DE1187098B - Verfahren zum Herstellen von Koerpern aus hochgereinigtem Halbleitermaterial - Google Patents
Verfahren zum Herstellen von Koerpern aus hochgereinigtem HalbleitermaterialInfo
- Publication number
 - DE1187098B DE1187098B DES58239A DES0058239A DE1187098B DE 1187098 B DE1187098 B DE 1187098B DE S58239 A DES58239 A DE S58239A DE S0058239 A DES0058239 A DE S0058239A DE 1187098 B DE1187098 B DE 1187098B
 - Authority
 - DE
 - Germany
 - Prior art keywords
 - rod
 - molar ratio
 - reaction
 - silicon
 - semiconductor material
 - Prior art date
 - Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
 - Pending
 
Links
Classifications
- 
        
- C—CHEMISTRY; METALLURGY
 - C30—CRYSTAL GROWTH
 - C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
 - C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
 - C30B29/02—Elements
 - C30B29/06—Silicon
 
 - 
        
- C—CHEMISTRY; METALLURGY
 - C01—INORGANIC CHEMISTRY
 - C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
 - C01B33/00—Silicon; Compounds thereof
 - C01B33/02—Silicon
 - C01B33/021—Preparation
 - C01B33/027—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material
 - C01B33/035—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material by decomposition or reduction of gaseous or vaporised silicon compounds in the presence of heated filaments of silicon, carbon or a refractory metal, e.g. tantalum or tungsten, or in the presence of heated silicon rods on which the formed silicon is deposited, a silicon rod being obtained, e.g. Siemens process
 
 - 
        
- C—CHEMISTRY; METALLURGY
 - C30—CRYSTAL GROWTH
 - C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
 - C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
 - C30B25/02—Epitaxial-layer growth
 
 - 
        
- H—ELECTRICITY
 - H01—ELECTRIC ELEMENTS
 - H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
 - H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
 
 - 
        
- H—ELECTRICITY
 - H01—ELECTRIC ELEMENTS
 - H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
 - H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
 - H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
 - H01L21/02104—Forming layers
 - H01L21/02365—Forming inorganic semiconducting materials on a substrate
 - H01L21/02518—Deposited layers
 - H01L21/02521—Materials
 - H01L21/02524—Group 14 semiconducting materials
 - H01L21/02529—Silicon carbide
 
 - 
        
- H—ELECTRICITY
 - H01—ELECTRIC ELEMENTS
 - H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
 - H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
 - H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
 - H01L21/02104—Forming layers
 - H01L21/02365—Forming inorganic semiconducting materials on a substrate
 - H01L21/02518—Deposited layers
 - H01L21/02521—Materials
 - H01L21/02524—Group 14 semiconducting materials
 - H01L21/02532—Silicon, silicon germanium, germanium
 
 - 
        
- H—ELECTRICITY
 - H01—ELECTRIC ELEMENTS
 - H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
 - H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
 - H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
 - H01L21/02104—Forming layers
 - H01L21/02365—Forming inorganic semiconducting materials on a substrate
 - H01L21/02612—Formation types
 - H01L21/02617—Deposition types
 - H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
 
 - 
        
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
 - Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
 - Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
 - Y10S148/00—Metal treatment
 - Y10S148/148—Silicon carbide
 
 
Landscapes
- Engineering & Computer Science (AREA)
 - Chemical & Material Sciences (AREA)
 - Manufacturing & Machinery (AREA)
 - Organic Chemistry (AREA)
 - Physics & Mathematics (AREA)
 - Computer Hardware Design (AREA)
 - Microelectronics & Electronic Packaging (AREA)
 - Power Engineering (AREA)
 - Condensed Matter Physics & Semiconductors (AREA)
 - General Physics & Mathematics (AREA)
 - Materials Engineering (AREA)
 - Metallurgy (AREA)
 - Crystallography & Structural Chemistry (AREA)
 - Chemical Kinetics & Catalysis (AREA)
 - General Chemical & Material Sciences (AREA)
 - Inorganic Chemistry (AREA)
 - Silicon Compounds (AREA)
 - Crystals, And After-Treatments Of Crystals (AREA)
 
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| NL236697D NL236697A (enEXAMPLES) | 1958-05-16 | ||
| NL123477D NL123477C (enEXAMPLES) | 1958-05-16 | ||
| BE578542D BE578542A (enEXAMPLES) | 1958-05-16 | ||
| DES58239A DE1187098B (de) | 1958-05-16 | 1958-05-16 | Verfahren zum Herstellen von Koerpern aus hochgereinigtem Halbleitermaterial | 
| CH7297759A CH416576A (de) | 1958-05-16 | 1959-05-06 | Verfahren zum Herstellen von Körpern aus hochgereinigtem Halbleitermaterial | 
| GB16748/59A GB914042A (en) | 1958-05-16 | 1959-05-15 | Improvements in or relating to a process for the surface treatment of semi-conductormaterial | 
| FR794798A FR1224562A (fr) | 1958-05-16 | 1959-05-15 | Procédé pour le traitement de surface de corps constitués par un matériau semi-conducteur de grande pureté | 
| US281857A US3171755A (en) | 1958-05-16 | 1963-05-09 | Surface treatment of high-purity semiconductor bodies | 
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| DES58239A DE1187098B (de) | 1958-05-16 | 1958-05-16 | Verfahren zum Herstellen von Koerpern aus hochgereinigtem Halbleitermaterial | 
Publications (1)
| Publication Number | Publication Date | 
|---|---|
| DE1187098B true DE1187098B (de) | 1965-02-11 | 
Family
ID=7492407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| DES58239A Pending DE1187098B (de) | 1958-05-16 | 1958-05-16 | Verfahren zum Herstellen von Koerpern aus hochgereinigtem Halbleitermaterial | 
Country Status (7)
| Country | Link | 
|---|---|
| US (1) | US3171755A (enEXAMPLES) | 
| BE (1) | BE578542A (enEXAMPLES) | 
| CH (1) | CH416576A (enEXAMPLES) | 
| DE (1) | DE1187098B (enEXAMPLES) | 
| FR (1) | FR1224562A (enEXAMPLES) | 
| GB (1) | GB914042A (enEXAMPLES) | 
| NL (2) | NL123477C (enEXAMPLES) | 
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| DE202010002486U1 (de) | 2009-03-31 | 2010-06-10 | Centrotherm Sitec Gmbh | Spann- und Kontaktierungsvorrichtung für Silizium-Dünnstäbe | 
| DE102009015196A1 (de) | 2009-03-31 | 2010-10-14 | Centrotherm Sitec Gmbh | Spann-und Kontaktierungsvorrichtung für Silizium-Dünnstäbe | 
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| US3279946A (en) * | 1962-08-14 | 1966-10-18 | Merck & Co Inc | Hydrogen chloride treatment of semiconductor coating chamber | 
| NL294648A (enEXAMPLES) * | 1962-08-31 | |||
| US3232803A (en) * | 1963-04-16 | 1966-02-01 | North American Aviation Inc | Chemical etching of tungsten | 
| US3367303A (en) * | 1963-05-29 | 1968-02-06 | Monsanto Co | Chemical equipment | 
| DE1290925B (de) * | 1963-06-10 | 1969-03-20 | Philips Nv | Verfahren zum Abscheiden von Silicium auf einem Halbleiterkoerper | 
| US3310426A (en) * | 1963-10-02 | 1967-03-21 | Siemens Ag | Method and apparatus for producing semiconductor material | 
| US3447506A (en) * | 1965-07-19 | 1969-06-03 | Mbt Corp | Vapor-coating apparatus | 
| US3522118A (en) * | 1965-08-17 | 1970-07-28 | Motorola Inc | Gas phase etching | 
| US3540871A (en) * | 1967-12-15 | 1970-11-17 | Texas Instruments Inc | Method for maintaining the uniformity of vapor grown polycrystalline silicon | 
| US4089735A (en) * | 1968-06-05 | 1978-05-16 | Siemens Aktiengesellschaft | Method for epitactic precipitation of crystalline material from a gaseous phase, particularly for semiconductors | 
| US3649260A (en) * | 1970-02-27 | 1972-03-14 | Sylvania Electric Prod | Process for making refractory metal material | 
| US3980042A (en) * | 1972-03-21 | 1976-09-14 | Siemens Aktiengesellschaft | Vapor deposition apparatus with computer control | 
| BE806098A (fr) * | 1973-03-28 | 1974-02-01 | Siemens Ag | Procede de fabrication de silicium ou autre matiere semi-conductrice tres pure | 
| DE2364989C3 (de) * | 1973-12-28 | 1979-10-18 | Consortium Fuer Elektrochemische Industrie Gmbh, 8000 Muenchen | Verfahren zur Herstellung von Schichten aus Siliciumcarbid auf einem Siliciumsubstrat | 
| DE2753567C3 (de) * | 1977-12-01 | 1982-04-15 | Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen | Verfahren zur Herstellung von hochreinen Halbleitermaterialien und Reinstmetallen | 
| JPS592318A (ja) * | 1982-06-28 | 1984-01-07 | Toshiba Mach Co Ltd | 半導体気相成長装置 | 
| US5259883A (en) * | 1988-02-16 | 1993-11-09 | Kabushiki Kaisha Toshiba | Method of thermally processing semiconductor wafers and an apparatus therefor | 
| KR101811872B1 (ko) | 2007-09-20 | 2017-12-22 | 미츠비시 마테리알 가부시키가이샤 | 다결정 실리콘 반응로 및 다결정 실리콘의 제조 방법 | 
| RU2357024C1 (ru) * | 2008-03-20 | 2009-05-27 | Федеральное государственное унитарное предприятие "Горно-химический комбинат" | Установка для получения стержней поликристаллического кремния | 
| KR100892123B1 (ko) * | 2008-12-31 | 2009-04-09 | (주)세미머티리얼즈 | 폴리 실리콘 증착장치 | 
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| DE865160C (de) * | 1951-03-07 | 1953-01-29 | Western Electric Co | Verfahren zur Erzeugung einer Germaniumschicht auf einem Germaniumkoerper | 
| DE943422C (de) * | 1949-04-02 | 1956-05-17 | Licentia Gmbh | Gesteuerter Trockengleichrichter, insbesondere mit Germanium, Silizium oder Siliziumkarbid als halbleitender Substanz | 
| FR1125207A (fr) * | 1954-05-18 | 1956-10-26 | Siemens Ag | Procédé de préparation de substances très pures de préférence pour emploi comme semi-conducteurs, dispositif pour sa réalisation et produits conformes à ceux obtenus | 
| DE966879C (de) * | 1953-02-21 | 1957-09-12 | Standard Elektrik Ag | Verfahren zur Reinigung und/oder Abtragung von Halbleitermaterial, insbesondere von Germanium- und Siliziumsubstanz | 
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| DE1029941B (de) * | 1955-07-13 | 1958-05-14 | Siemens Ag | Verfahren zur Herstellung von einkristallinen Halbleiterschichten | 
| US2840489A (en) * | 1956-01-17 | 1958-06-24 | Owens Illinois Glass Co | Process for the controlled deposition of silicon dihalide vapors onto selected surfaces | 
| DE1061593B (de) * | 1956-06-25 | 1959-07-16 | Siemens Ag | Vorrichtung zur Gewinnung reinsten Halbleitermaterials fuer elektrotechnische Zwecke | 
| US2841477A (en) * | 1957-03-04 | 1958-07-01 | Pacific Semiconductors Inc | Photochemically activated gaseous etching method | 
- 
        0
        
- NL NL236697D patent/NL236697A/xx unknown
 - BE BE578542D patent/BE578542A/xx unknown
 - NL NL123477D patent/NL123477C/xx active
 
 - 
        1958
        
- 1958-05-16 DE DES58239A patent/DE1187098B/de active Pending
 
 - 
        1959
        
- 1959-05-06 CH CH7297759A patent/CH416576A/de unknown
 - 1959-05-15 GB GB16748/59A patent/GB914042A/en not_active Expired
 - 1959-05-15 FR FR794798A patent/FR1224562A/fr not_active Expired
 
 - 
        1963
        
- 1963-05-09 US US281857A patent/US3171755A/en not_active Expired - Lifetime
 
 
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| DE943422C (de) * | 1949-04-02 | 1956-05-17 | Licentia Gmbh | Gesteuerter Trockengleichrichter, insbesondere mit Germanium, Silizium oder Siliziumkarbid als halbleitender Substanz | 
| DE865160C (de) * | 1951-03-07 | 1953-01-29 | Western Electric Co | Verfahren zur Erzeugung einer Germaniumschicht auf einem Germaniumkoerper | 
| DE966879C (de) * | 1953-02-21 | 1957-09-12 | Standard Elektrik Ag | Verfahren zur Reinigung und/oder Abtragung von Halbleitermaterial, insbesondere von Germanium- und Siliziumsubstanz | 
| FR1125207A (fr) * | 1954-05-18 | 1956-10-26 | Siemens Ag | Procédé de préparation de substances très pures de préférence pour emploi comme semi-conducteurs, dispositif pour sa réalisation et produits conformes à ceux obtenus | 
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| DE202010002486U1 (de) | 2009-03-31 | 2010-06-10 | Centrotherm Sitec Gmbh | Spann- und Kontaktierungsvorrichtung für Silizium-Dünnstäbe | 
| WO2010115542A1 (en) | 2009-03-31 | 2010-10-14 | Centrotherm Sitec Gmbh | Clamping and contacting device for thin silicon rods | 
| DE102009015196A1 (de) | 2009-03-31 | 2010-10-14 | Centrotherm Sitec Gmbh | Spann-und Kontaktierungsvorrichtung für Silizium-Dünnstäbe | 
| DE112010001773T5 (de) | 2009-03-31 | 2012-09-27 | Centrotherm Sitec Gmbh | Spann- und Kontaktierungsvorrichtung für Silizium-Dünnstäbe | 
Also Published As
| Publication number | Publication date | 
|---|---|
| FR1224562A (fr) | 1960-06-24 | 
| GB914042A (en) | 1962-12-28 | 
| NL236697A (enEXAMPLES) | |
| NL123477C (enEXAMPLES) | |
| US3171755A (en) | 1965-03-02 | 
| BE578542A (enEXAMPLES) | |
| CH416576A (de) | 1966-07-15 | 
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