DE19581386T1 - Hemmsteg-Schneidevorrichtung und Hemmsteg-Schneideverfahren - Google Patents

Hemmsteg-Schneidevorrichtung und Hemmsteg-Schneideverfahren

Info

Publication number
DE19581386T1
DE19581386T1 DE19581386T DE19581386T DE19581386T1 DE 19581386 T1 DE19581386 T1 DE 19581386T1 DE 19581386 T DE19581386 T DE 19581386T DE 19581386 T DE19581386 T DE 19581386T DE 19581386 T1 DE19581386 T1 DE 19581386T1
Authority
DE
Germany
Prior art keywords
hemmsteg
cutting
cutting device
cutting method
hemmsteg cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19581386T
Other languages
English (en)
Other versions
DE19581386C2 (de
Inventor
Nobuhiko Tada
Kojiro Ogata
Naoki Miyanagi
Yoshiaki Shimomura
Shigeyuki Sakurai
Yoshinari Nagano
Shinya Okumura
Yasushi Minomoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Construction Machinery Co Ltd
Original Assignee
Hitachi Construction Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Construction Machinery Co Ltd filed Critical Hitachi Construction Machinery Co Ltd
Publication of DE19581386T1 publication Critical patent/DE19581386T1/de
Application granted granted Critical
Publication of DE19581386C2 publication Critical patent/DE19581386C2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0092—Treatment of the terminal leads as a separate operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
DE19581386T 1994-10-13 1995-10-09 Vorrichtung und Verfahren zum Schneiden von Hemmstegen (Dam-bars) Expired - Fee Related DE19581386C2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP24795294 1994-10-13
PCT/JP1995/002064 WO1996012300A1 (fr) 1994-10-13 1995-10-09 Dispositif et procede permettant d'usiner une barre de liaison

Publications (2)

Publication Number Publication Date
DE19581386T1 true DE19581386T1 (de) 1996-12-05
DE19581386C2 DE19581386C2 (de) 1998-07-23

Family

ID=17170996

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19581386T Expired - Fee Related DE19581386C2 (de) 1994-10-13 1995-10-09 Vorrichtung und Verfahren zum Schneiden von Hemmstegen (Dam-bars)

Country Status (5)

Country Link
US (1) US5662822A (de)
JP (1) JP3413204B2 (de)
KR (1) KR100191675B1 (de)
DE (1) DE19581386C2 (de)
WO (1) WO1996012300A1 (de)

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DE19741029A1 (de) * 1997-09-18 1999-04-08 Bosch Gmbh Robert Optische Vorrichtung zum Bohren mittels Laserstrahls
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US6281471B1 (en) 1999-12-28 2001-08-28 Gsi Lumonics, Inc. Energy-efficient, laser-based method and system for processing target material
US7723642B2 (en) * 1999-12-28 2010-05-25 Gsi Group Corporation Laser-based system for memory link processing with picosecond lasers
US20040134894A1 (en) * 1999-12-28 2004-07-15 Bo Gu Laser-based system for memory link processing with picosecond lasers
US7838794B2 (en) 1999-12-28 2010-11-23 Gsi Group Corporation Laser-based method and system for removing one or more target link structures
US8217304B2 (en) * 2001-03-29 2012-07-10 Gsi Group Corporation Methods and systems for thermal-based laser processing a multi-material device
US7671295B2 (en) 2000-01-10 2010-03-02 Electro Scientific Industries, Inc. Processing a memory link with a set of at least two laser pulses
US6951995B2 (en) 2002-03-27 2005-10-04 Gsi Lumonics Corp. Method and system for high-speed, precise micromachining an array of devices
DE10318688A1 (de) * 2003-04-24 2004-11-25 W. C. Heraeus Gmbh & Co. Kg Verfahren zum Trennen der elektrischen Verbindungsknoten bei IC-Frames und Verfahren zur Herstellung eines elektronischen Bauteils sowie von Frames dafür
JP2005334922A (ja) * 2004-05-26 2005-12-08 Yamazaki Mazak Corp レーザ加工機におけるノズルチェック装置
WO2007005639A2 (en) * 2005-06-30 2007-01-11 Controlled Semiconductor, Inc. Lead frame isolation using laser technology
US8290239B2 (en) * 2005-10-21 2012-10-16 Orbotech Ltd. Automatic repair of electric circuits
US8084706B2 (en) * 2006-07-20 2011-12-27 Gsi Group Corporation System and method for laser processing at non-constant velocities
US20100102045A1 (en) * 2007-02-13 2010-04-29 Lasag Ag Method of cutting parts to be machined using a pulsed laser
JP2008254035A (ja) 2007-04-05 2008-10-23 Disco Abrasive Syst Ltd レーザー加工装置
KR100829009B1 (ko) 2007-08-28 2008-05-14 지에스아이 루모닉스 인코퍼레이티드 표적 물질 처리를 위한 에너지 효율적인 레이저 기반 방법 및 시스템
US9280913B2 (en) 2009-07-10 2016-03-08 Lincoln Global, Inc. Systems and methods providing enhanced education and training in a virtual reality environment
US9483959B2 (en) 2008-08-21 2016-11-01 Lincoln Global, Inc. Welding simulator
US9196169B2 (en) 2008-08-21 2015-11-24 Lincoln Global, Inc. Importing and analyzing external data using a virtual reality welding system
US9318026B2 (en) 2008-08-21 2016-04-19 Lincoln Global, Inc. Systems and methods providing an enhanced user experience in a real-time simulated virtual reality welding environment
US8274013B2 (en) 2009-03-09 2012-09-25 Lincoln Global, Inc. System for tracking and analyzing welding activity
CN102473651B (zh) 2009-07-06 2014-12-17 瑞萨电子株式会社 半导体器件的制造方法
US20110210105A1 (en) * 2009-12-30 2011-09-01 Gsi Group Corporation Link processing with high speed beam deflection
JP5319571B2 (ja) * 2010-02-12 2013-10-16 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
CN102218607B (zh) * 2010-04-15 2014-11-05 鸿富锦精密工业（深圳）有限公司 块体非晶合金的脉冲激光切割方法
DE102010020183B4 (de) * 2010-05-11 2013-07-11 Precitec Kg Laserschneidkopf und Verfahren zum Schneiden eines Werkstücks mittels eines Laserschneidkopfes
WO2011158617A1 (ja) * 2010-06-14 2011-12-22 三菱電機株式会社 レーザ加工装置、及びレーザ加工方法
US20160093233A1 (en) 2012-07-06 2016-03-31 Lincoln Global, Inc. System for characterizing manual welding operations on pipe and other curved structures
US10930174B2 (en) 2013-05-24 2021-02-23 Lincoln Global, Inc. Systems and methods providing a computerized eyewear device to aid in welding
US20150072323A1 (en) 2013-09-11 2015-03-12 Lincoln Global, Inc. Learning management system for a real-time simulated virtual reality welding training environment
JP2015077629A (ja) * 2013-10-18 2015-04-23 三菱マテリアル株式会社 レーザ加工方法及び加工装置
US10083627B2 (en) 2013-11-05 2018-09-25 Lincoln Global, Inc. Virtual reality and real welding training system and method
US9836987B2 (en) 2014-02-14 2017-12-05 Lincoln Global, Inc. Virtual reality pipe welding simulator and setup
WO2015185972A1 (en) 2014-06-02 2015-12-10 Lincoln Global, Inc. System and method for manual welder training
US10371645B2 (en) 2015-03-10 2019-08-06 Technology Research Association For Future Additive Manufacturing Optical processing head, optical processing apparatus, and control method and control program of optical processing apparatus
EP3319066A1 (de) 2016-11-04 2018-05-09 Lincoln Global, Inc. Magnetische frequenzwahl für elektromagnetische positionsverfolgung
US10878591B2 (en) 2016-11-07 2020-12-29 Lincoln Global, Inc. Welding trainer utilizing a head up display to display simulated and real-world objects
US10913125B2 (en) 2016-11-07 2021-02-09 Lincoln Global, Inc. Welding system providing visual and audio cues to a welding helmet with a display
JP6598807B2 (ja) * 2017-03-13 2019-10-30 株式会社Ｓｃｒｅｅｎホールディングス 検査方法および検査装置
US10997872B2 (en) 2017-06-01 2021-05-04 Lincoln Global, Inc. Spring-loaded tip assembly to support simulated shielded metal arc welding
US11557223B2 (en) 2018-04-19 2023-01-17 Lincoln Global, Inc. Modular and reconfigurable chassis for simulated welding training
US11475792B2 (en) 2018-04-19 2022-10-18 Lincoln Global, Inc. Welding simulator with dual-user configuration
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Also Published As

Publication number Publication date
WO1996012300A1 (fr) 1996-04-25
US5662822A (en) 1997-09-02
JP3413204B2 (ja) 2003-06-03
DE19581386C2 (de) 1998-07-23
KR960706195A (ko) 1996-11-08
KR100191675B1 (ko) 1999-07-01

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8125 Change of the main classification

Ipc: H01L 23/50

D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee