JP5319571B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
- Publication number
- JP5319571B2 JP5319571B2 JP2010028705A JP2010028705A JP5319571B2 JP 5319571 B2 JP5319571 B2 JP 5319571B2 JP 2010028705 A JP2010028705 A JP 2010028705A JP 2010028705 A JP2010028705 A JP 2010028705A JP 5319571 B2 JP5319571 B2 JP 5319571B2
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- lead
- sealing body
- dam
- resin
- semiconductor device
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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Description
前記特許文献1の図3(b)に示すように、ダムバーごとダム内樹脂を除去することができる。しかし、前記特許文献1の図3(c)に示すように、金型パンチで打ち抜く領域と、その領域に隣接するリードとの間には、材料公差分や切断公差分を考慮した所定のクリアランスが設けられており、そのクリアランスが設けられている関係でリードの側面にダム内樹脂の一部が残留してしまう。
2、24 封止体
2a 上面
2b 下面
2c、2d 側面
2f ダム内樹脂
2g 封止体側樹脂
2h 凸状樹脂
2i 残留樹脂
2j マーク
3、3h、25 リード
3a インナリード
3b アウタリード
3c 突出部
3i 凸部
4、4a 半導体チップ
4d 電極パッド
5 チップ搭載部
6 ダイボンド材
7 導電性部材
8 めっき膜
10、10d リードフレーム
10a デバイス領域
10b 枠体(枠部)
10c 送り穴(スプロケットホール)
11 吊りリード
12 ダムバー
12a ダム部
20 成形金型
21 上型
21a 金型面
21b 凹部
22 下型
22a 金型面
22b 凹部
30 銅板
30a 上面
30b 下面
30c 側面
30d 不要な銅板
30e 潰れ
30f、30g バリ
31、31a 金型パンチ
32、32a ダイ
33、33a 金型パンチガイド
L1 距離
L2 幅
Claims (12)
- 半導体チップを封止する第1封止体および前記第1封止体から露出する複数のリードを有する半導体装置の製造方法であって、
(a)前記半導体チップを封止する前記第1封止体、前記第1封止体から露出する前記複数のリード、前記複数のリードのそれぞれのリード間に一体で形成されたダムバー、および前記第1封止体と前記複数のリードと前記ダムバーとで囲まれた領域に形成された第2封止体を有する半導体パッケージを準備する工程と、
(b)前記第2封止体の一部にレーザを照射する工程と、
(c)前記(b)工程の後、前記ダムバーの一部を除去する工程と、
(d)前記(c)工程の後、前記複数のリードのそれぞれの表面にめっき膜を形成する工程と、
を有し、
前記(b)工程は、前記第2封止体と前記複数のリードとの界面と、前記第2封止体と前記ダムバーとの界面と、に沿う経路に前記レーザを照射することにより、前記第2封止体の前記レーザが照射された部分は除去し、それ以外の部分は残存させるように行う半導体装置の製造方法。 - 請求項1に記載の半導体装置の製造方法において、
前記(b)工程において、前記レーザの照射は、前記レーザの中心位置を前記界面よりも前記第2封止体側に位置させた状態で行う半導体装置の製造方法。 - 請求項1に記載の半導体装置の製造方法において、
前記(b)工程は、前記第1封止体の側面から前記ダムバーが設けられている方向に突出した第3封止体を形成するように行い、
前記第3封止体は、前記第2封止体の一部が残存したものである半導体装置の製造方法。 - 請求項3に記載の半導体装置の製造方法において、
前記(c)工程は、前記ダムバーの一部と前記第3封止体とを除去する半導体装置の製造方法。 - 請求項4に記載の半導体装置の製造方法において、
前記(c)工程は、切断刃を用いて前記ダムバーの一部と前記第3封止体とを除去する半導体装置の製造方法。 - 請求項5に記載の半導体装置の製造方法において、
前記(c)工程で使用する前記切断刃の幅は、前記複数のリード間の距離よりも小さい半導体装置の製造方法。 - 請求項1に記載の半導体装置の製造方法において、
前記(b)工程は、前記複数のリード間において、前記第1封止体の側面に沿って延在する第4封止体を形成するように行い、
前記第4封止体は、前記第2封止体の一部が残存したものである半導体装置の製造方法。 - 請求項1に記載の半導体装置の製造方法において、
前記(b)工程は、前記複数のリードの主面側または前記主面側の反対の裏面側において、端部が曲線形状に凹んだ形状を有する面のある側から前記レーザを前記第2封止体に対して照射する半導体装置の製造方法。 - 請求項1に記載の半導体装置の製造方法において、
前記(b)工程は、前記レーザの照射を前記複数のリードの主面側および裏面側のそれぞれの方向から行う半導体装置の製造方法。 - 請求項1に記載の半導体装置の製造方法において、
前記(b)工程は、前記レーザの照射を複数回に分けて行う半導体装置の製造方法。 - 請求項1に記載の半導体装置の製造方法において、
前記(b)工程で照射する前記レーザはYAGレーザである半導体装置の製造方法。 - 請求項1に記載の半導体装置の製造方法において、
(e)前記(d)工程の後、前記複数のリードをガルウイング状に成形する半導体装置の製造方法。
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CN102473651B (zh) | 2009-07-06 | 2014-12-17 | 瑞萨电子株式会社 | 半导体器件的制造方法 |
JP5380244B2 (ja) * | 2009-10-22 | 2014-01-08 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
TWI453831B (zh) | 2010-09-09 | 2014-09-21 | 台灣捷康綜合有限公司 | 半導體封裝結構及其製造方法 |
US8587099B1 (en) * | 2012-05-02 | 2013-11-19 | Texas Instruments Incorporated | Leadframe having selective planishing |
US9589929B2 (en) * | 2013-03-14 | 2017-03-07 | Vishay-Siliconix | Method for fabricating stack die package |
US9966330B2 (en) | 2013-03-14 | 2018-05-08 | Vishay-Siliconix | Stack die package |
JP6090041B2 (ja) * | 2013-07-30 | 2017-03-08 | 株式会社デンソー | 電子装置およびその製造方法 |
US20150144389A1 (en) * | 2013-11-22 | 2015-05-28 | Texas Instruments Incorporated | Method of minimizing mold flash during dambar cut |
JP6178734B2 (ja) * | 2014-02-04 | 2017-08-09 | 新電元工業株式会社 | 樹脂封止型半導体装置の製造方法、樹脂封止型半導体装置及び樹脂封止型半導体装置の製造装置 |
JP6505540B2 (ja) * | 2015-07-27 | 2019-04-24 | 新光電気工業株式会社 | 半導体装置及び半導体装置の製造方法 |
JP6260593B2 (ja) * | 2015-08-07 | 2018-01-17 | 日亜化学工業株式会社 | リードフレーム、パッケージ及び発光装置、並びにこれらの製造方法 |
WO2017168537A1 (ja) * | 2016-03-29 | 2017-10-05 | 三菱電機株式会社 | 樹脂封止型電力半導体装置の製造方法 |
JP7396789B2 (ja) * | 2018-08-10 | 2023-12-12 | 日東電工株式会社 | 配線回路基板、その製造方法および配線回路基板集合体シート |
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US20210043466A1 (en) | 2019-08-06 | 2021-02-11 | Texas Instruments Incorporated | Universal semiconductor package molds |
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