd Technologies Development Center Co Ltd レーザー結晶化装置及びレーザー結晶化方法
DE602005025201D1 (de) * 2004-03-31 2011-01-20 Nippon Kogaku Kk Verfahren zur verarbeitung von organischen kristallen
US6869889B1 (en) * 2004-04-07 2005-03-22 Intel Corporation Etching metal carbide films
US7557917B1 (en) * 2004-05-08 2009-07-07 Collectors Universe, Inc. System and method for analysis of gemstones
JP4390627B2 (ja) * 2004-05-28 2009-12-24 ヤマザキマザック株式会社 レーザ焼き入れ工具
US20080271305A1 (en) * 2005-01-19 2008-11-06 Tosoh Smd Etna, Llc Automated Sputtering Target Production
US8529738B2 (en) * 2005-02-08 2013-09-10 The Trustees Of Columbia University In The City Of New York In situ plating and etching of materials covered with a surface film
US8496799B2 (en) * 2005-02-08 2013-07-30 The Trustees Of Columbia University In The City Of New York Systems and methods for in situ annealing of electro- and electroless platings during deposition
US8184284B2 (en) * 2005-06-14 2012-05-22 Ebstein Steven M Laser-processed substrate for molecular diagnostics
EP1896805A4 (en) * 2005-06-14 2010-03-31 Steven M Ebstein USES OF LASER-TREATED SUBSTRATE FOR MOLECULAR DIAGNOSIS
EP1742049B1 (en) * 2005-07-07 2009-12-09 Kabushiki Kaisha Toshiba Laser-based maintenance apparatus
US7757561B2 (en) * 2005-08-01 2010-07-20 Covaris, Inc. Methods and systems for processing samples using acoustic energy
JP4844715B2 (ja) * 2005-08-25 2011-12-28 澁谷工業株式会社 ハイブリッドレーザ加工装置
JP4400542B2 (ja) * 2005-10-04 2010-01-20 セイコーエプソン株式会社 パターン形成方法及び液滴吐出装置
US8189971B1 (en) * 2006-01-23 2012-05-29 Raydiance, Inc. Dispersion compensation in a chirped pulse amplification system
US7444049B1 (en) * 2006-01-23 2008-10-28 Raydiance, Inc. Pulse stretcher and compressor including a multi-pass Bragg grating
US7605063B2 (en) * 2006-05-10 2009-10-20 Lam Research Corporation Photoresist stripping chamber and methods of etching photoresist on substrates
US7532652B2 (en) * 2007-02-20 2009-05-12 The Boeing Company Laser thermal management systems and methods
JP4930095B2 (ja) * 2007-02-22 2012-05-09 富士通株式会社 ウエットエッチング方法および半導体装置の製造方法
US7576334B2 (en) * 2007-03-19 2009-08-18 The Regents Of The University Of Michigan Photoacoustic indicators
EP1975276A1 (en) * 2007-03-30 2008-10-01 Danmarks Tekniske Universitet Preparation of a polymer article for selective metallization
WO2008149352A2 (en) * 2007-06-04 2008-12-11 Pixer Technology Ltd. Apparatus and method for inducing controllable jets in liquids
JP5643101B2 (ja) * 2007-10-25 2014-12-17 ワシントン・ユニバーシティＷａｓｈｉｎｇｔｏｎ Ｕｎｉｖｅｒｓｉｔｙ 散乱媒体の画像化方法、画像化装置及び画像化システム
US7903326B2 (en) * 2007-11-30 2011-03-08 Radiance, Inc. Static phase mask for high-order spectral phase control in a hybrid chirped pulse amplifier system
JP2011516914A (ja) * 2008-04-03 2011-05-26 カール ゼイス エスエムエス リミテッド 液体中の気泡の形成、捕獲および操作方法
WO2009149563A1 (en) * 2008-06-13 2009-12-17 Fablab Inc. A system and method for fabricating macroscopic objects, and nano-assembled objects obtained therewith
US8458871B2 (en) * 2008-06-26 2013-06-11 Hg-Farley Laserlab Co. Pty Ltd Secondary positioning device for workpiece machining
DE102008030725B4 (de) * 2008-07-01 2013-10-17 Deutsche Cell Gmbh Verfahren zur Herstellung einer Kontakt-Struktur mittels einer Galvanikmaske
JP5469950B2 (ja) * 2008-08-08 2014-04-16 株式会社半導体エネルギー研究所 発光装置の作製方法
US8125704B2 (en) * 2008-08-18 2012-02-28 Raydiance, Inc. Systems and methods for controlling a pulsed laser by combining laser signals
US9089928B2 (en) * 2008-08-20 2015-07-28 Foro Energy, Inc. Laser systems and methods for the removal of structures
SA109300643B1 (ar) * 2008-10-28 2014-11-12 Electra Holdings Co Ltd جهاز لتنقية شعاع الليزر وطريقة لتنقية شعاع الليزر
FR2939195B1 (fr) * 2008-11-28 2011-01-21 Bertin Technologies Sa Dispositif d'analyse de materiaux par spectroscopie de plasma
CA2767428C (en) * 2009-07-08 2018-03-13 Gr Intellectual Reserve, Llc Novel gold-based nanocrystals for medical treatments and electrochemical manufacturing processes therefor
US8701471B2 (en) * 2009-07-08 2014-04-22 University of Washington through its Center for Commercialiation Method and system for background suppression in magneto-motive photoacoustic imaging of magnetic contrast agents
US8210045B2 (en) * 2009-08-25 2012-07-03 James N. Caron Continuous laser generation of ultrasound
KR101377832B1 (ko) * 2009-08-25 2014-03-26 가부시끼가이샤 도시바 레이저 조사 장치 및 레이저 시공 방법
US8985050B2 (en) * 2009-11-05 2015-03-24 The Trustees Of Columbia University In The City Of New York Substrate laser oxide removal process followed by electro or immersion plating
CA2781104C (en) * 2009-11-16 2016-02-09 Rolls-Royce Corporation Techniques for removing a contaminant layer from a thermal barrier coating and estimating remaining life of the coating
US8288680B1 (en) * 2010-02-24 2012-10-16 Vinyl Technologies, Inc. Thin film remediation and edge deletion process
WO2012052985A1 (en) * 2010-10-22 2012-04-26 Highcon Ltd Method and apparatus for laser cutting
TWI409452B (zh) * 2010-11-05 2013-09-21 Univ Chang Gung 一種光學式超音波觀測裝置及其延遲同步控制的方法
US9442095B2 (en) * 2011-06-15 2016-09-13 Northwestern University Optical coherence photoacoustic microscopy
US9452495B1 (en) * 2011-07-08 2016-09-27 Sixpoint Materials, Inc. Laser slicer of crystal ingots and a method of slicing gallium nitride ingots using a laser slicer
JP6049293B2 (ja) * 2011-12-26 2016-12-21 キヤノン株式会社 音響波取得装置
US11590609B2 (en) * 2012-01-18 2023-02-28 Purdue Research Foundation Laser shock peening apparatuses and methods
US9737954B2 (en) * 2012-04-04 2017-08-22 Hypertherm, Inc. Automatically sensing consumable components in thermal processing systems
US9144882B2 (en) * 2012-04-04 2015-09-29 Hypertherm, Inc. Identifying liquid jet cutting system components
US20150332071A1 (en) * 2012-04-04 2015-11-19 Hypertherm, Inc. Configuring Signal Devices in Thermal Processing Systems
US9672460B2 (en) * 2012-04-04 2017-06-06 Hypertherm, Inc. Configuring signal devices in thermal processing systems
US9395715B2 (en) * 2012-04-04 2016-07-19 Hypertherm, Inc. Identifying components in a material processing system
US20140033821A1 (en) * 2012-07-31 2014-02-06 National Taiwan University Noninvasive measuring device and noninvasive measuring method for probing an interface
US9042006B2 (en) * 2012-09-11 2015-05-26 Kla-Tencor Corporation Solid state illumination source and inspection system
US8929406B2 (en) * 2013-01-24 2015-01-06 Kla-Tencor Corporation 193NM laser and inspection system
US9529182B2 (en) * 2013-02-13 2016-12-27 KLA—Tencor Corporation 193nm laser and inspection system
US9608399B2 (en) * 2013-03-18 2017-03-28 Kla-Tencor Corporation 193 nm laser and an inspection system using a 193 nm laser
JP2015007262A (ja) * 2013-06-24 2015-01-15 株式会社豊電子工業 レーザ焼入れ装置
US9643273B2 (en) * 2013-10-14 2017-05-09 Hypertherm, Inc. Systems and methods for configuring a cutting or welding delivery device
CN103712723B (zh) * 2013-12-19 2016-04-06 江苏大学 激光空化射流力冲击作用的检测方法及装置
US20150269603A1 (en) * 2014-03-19 2015-09-24 Hypertherm, Inc. Methods for Developing Customer Loyalty Programs and Related Systems and Devices
US9804101B2 (en) * 2014-03-20 2017-10-31 Kla-Tencor Corporation System and method for reducing the bandwidth of a laser and an inspection system and method using a laser
CN103920884B (zh) * 2014-04-25 2016-04-20 广东工业大学 一种基于激光诱导空化的纳米颗粒制备装置及方法
US9500844B2 (en) * 2014-06-05 2016-11-22 University Of Florida Research Foundation, Inc. Compact lens system for use in photoacoustic microscopy
US20160059363A1 (en) * 2014-06-25 2016-03-03 Pittsburgh Portable Laser Company, Llc Portable computer numerically controlled cutting machine with folding arm
JP6430219B2 (ja) * 2014-11-17 2018-11-28 株式会社東芝 レーザ加工装置及びレーザ加工方法
CN104561516B (zh) * 2014-12-19 2017-12-05 江苏大学 一种激光诱导空化泡进行表面改性的装置和方法
CN104759753B (zh) * 2015-03-30 2016-08-31 江苏大学 多系统自动化协调工作提高激光诱导空化强化的方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3517256A (en) * 1966-02-22 1970-06-23 Comp Generale Electricite Shock-wave generator
CN101685065A (zh) * 2008-09-24 2010-03-31 中国科学院工程热物理研究所 一种声空化强化传热与防除垢测量装置及测量方法
CN101722361A (zh) * 2009-11-05 2010-06-09 江苏大学 一种控制金属微结构表面残余应力的装置及方法
CN103849757A (zh) * 2014-03-10 2014-06-11 广东工业大学 一种基于激光诱导空化的金属表面强化装置及方法

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
基于高速摄影术的聚焦Nd:YAG脉冲激光水下空化效应实验研究;吕涛 等;《中国科学：物理学 力学 天文学》;20111018;第41卷(第11期);第753-758页 *
激光电化学复合加工的冲击空化检测及试验;毛卫平 等;《激光技术》;20141130;第38卷(第6期);第753-758页 *

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