DE1246898B - Verfahren zum Herstellen eines metallischen duennen Gitters fuer elektronische Festkoerperbauelemente - Google Patents

Verfahren zum Herstellen eines metallischen duennen Gitters fuer elektronische Festkoerperbauelemente

Info

Publication number
DE1246898B
DE1246898B DEJ23809A DEJ0023809A DE1246898B DE 1246898 B DE1246898 B DE 1246898B DE J23809 A DEJ23809 A DE J23809A DE J0023809 A DEJ0023809 A DE J0023809A DE 1246898 B DE1246898 B DE 1246898B
Authority
DE
Germany
Prior art keywords
polystyrene
layer
metallic
spheres
methyl alcohol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DEJ23809A
Other languages
German (de)
English (en)
Inventor
Rudolf Eduar Thun
Edward Stanley Wajda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE1246898B publication Critical patent/DE1246898B/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J19/00—Details of vacuum tubes of the types covered by group H01J21/00
    • H01J19/28—Non-electron-emitting electrodes; Screens
    • H01J19/30—Non-electron-emitting electrodes; Screens characterised by the material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2893/00—Discharge tubes and lamps
    • H01J2893/0001—Electrodes and electrode systems suitable for discharge tubes or lamps
    • H01J2893/0012—Constructional arrangements
    • H01J2893/0019—Chemical composition and manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Bipolar Transistors (AREA)
  • Insulating Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Cold Cathode And The Manufacture (AREA)
DEJ23809A 1962-06-01 1963-06-01 Verfahren zum Herstellen eines metallischen duennen Gitters fuer elektronische Festkoerperbauelemente Pending DE1246898B (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US19944962A 1962-06-01 1962-06-01
US199450A US3202543A (en) 1962-06-01 1962-06-01 Method of forming a thin film grid

Publications (1)

Publication Number Publication Date
DE1246898B true DE1246898B (de) 1967-08-10

Family

ID=26894786

Family Applications (2)

Application Number Title Priority Date Filing Date
DEJ23809A Pending DE1246898B (de) 1962-06-01 1963-06-01 Verfahren zum Herstellen eines metallischen duennen Gitters fuer elektronische Festkoerperbauelemente
DEJ23808A Withdrawn DE1244310B (de) 1962-06-01 1963-06-01 Elektrisch verstaerkendes Bauelement mit duennen isolierenden Festkoerperschichten

Family Applications After (1)

Application Number Title Priority Date Filing Date
DEJ23808A Withdrawn DE1244310B (de) 1962-06-01 1963-06-01 Elektrisch verstaerkendes Bauelement mit duennen isolierenden Festkoerperschichten

Country Status (9)

Country Link
US (1) US3202543A (enExample)
BE (1) BE633151A (enExample)
CH (2) CH413114A (enExample)
DE (2) DE1246898B (enExample)
DK (1) DK126462B (enExample)
FR (2) FR1357559A (enExample)
GB (1) GB994241A (enExample)
NL (1) NL293391A (enExample)
SE (1) SE321990B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4022928A (en) * 1975-05-22 1977-05-10 Piwcyzk Bernhard P Vacuum deposition methods and masking structure
SU1005223A1 (ru) * 1980-05-16 1983-03-15 Ордена Трудового Красного Знамени Институт Радиотехники И Электроники Ан Ссср Полупроводниковое запоминающее устройство
US4978558A (en) * 1988-06-10 1990-12-18 United Technologies Corporation Method for applying diffusion coating masks
DE10006738C2 (de) * 2000-02-15 2002-01-17 Osram Opto Semiconductors Gmbh Lichtemittierendes Bauelement mit verbesserter Lichtauskopplung und Verfahren zu seiner Herstellung
WO2001061765A1 (de) * 2000-02-15 2001-08-23 Osram Opto Semiconductors Gmbh Strahlungsemittierendes halbleiterbauelement und verfahren zu dessen herstellung
DE20111659U1 (de) * 2000-05-23 2001-12-13 OSRAM Opto Semiconductors GmbH & Co. oHG, 93049 Regensburg Bauelement für die Optoelektronik
KR100831843B1 (ko) * 2006-11-07 2008-05-22 주식회사 실트론 금속층 위에 성장된 화합물 반도체 기판, 그 제조 방법 및이를 이용한 화합물 반도체 소자
EP2177644A1 (en) 2008-10-14 2010-04-21 Applied Materials, Inc. Coating of masked substrates
CN110981479B (zh) * 2020-01-10 2022-03-01 陕西科技大学 一种高击穿的铁电陶瓷及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB500344A (en) * 1937-09-22 1939-02-07 British Thomson Houston Co Ltd Improvements in and relating to dry surface-contact electric rectifiers
GB500342A (en) * 1937-09-18 1939-02-07 British Thomson Houston Co Ltd Improvements relating to dry surface-contact electric rectifiers
CH307776A (de) * 1952-01-08 1955-06-15 Ericsson Telefon Ab L M Kontaktvorrichtung an einem Halbleiterelement.

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2815462A (en) * 1953-05-19 1957-12-03 Electronique Sa Soc Gen Method of forming a film supported a short distance from a surface and cathode-ray tube incorporating such film
US2906637A (en) * 1953-05-19 1959-09-29 Electronique Soc Gen Method of forming a film a short distance from a surface
FR1266933A (fr) * 1959-09-09 1961-07-17 Ass Elect Ind Perfectionnements aux dispositifs à semi-conducteurs

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB500342A (en) * 1937-09-18 1939-02-07 British Thomson Houston Co Ltd Improvements relating to dry surface-contact electric rectifiers
GB500344A (en) * 1937-09-22 1939-02-07 British Thomson Houston Co Ltd Improvements in and relating to dry surface-contact electric rectifiers
CH307776A (de) * 1952-01-08 1955-06-15 Ericsson Telefon Ab L M Kontaktvorrichtung an einem Halbleiterelement.

Also Published As

Publication number Publication date
CH413114A (de) 1966-05-15
CH415861A (de) 1966-06-30
US3202543A (en) 1965-08-24
FR1357558A (fr) 1964-04-03
DE1244310B (de) 1967-07-13
NL293391A (enExample)
BE633151A (enExample)
GB994241A (en) 1965-06-02
FR1357559A (fr) 1964-04-03
DK126462B (da) 1973-07-16
SE321990B (enExample) 1970-03-23

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