DE1808928C2 - Halbleiterbauelement mit polykristallinen Bereichen und Verfahren zum Herstellen - Google Patents

Halbleiterbauelement mit polykristallinen Bereichen und Verfahren zum Herstellen

Info

Publication number
DE1808928C2
DE1808928C2 DE1808928A DE1808928A DE1808928C2 DE 1808928 C2 DE1808928 C2 DE 1808928C2 DE 1808928 A DE1808928 A DE 1808928A DE 1808928 A DE1808928 A DE 1808928A DE 1808928 C2 DE1808928 C2 DE 1808928C2
Authority
DE
Germany
Prior art keywords
area
semiconductor
polycrystalline
layer
sub
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE1808928A
Other languages
German (de)
English (en)
Other versions
DE1808928A1 (de
Inventor
Isamu Kanagawa Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of DE1808928A1 publication Critical patent/DE1808928A1/de
Application granted granted Critical
Publication of DE1808928C2 publication Critical patent/DE1808928C2/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/281—Base electrodes for bipolar transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/40—Crystalline structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
    • H10D64/0111—Manufacture or treatment of electrodes ohmically coupled to a semiconductor to Group IV semiconductors
    • H10D64/0113—Manufacture or treatment of electrodes ohmically coupled to a semiconductor to Group IV semiconductors the conductive layers comprising highly doped semiconductor materials, e.g. polysilicon layers or amorphous silicon layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/40—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00 with at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of IGFETs with BJTs
    • H10D84/401—Combinations of FETs or IGBTs with BJTs
    • H10D84/403—Combinations of FETs or IGBTs with BJTs and with one or more of diodes, resistors or capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/053—Field effect transistors fets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/122—Polycrystalline
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/145—Shaped junctions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/151—Simultaneous diffusion

Landscapes

  • Junction Field-Effect Transistors (AREA)
  • Bipolar Transistors (AREA)
  • Thyristors (AREA)
DE1808928A 1967-11-14 1968-11-14 Halbleiterbauelement mit polykristallinen Bereichen und Verfahren zum Herstellen Expired DE1808928C2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7315567 1967-11-14
JP8205567 1967-12-21

Publications (2)

Publication Number Publication Date
DE1808928A1 DE1808928A1 (de) 1969-07-24
DE1808928C2 true DE1808928C2 (de) 1983-07-28

Family

ID=26414311

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1808928A Expired DE1808928C2 (de) 1967-11-14 1968-11-14 Halbleiterbauelement mit polykristallinen Bereichen und Verfahren zum Herstellen

Country Status (10)

Country Link
US (1) US3681668A (enExample)
AT (1) AT300039B (enExample)
BE (1) BE723824A (enExample)
CH (1) CH499203A (enExample)
DE (1) DE1808928C2 (enExample)
FR (1) FR1601561A (enExample)
GB (1) GB1253064A (enExample)
NL (1) NL163372C (enExample)
NO (1) NO123437B (enExample)
SE (1) SE354545B (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3621346A (en) * 1970-01-28 1971-11-16 Ibm Process for forming semiconductor devices with polycrystalline diffusion pathways and devices formed thereby
US3703420A (en) * 1970-03-03 1972-11-21 Ibm Lateral transistor structure and process for forming the same
US3990093A (en) * 1973-10-30 1976-11-02 General Electric Company Deep buried layers for semiconductor devices
JPS51132779A (en) * 1975-05-14 1976-11-18 Hitachi Ltd Production method of vertical-junction type field-effect transistor
JPS57176772A (en) * 1981-04-23 1982-10-30 Fujitsu Ltd Semiconductor device and manufacture thereof
GB2132017B (en) * 1982-12-16 1986-12-03 Secr Defence Semiconductor device array
US4837175A (en) * 1983-02-15 1989-06-06 Eaton Corporation Making a buried channel FET with lateral growth over amorphous region
US4601096A (en) * 1983-02-15 1986-07-22 Eaton Corporation Method for fabricating buried channel field effect transistor for microwave and millimeter frequencies utilizing molecular beam epitaxy
US4833095A (en) * 1985-02-19 1989-05-23 Eaton Corporation Method for buried channel field effect transistor for microwave and millimeter frequencies utilizing ion implantation
WO1985003597A1 (en) * 1984-02-03 1985-08-15 Advanced Micro Devices, Inc. A bipolar transistor with active elements formed in slots
US4935789A (en) * 1985-02-19 1990-06-19 Eaton Corporation Buried channel FET with lateral growth over amorphous region
US4724220A (en) * 1985-02-19 1988-02-09 Eaton Corporation Method for fabricating buried channel field-effect transistor for microwave and millimeter frequencies
US4683485A (en) * 1985-12-27 1987-07-28 Harris Corporation Technique for increasing gate-drain breakdown voltage of ion-implanted JFET
JPH0671073B2 (ja) * 1989-08-29 1994-09-07 株式会社東芝 半導体装置及びその製造方法
JP2775503B2 (ja) * 1990-03-13 1998-07-16 三菱電機株式会社 接合ゲート型電界効果トランジスタの製造方法
US5637518A (en) * 1995-10-16 1997-06-10 Micron Technology, Inc. Method of making a field effect transistor having an elevated source and an elevated drain
JP4610865B2 (ja) * 2003-05-30 2011-01-12 パナソニック株式会社 半導体装置及びその製造方法
US20080265936A1 (en) * 2007-04-27 2008-10-30 Dsm Solutions, Inc. Integrated circuit switching device, structure and method of manufacture

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3189973A (en) * 1961-11-27 1965-06-22 Bell Telephone Labor Inc Method of fabricating a semiconductor device

Also Published As

Publication number Publication date
GB1253064A (enExample) 1971-11-10
NL6816092A (enExample) 1969-05-19
NL163372B (nl) 1980-03-17
NL163372C (nl) 1980-08-15
SE354545B (enExample) 1973-03-12
NO123437B (enExample) 1971-11-15
CH499203A (de) 1970-11-15
DE1808928A1 (de) 1969-07-24
US3681668A (en) 1972-08-01
AT300039B (de) 1972-07-10
FR1601561A (enExample) 1970-08-31
BE723824A (enExample) 1969-04-16

Similar Documents

Publication Publication Date Title
DE2745857C2 (enExample)
DE2238450C3 (de) Verfahren zur Herstellung einer integrierten Halbleiteranordnung
DE2824419C2 (de) Feldeffekttransistor und Verfahren zu dessen Herstellung
DE1131329B (de) Steuerbares Halbleiterbauelement
DE2060333B2 (de) Verfahren zur herstellung einer halbleiteranordnung mit einem feldeffekttransistor mit isolierter gateelektrode
DE1964979C3 (de) Halbleiterbauelement mit wenigstens einem lateralen Transistor und Verfahren zu seiner Herstellung
DE1808928A1 (de) Halbleiterbauelement und Verfahren zu dessen Herstellung
DE2453279C3 (de) Halbleiteranordnung
DE2633714A1 (de) Integrierter halbleiter-baustein sowie verfahren zu seiner herstellung
DE1564218A1 (de) Verfahren zur Herstellung von Transistoren
DE2109352C2 (de) Verfahren zum Herstellen eines lateralen bipolaren Halbleiter-Bauelements
DE1539090B1 (de) Integrierte Halbleiteranordnung und Verfahren zu ihrer Herstellung
DE2752335B2 (de) Verfahren zur Herstellung eines Sperrschicht-Feldeffekttransistors mit einem vertikalen Kanal
DE1614827C2 (de) Verfahren zum Herstellen eines Transistors
DE2100292A1 (de) Halbleiteranordnung mit relativ kleinen geometrischen Abmessungen und Verfahren zur Herstellung derselben
DE2408402A1 (de) Verfahren zur herstellung integrierter schaltungen bzw. nach einem solchen verfahren hergestellte integrierte halbleiterschaltungseinheit
DE1303672C2 (de) Transistor
DE2537327A1 (de) Halbleiterbauelement mit einem pn- uebergang gleichfoermiger stromdichteverteilung und verfahren zum herstellen eines solchen halbleiterbauelements
DE1464305B2 (de) Verfahren zum Herstellen von Halbleiterbauelementen sowie nach diesem Verfahren hergestellte Bauelemente
DE1090330B (de) Halbleiteranordnung mit einem Halbleiterkoerper mit zwei Zonen entgegengesetzten Leitfaehigkeitstyps und je einer Elektrode an den beiden Zonen
DE2216642C3 (de) Halbleiteranordnung und Verfahren zu ihrer Herstellung
DE2051892C3 (de) Halbleiteranordnung
DE2256883C3 (de) Halbleiteranordnung und Verfahren zu ihrer Herstellung
DE1789016C3 (de) Schalttransistor und Verfahren zu seiner Herstellung
DE1614286C3 (de) Halbleiteranordnung und Verfahren zu ihrer Herstellung

Legal Events

Date Code Title Description
8125 Change of the main classification

Ipc: H01L 29/04

D2 Grant after examination
8363 Opposition against the patent
8339 Ceased/non-payment of the annual fee