DE1239159B - Bad und Verfahren zum galvanischen Abscheiden von Palladiumueberzuegen - Google Patents
Bad und Verfahren zum galvanischen Abscheiden von PalladiumueberzuegenInfo
- Publication number
- DE1239159B DE1239159B DEJ28310A DEJ0028310A DE1239159B DE 1239159 B DE1239159 B DE 1239159B DE J28310 A DEJ28310 A DE J28310A DE J0028310 A DEJ0028310 A DE J0028310A DE 1239159 B DE1239159 B DE 1239159B
- Authority
- DE
- Germany
- Prior art keywords
- palladium
- bath
- ammonium
- temperature
- coatings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical group [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 title claims description 97
- 229910052763 palladium Inorganic materials 0.000 title claims description 35
- 238000000576 coating method Methods 0.000 title claims description 22
- 238000000034 method Methods 0.000 title claims description 4
- 230000008021 deposition Effects 0.000 title claims description 3
- VZTDIZULWFCMLS-UHFFFAOYSA-N ammonium formate Chemical compound [NH4+].[O-]C=O VZTDIZULWFCMLS-UHFFFAOYSA-N 0.000 claims description 8
- 150000002941 palladium compounds Chemical class 0.000 claims description 8
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 7
- 150000003863 ammonium salts Chemical class 0.000 claims description 7
- VBIXEXWLHSRNKB-UHFFFAOYSA-N ammonium oxalate Chemical compound [NH4+].[NH4+].[O-]C(=O)C([O-])=O VBIXEXWLHSRNKB-UHFFFAOYSA-N 0.000 claims description 5
- YWYZEGXAUVWDED-UHFFFAOYSA-N triammonium citrate Chemical compound [NH4+].[NH4+].[NH4+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O YWYZEGXAUVWDED-UHFFFAOYSA-N 0.000 claims description 5
- NGPGDYLVALNKEG-UHFFFAOYSA-N azanium;azane;2,3,4-trihydroxy-4-oxobutanoate Chemical group [NH4+].[NH4+].[O-]C(=O)C(O)C(O)C([O-])=O NGPGDYLVALNKEG-UHFFFAOYSA-N 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- 150000007524 organic acids Chemical class 0.000 claims description 4
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 claims description 3
- 239000012670 alkaline solution Substances 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims description 2
- 238000004070 electrodeposition Methods 0.000 claims description 2
- 230000007935 neutral effect Effects 0.000 claims description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 24
- 229910021529 ammonia Inorganic materials 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 10
- 238000009713 electroplating Methods 0.000 description 9
- 229960001484 edetic acid Drugs 0.000 description 6
- 150000003839 salts Chemical class 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 150000002940 palladium Chemical class 0.000 description 2
- YJVFFLUZDVXJQI-UHFFFAOYSA-L palladium(ii) acetate Chemical compound [Pd+2].CC([O-])=O.CC([O-])=O YJVFFLUZDVXJQI-UHFFFAOYSA-L 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- USFZMSVCRYTOJT-UHFFFAOYSA-N Ammonium acetate Chemical compound N.CC(O)=O USFZMSVCRYTOJT-UHFFFAOYSA-N 0.000 description 1
- 239000005695 Ammonium acetate Substances 0.000 description 1
- GEHMBYLTCISYNY-UHFFFAOYSA-N Ammonium sulfamate Chemical compound [NH4+].NS([O-])(=O)=O GEHMBYLTCISYNY-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- 241001072332 Monia Species 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229940043376 ammonium acetate Drugs 0.000 description 1
- 235000019257 ammonium acetate Nutrition 0.000 description 1
- -1 ammonium ions Chemical class 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
- C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB24457/64A GB1035850A (en) | 1964-06-12 | 1964-06-12 | Improvements in and relating to the electrodeposition of palladium |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE1239159B true DE1239159B (de) | 1967-04-20 |
Family
ID=10212010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DEJ28310A Pending DE1239159B (de) | 1964-06-12 | 1965-06-09 | Bad und Verfahren zum galvanischen Abscheiden von Palladiumueberzuegen |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3530050A (fr) |
| DE (1) | DE1239159B (fr) |
| FR (1) | FR1436451A (fr) |
| GB (1) | GB1035850A (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3400139A1 (de) * | 1983-01-07 | 1984-07-12 | Omi International Corp., Warren, Mich. | Galvanisches bad fuer die schnellabscheidung von palladium und ein verfahren zur galvanischen schnellabscheidung von palladium |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH597372A5 (fr) * | 1976-06-28 | 1978-03-31 | Systemes Traitements Surfaces | |
| CA1089796A (fr) * | 1976-11-17 | 1980-11-18 | Thomas F. Davis | Palladium pour electro-deposition |
| US4092225A (en) * | 1976-11-17 | 1978-05-30 | Amp Incorporated | High efficiency palladium electroplating process, bath and composition therefor |
| US4328286A (en) * | 1979-04-26 | 1982-05-04 | The International Nickel Co., Inc. | Electrodeposited palladium, method of preparation and electrical contact made thereby |
| US4392921A (en) * | 1980-12-17 | 1983-07-12 | Occidental Chemical Corporation | Composition and process for electroplating white palladium |
| SE8106693L (sv) * | 1980-12-17 | 1982-06-18 | Hooker Chemicals Plastics Corp | Elektropleteringsbad innehallande palladium |
| GB2171721B (en) * | 1985-01-25 | 1989-06-07 | Omi Int Corp | Palladium and palladium alloy plating |
| US4778574A (en) * | 1987-09-14 | 1988-10-18 | American Chemical & Refining Company, Inc. | Amine-containing bath for electroplating palladium |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE371542A (fr) * | 1929-07-02 | |||
| GB367587A (en) * | 1931-03-12 | 1932-02-25 | Alan Richard Powell | Improvements in or relating to the electro-deposition of palladium |
| GB367588A (en) * | 1931-03-12 | 1932-02-25 | Alan Richard Powell | Improvements in or relating to the electrodeposition of the metals of the platinum group |
| US2057475A (en) * | 1931-03-31 | 1936-10-13 | Baker & Co Inc | Electrodeposition of rhodium |
| DE564088C (de) * | 1931-11-08 | 1932-11-14 | Heraeus Gmbh W C | Verfahren zur Erzeugung elektrolytischer Niederschlaege von Metallen der Platingruppe |
| US2773818A (en) * | 1954-05-20 | 1956-12-11 | Harshaw Chem Corp | Alkaline nickel plating solution |
| US2915406A (en) * | 1958-03-03 | 1959-12-01 | Int Nickel Co | Palladium plating by chemical reduction |
| US3235392A (en) * | 1960-10-11 | 1966-02-15 | Automatic Telephone & Elect | Electroless deposition of palladium |
| US3130072A (en) * | 1961-09-22 | 1964-04-21 | Sel Rex Corp | Silver-palladium immersion plating composition and process |
| US3264199A (en) * | 1962-06-25 | 1966-08-02 | Ford Motor Co | Electroless plating of metals |
| GB965859A (en) * | 1962-07-05 | 1964-08-06 | Johnson Matthey Co Ltd | Improvements in and relating to the deposition of palladium |
| US3274022A (en) * | 1963-03-26 | 1966-09-20 | Int Nickel Co | Palladium deposition |
| US3303111A (en) * | 1963-08-12 | 1967-02-07 | Arthur L Peach | Electro-electroless plating method |
| US3290234A (en) * | 1963-10-29 | 1966-12-06 | Technic | Electrodeposition of palladium |
| CA791112A (en) * | 1964-06-30 | 1968-07-30 | J. Kahan George | Catalytically active palladium coatings |
-
1964
- 1964-06-12 GB GB24457/64A patent/GB1035850A/en not_active Expired
-
1965
- 1965-06-08 US US462433A patent/US3530050A/en not_active Expired - Lifetime
- 1965-06-09 DE DEJ28310A patent/DE1239159B/de active Pending
- 1965-06-09 FR FR20109A patent/FR1436451A/fr not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3400139A1 (de) * | 1983-01-07 | 1984-07-12 | Omi International Corp., Warren, Mich. | Galvanisches bad fuer die schnellabscheidung von palladium und ein verfahren zur galvanischen schnellabscheidung von palladium |
Also Published As
| Publication number | Publication date |
|---|---|
| GB1035850A (en) | 1966-07-13 |
| FR1436451A (fr) | 1966-04-22 |
| US3530050A (en) | 1970-09-22 |
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