FR1436451A - Nouveau bain pour dépôt électrolytique de palladium - Google Patents

Nouveau bain pour dépôt électrolytique de palladium

Info

Publication number
FR1436451A
FR1436451A FR20109A FR20109A FR1436451A FR 1436451 A FR1436451 A FR 1436451A FR 20109 A FR20109 A FR 20109A FR 20109 A FR20109 A FR 20109A FR 1436451 A FR1436451 A FR 1436451A
Authority
FR
France
Prior art keywords
new bath
electroplating palladium
electroplating
palladium
bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR20109A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Johnson Matthey PLC
Original Assignee
Johnson Matthey PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnson Matthey PLC filed Critical Johnson Matthey PLC
Application granted granted Critical
Publication of FR1436451A publication Critical patent/FR1436451A/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)
FR20109A 1964-06-12 1965-06-09 Nouveau bain pour dépôt électrolytique de palladium Expired FR1436451A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB24457/64A GB1035850A (en) 1964-06-12 1964-06-12 Improvements in and relating to the electrodeposition of palladium

Publications (1)

Publication Number Publication Date
FR1436451A true FR1436451A (fr) 1966-04-22

Family

ID=10212010

Family Applications (1)

Application Number Title Priority Date Filing Date
FR20109A Expired FR1436451A (fr) 1964-06-12 1965-06-09 Nouveau bain pour dépôt électrolytique de palladium

Country Status (4)

Country Link
US (1) US3530050A (fr)
DE (1) DE1239159B (fr)
FR (1) FR1436451A (fr)
GB (1) GB1035850A (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH597372A5 (fr) * 1976-06-28 1978-03-31 Systemes Traitements Surfaces
US4092225A (en) * 1976-11-17 1978-05-30 Amp Incorporated High efficiency palladium electroplating process, bath and composition therefor
CA1089796A (fr) * 1976-11-17 1980-11-18 Thomas F. Davis Palladium pour electro-deposition
US4328286A (en) * 1979-04-26 1982-05-04 The International Nickel Co., Inc. Electrodeposited palladium, method of preparation and electrical contact made thereby
SE8106693L (sv) * 1980-12-17 1982-06-18 Hooker Chemicals Plastics Corp Elektropleteringsbad innehallande palladium
US4392921A (en) * 1980-12-17 1983-07-12 Occidental Chemical Corporation Composition and process for electroplating white palladium
FR2539145B1 (fr) * 1983-01-07 1986-08-29 Omi Int Corp Procede pour former a grande vitesse, par electrolyse, une couche de revetement en palladium sur un substrat et bain pour la mise en oeuvre de ce procede
GB2171721B (en) * 1985-01-25 1989-06-07 Omi Int Corp Palladium and palladium alloy plating
US4778574A (en) * 1987-09-14 1988-10-18 American Chemical & Refining Company, Inc. Amine-containing bath for electroplating palladium

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE371542A (fr) * 1929-07-02
GB367587A (en) * 1931-03-12 1932-02-25 Alan Richard Powell Improvements in or relating to the electro-deposition of palladium
GB367588A (en) * 1931-03-12 1932-02-25 Alan Richard Powell Improvements in or relating to the electrodeposition of the metals of the platinum group
US2057475A (en) * 1931-03-31 1936-10-13 Baker & Co Inc Electrodeposition of rhodium
DE564088C (de) * 1931-11-08 1932-11-14 Heraeus Gmbh W C Verfahren zur Erzeugung elektrolytischer Niederschlaege von Metallen der Platingruppe
US2773818A (en) * 1954-05-20 1956-12-11 Harshaw Chem Corp Alkaline nickel plating solution
US2915406A (en) * 1958-03-03 1959-12-01 Int Nickel Co Palladium plating by chemical reduction
US3235392A (en) * 1960-10-11 1966-02-15 Automatic Telephone & Elect Electroless deposition of palladium
US3130072A (en) * 1961-09-22 1964-04-21 Sel Rex Corp Silver-palladium immersion plating composition and process
US3264199A (en) * 1962-06-25 1966-08-02 Ford Motor Co Electroless plating of metals
GB965859A (en) * 1962-07-05 1964-08-06 Johnson Matthey Co Ltd Improvements in and relating to the deposition of palladium
US3274022A (en) * 1963-03-26 1966-09-20 Int Nickel Co Palladium deposition
US3303111A (en) * 1963-08-12 1967-02-07 Arthur L Peach Electro-electroless plating method
US3290234A (en) * 1963-10-29 1966-12-06 Technic Electrodeposition of palladium
CA791112A (en) * 1964-06-30 1968-07-30 J. Kahan George Catalytically active palladium coatings

Also Published As

Publication number Publication date
DE1239159B (de) 1967-04-20
US3530050A (en) 1970-09-22
GB1035850A (en) 1966-07-13

Similar Documents

Publication Publication Date Title
FR1402776A (fr) élévateur pour le bain
BE805484Q (fr) Additif pour bain
FR1436451A (fr) Nouveau bain pour dépôt électrolytique de palladium
AT289310B (de) Stranggießverfahren
CH441925A (de) Stromlose Plattierung
FR1546176A (fr) Nouvel additif pour bain d'étamage halogéné
FR1491729A (fr) Dispositif pour bain de vapeur
FR1365970A (fr) Bain de galvanoplastie
CH458874A (fr) Bain pour le dépôt non électrolytique de cuivre
FR1392440A (fr) Presse-séchoir pour blanchisseries
CH438874A (fr) Bain de nickelage électrolytique
FR1424042A (fr) Solution pour le dépôt électrolytique de nickel
CH428370A (de) Elektroplattierungsapparat
CH464638A (de) Zusatz für saueres Verkupferungsbad
FR1380297A (fr) Bain pour la galvanoplastie des métaux
FR1395008A (fr) Cuve de traitement, notamment pour le chromage électrolytique
FR1446908A (fr) Solutions galvanoplastiques pour le dépôt du zinc
CH491206A (de) Badlösung zum stromlosen Abscheiden von Metallschichten
CH472505A (fr) Bain de nickelage
FR1468584A (fr) Bain stabilisé pour cuivrage chimique
CH384322A (fr) Installation pour la galvanoplastie
FR1439012A (fr) Huiles pour bain
FR1420603A (fr) Disposition de repose-pieds pour télésiège
FR1436924A (fr) Bain et procédé pour le dépôt électrolytique du nickel
FR1475377A (fr) Additifs pour bains de dépôt électrolytique