JPS5364624A - Electrodeless gold plating bath - Google Patents
Electrodeless gold plating bathInfo
- Publication number
- JPS5364624A JPS5364624A JP13678477A JP13678477A JPS5364624A JP S5364624 A JPS5364624 A JP S5364624A JP 13678477 A JP13678477 A JP 13678477A JP 13678477 A JP13678477 A JP 13678477A JP S5364624 A JPS5364624 A JP S5364624A
- Authority
- JP
- Japan
- Prior art keywords
- plating bath
- gold plating
- electrodeless
- electrodeless gold
- bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title 1
- 239000010931 gold Substances 0.000 title 1
- 229910052737 gold Inorganic materials 0.000 title 1
- 238000007747 plating Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US74322076A | 1976-11-19 | 1976-11-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5364624A true JPS5364624A (en) | 1978-06-09 |
JPS5620353B2 JPS5620353B2 (ja) | 1981-05-13 |
Family
ID=24987968
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13678477A Granted JPS5364624A (en) | 1976-11-19 | 1977-11-16 | Electrodeless gold plating bath |
Country Status (4)
Country | Link |
---|---|
US (1) | US4142902A (ja) |
JP (1) | JPS5364624A (ja) |
DE (1) | DE2750932C3 (ja) |
GB (1) | GB1547028A (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4337091A (en) * | 1981-03-23 | 1982-06-29 | Hooker Chemicals & Plastics Corp. | Electroless gold plating |
GB2114159B (en) * | 1982-01-25 | 1986-02-12 | Mine Safety Appliances Co | Method and bath for the electroless plating of gold |
JPS6299477A (ja) * | 1985-10-25 | 1987-05-08 | C Uyemura & Co Ltd | 無電解金めつき液 |
US4832743A (en) * | 1986-12-19 | 1989-05-23 | Lamerie, N.V. | Gold plating solutions, creams and baths |
WO1994012686A1 (en) * | 1992-11-25 | 1994-06-09 | Kanto Kagaku Kabushiki Kaisha | Electroless gold plating bath |
US5318621A (en) * | 1993-08-11 | 1994-06-07 | Applied Electroless Concepts, Inc. | Plating rate improvement for electroless silver and gold plating |
US5635253A (en) * | 1994-08-30 | 1997-06-03 | International Business Machines Corporation | Method of replenishing electroless gold plating baths |
GB2593660A (en) | 2019-10-31 | 2021-10-06 | Armadillo Metal Coatings Ltd | Metallic coated substrates |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4005229A (en) * | 1975-06-23 | 1977-01-25 | Ppg Industries, Inc. | Novel method for the rapid deposition of gold films onto non-metallic substrates at ambient temperatures |
-
1977
- 1977-11-11 GB GB47077/77A patent/GB1547028A/en not_active Expired
- 1977-11-15 DE DE2750932A patent/DE2750932C3/de not_active Expired
- 1977-11-16 JP JP13678477A patent/JPS5364624A/ja active Granted
-
1978
- 1978-01-09 US US05/867,702 patent/US4142902A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US4142902A (en) | 1979-03-06 |
DE2750932A1 (de) | 1978-05-24 |
JPS5620353B2 (ja) | 1981-05-13 |
GB1547028A (en) | 1979-06-06 |
DE2750932C3 (de) | 1979-08-16 |
DE2750932B2 (de) | 1978-12-14 |
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