DE1247804B - Alkalisches Bad zum chemischen Abscheiden von festhaftenden Palladiumueberzuegen - Google Patents
Alkalisches Bad zum chemischen Abscheiden von festhaftenden PalladiumueberzuegenInfo
- Publication number
- DE1247804B DE1247804B DEJ25485A DEJ0025485A DE1247804B DE 1247804 B DE1247804 B DE 1247804B DE J25485 A DEJ25485 A DE J25485A DE J0025485 A DEJ0025485 A DE J0025485A DE 1247804 B DE1247804 B DE 1247804B
- Authority
- DE
- Germany
- Prior art keywords
- ammonia
- palladium
- bath
- chemical deposition
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US267947A US3274022A (en) | 1963-03-26 | 1963-03-26 | Palladium deposition |
Publications (1)
Publication Number | Publication Date |
---|---|
DE1247804B true DE1247804B (de) | 1967-08-17 |
Family
ID=23020789
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DEJ25485A Pending DE1247804B (de) | 1963-03-26 | 1964-03-19 | Alkalisches Bad zum chemischen Abscheiden von festhaftenden Palladiumueberzuegen |
Country Status (5)
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1035850A (en) * | 1964-06-12 | 1966-07-13 | Johnson Matthey Co Ltd | Improvements in and relating to the electrodeposition of palladium |
US3629776A (en) * | 1967-10-24 | 1971-12-21 | Nippon Kogaku Kk | Sliding thin film resistance for measuring instruments |
US3846345A (en) * | 1969-10-06 | 1974-11-05 | Owens Illinois Inc | Electroconductive paste composition and structures formed therefrom |
US3861919A (en) * | 1970-03-30 | 1975-01-21 | Itek Corp | A photoconductor process using a copy medium sensitized with an amine |
US3862488A (en) * | 1970-11-20 | 1975-01-28 | Rca Corp | Method of making a joined metal structure |
US4180480A (en) * | 1975-10-15 | 1979-12-25 | Mcgean Chemical Company, Inc. | Catalytically active compositions from precious metal complexes |
US4255194A (en) * | 1979-01-15 | 1981-03-10 | Mine Safety Appliances Company | Palladium alloy baths for the electroless deposition |
US4279951A (en) * | 1979-01-15 | 1981-07-21 | Mine Safety Appliances Company | Method for the electroless deposition of palladium |
CN104674201A (zh) * | 2015-02-11 | 2015-06-03 | 江苏澳光电子有限公司 | 一种用于金属表面镀覆金属钯镀层的化学镀钯液 |
CN105296974A (zh) * | 2015-08-27 | 2016-02-03 | 中国科学院兰州化学物理研究所 | 一种镀钯液及使用其在铜表面镀钯的方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB844358A (en) * | 1958-03-03 | 1960-08-10 | Mond Nickel Co Ltd | Improvements in palladium plating |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2915406A (en) * | 1958-03-03 | 1959-12-01 | Int Nickel Co | Palladium plating by chemical reduction |
US3156634A (en) * | 1962-12-12 | 1964-11-10 | Sel Rex Corp | Gold plating |
-
1963
- 1963-03-26 US US267947A patent/US3274022A/en not_active Expired - Lifetime
-
1964
- 1964-03-10 GB GB10064/64A patent/GB994560A/en not_active Expired
- 1964-03-19 DE DEJ25485A patent/DE1247804B/de active Pending
- 1964-03-23 NL NL6403078A patent/NL6403078A/xx unknown
- 1964-03-26 BE BE645775A patent/BE645775A/xx unknown
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB844358A (en) * | 1958-03-03 | 1960-08-10 | Mond Nickel Co Ltd | Improvements in palladium plating |
Also Published As
Publication number | Publication date |
---|---|
BE645775A (US07714131-20100511-C00038.png) | 1964-09-28 |
US3274022A (en) | 1966-09-20 |
GB994560A (en) | 1965-06-10 |
NL6403078A (US07714131-20100511-C00038.png) | 1964-09-28 |
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