DE2750932A1 - CYANIDE-FREE BATHROOM FOR ELECTRONIC GOLD DEPOSITION AND PROCESS FOR SEPARATING GOLD - Google Patents

CYANIDE-FREE BATHROOM FOR ELECTRONIC GOLD DEPOSITION AND PROCESS FOR SEPARATING GOLD

Info

Publication number
DE2750932A1
DE2750932A1 DE19772750932 DE2750932A DE2750932A1 DE 2750932 A1 DE2750932 A1 DE 2750932A1 DE 19772750932 DE19772750932 DE 19772750932 DE 2750932 A DE2750932 A DE 2750932A DE 2750932 A1 DE2750932 A1 DE 2750932A1
Authority
DE
Germany
Prior art keywords
gold
depositing
deposition
cyanide bath
electroless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19772750932
Other languages
English (en)
Other versions
DE2750932C3 (de
DE2750932B2 (de
Inventor
William V Hough
Aaron R Burke
Gerald T Hefferan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MSA Safety Inc
Original Assignee
MSA Safety Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US74322076A priority Critical
Application filed by MSA Safety Inc filed Critical MSA Safety Inc
Publication of DE2750932A1 publication Critical patent/DE2750932A1/de
Publication of DE2750932B2 publication Critical patent/DE2750932B2/de
Application granted granted Critical
Publication of DE2750932C3 publication Critical patent/DE2750932C3/de
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/42Coating with noble metals
    • C23C18/44Coating with noble metals using reducing agents
DE19772750932 1976-11-19 1977-11-15 Expired DE2750932C3 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US74322076A true 1976-11-19 1976-11-19

Publications (3)

Publication Number Publication Date
DE2750932A1 true DE2750932A1 (de) 1978-05-24
DE2750932B2 DE2750932B2 (de) 1978-12-14
DE2750932C3 DE2750932C3 (de) 1979-08-16

Family

ID=24987968

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19772750932 Expired DE2750932C3 (de) 1976-11-19 1977-11-15

Country Status (4)

Country Link
US (1) US4142902A (de)
JP (1) JPS5620353B2 (de)
DE (1) DE2750932C3 (de)
GB (1) GB1547028A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4792469A (en) * 1985-10-25 1988-12-20 C. Uyemura & Co., Ltd. Electroless gold plating solution

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4337091A (en) * 1981-03-23 1982-06-29 Hooker Chemicals & Plastics Corp. Electroless gold plating
GB2114159B (en) * 1982-01-25 1986-02-12 Mine Safety Appliances Co Method and bath for the electroless plating of gold
US4832743A (en) * 1986-12-19 1989-05-23 Lamerie, N.V. Gold plating solutions, creams and baths
WO1994012686A1 (en) * 1992-11-25 1994-06-09 Kanto Kagaku Kabushiki Kaisha Electroless gold plating bath
US5318621A (en) * 1993-08-11 1994-06-07 Applied Electroless Concepts, Inc. Plating rate improvement for electroless silver and gold plating
US5635253A (en) * 1994-08-30 1997-06-03 International Business Machines Corporation Method of replenishing electroless gold plating baths

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4005229A (en) * 1975-06-23 1977-01-25 Ppg Industries, Inc. Novel method for the rapid deposition of gold films onto non-metallic substrates at ambient temperatures

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4792469A (en) * 1985-10-25 1988-12-20 C. Uyemura & Co., Ltd. Electroless gold plating solution

Also Published As

Publication number Publication date
DE2750932B2 (de) 1978-12-14
JPS5364624A (en) 1978-06-09
US4142902A (en) 1979-03-06
GB1547028A (en) 1979-06-06
JPS5620353B2 (de) 1981-05-13
DE2750932C3 (de) 1979-08-16

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Legal Events

Date Code Title Description
OAP Request for examination filed
OD Request for examination
C3 Grant after two publication steps (3rd publication)
8339 Ceased/non-payment of the annual fee