FR1224562A - Procédé pour le traitement de surface de corps constitués par un matériau semi-conducteur de grande pureté - Google Patents

Procédé pour le traitement de surface de corps constitués par un matériau semi-conducteur de grande pureté

Info

Publication number
FR1224562A
FR1224562A FR794798A FR794798A FR1224562A FR 1224562 A FR1224562 A FR 1224562A FR 794798 A FR794798 A FR 794798A FR 794798 A FR794798 A FR 794798A FR 1224562 A FR1224562 A FR 1224562A
Authority
FR
France
Prior art keywords
surface treatment
semiconductor material
high purity
bodies made
purity semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR794798A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens AG
Original Assignee
Siemens Schuckertwerke AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens AG filed Critical Siemens Schuckertwerke AG
Application granted granted Critical
Publication of FR1224562A publication Critical patent/FR1224562A/fr
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02Elements
    • C30B29/06Silicon
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00Silicon; Compounds thereof
    • C01B33/02Silicon
    • C01B33/021Preparation
    • C01B33/027Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material
    • C01B33/035Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material by decomposition or reduction of gaseous or vaporised silicon compounds in the presence of heated filaments of silicon, carbon or a refractory metal, e.g. tantalum or tungsten, or in the presence of heated silicon rods on which the formed silicon is deposited, a silicon rod being obtained, e.g. Siemens process
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02524Group 14 semiconducting materials
    • H01L21/02529Silicon carbide
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02524Group 14 semiconducting materials
    • H01L21/02532Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/0262Reduction or decomposition of gaseous compounds, e.g. CVD
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/148Silicon carbide
FR794798A 1958-05-16 1959-05-15 Procédé pour le traitement de surface de corps constitués par un matériau semi-conducteur de grande pureté Expired FR1224562A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES58239A DE1187098B (de) 1958-05-16 1958-05-16 Verfahren zum Herstellen von Koerpern aus hochgereinigtem Halbleitermaterial

Publications (1)

Publication Number Publication Date
FR1224562A true FR1224562A (fr) 1960-06-24

Family

ID=7492407

Family Applications (1)

Application Number Title Priority Date Filing Date
FR794798A Expired FR1224562A (fr) 1958-05-16 1959-05-15 Procédé pour le traitement de surface de corps constitués par un matériau semi-conducteur de grande pureté

Country Status (7)

Country Link
US (1) US3171755A (fr)
BE (1) BE578542A (fr)
CH (1) CH416576A (fr)
DE (1) DE1187098B (fr)
FR (1) FR1224562A (fr)
GB (1) GB914042A (fr)
NL (2) NL236697A (fr)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3279946A (en) * 1962-08-14 1966-10-18 Merck & Co Inc Hydrogen chloride treatment of semiconductor coating chamber
NL294648A (fr) * 1962-08-31
US3232803A (en) * 1963-04-16 1966-02-01 North American Aviation Inc Chemical etching of tungsten
US3367303A (en) * 1963-05-29 1968-02-06 Monsanto Co Chemical equipment
DE1290925B (de) * 1963-06-10 1969-03-20 Philips Nv Verfahren zum Abscheiden von Silicium auf einem Halbleiterkoerper
US3310426A (en) * 1963-10-02 1967-03-21 Siemens Ag Method and apparatus for producing semiconductor material
US3447506A (en) * 1965-07-19 1969-06-03 Mbt Corp Vapor-coating apparatus
US3522118A (en) * 1965-08-17 1970-07-28 Motorola Inc Gas phase etching
US3540871A (en) * 1967-12-15 1970-11-17 Texas Instruments Inc Method for maintaining the uniformity of vapor grown polycrystalline silicon
US4089735A (en) * 1968-06-05 1978-05-16 Siemens Aktiengesellschaft Method for epitactic precipitation of crystalline material from a gaseous phase, particularly for semiconductors
US3649260A (en) * 1970-02-27 1972-03-14 Sylvania Electric Prod Process for making refractory metal material
US3980042A (en) * 1972-03-21 1976-09-14 Siemens Aktiengesellschaft Vapor deposition apparatus with computer control
BE806098A (fr) * 1973-03-28 1974-02-01 Siemens Ag Procede de fabrication de silicium ou autre matiere semi-conductrice tres pure
DE2364989C3 (de) * 1973-12-28 1979-10-18 Consortium Fuer Elektrochemische Industrie Gmbh, 8000 Muenchen Verfahren zur Herstellung von Schichten aus Siliciumcarbid auf einem Siliciumsubstrat
DE2753567C3 (de) * 1977-12-01 1982-04-15 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen Verfahren zur Herstellung von hochreinen Halbleitermaterialien und Reinstmetallen
JPS592318A (ja) * 1982-06-28 1984-01-07 Toshiba Mach Co Ltd 半導体気相成長装置
US5259883A (en) * 1988-02-16 1993-11-09 Kabushiki Kaisha Toshiba Method of thermally processing semiconductor wafers and an apparatus therefor
EP2039653B1 (fr) * 2007-09-20 2015-12-23 Mitsubishi Materials Corporation Réacteur pour silicium polycristallin et procédé de production de silicium polycristallin
KR100892123B1 (ko) * 2008-12-31 2009-04-09 (주)세미머티리얼즈 폴리 실리콘 증착장치
DE102009015196A1 (de) 2009-03-31 2010-10-14 Centrotherm Sitec Gmbh Spann-und Kontaktierungsvorrichtung für Silizium-Dünnstäbe
DE202010002486U1 (de) 2009-03-31 2010-06-10 Centrotherm Sitec Gmbh Spann- und Kontaktierungsvorrichtung für Silizium-Dünnstäbe

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE943422C (de) * 1949-04-02 1956-05-17 Licentia Gmbh Gesteuerter Trockengleichrichter, insbesondere mit Germanium, Silizium oder Siliziumkarbid als halbleitender Substanz
BE509317A (fr) * 1951-03-07 1900-01-01
DE966879C (de) * 1953-02-21 1957-09-12 Standard Elektrik Ag Verfahren zur Reinigung und/oder Abtragung von Halbleitermaterial, insbesondere von Germanium- und Siliziumsubstanz
NL218408A (fr) * 1954-05-18 1900-01-01
DE1029941B (de) * 1955-07-13 1958-05-14 Siemens Ag Verfahren zur Herstellung von einkristallinen Halbleiterschichten
US2840489A (en) * 1956-01-17 1958-06-24 Owens Illinois Glass Co Process for the controlled deposition of silicon dihalide vapors onto selected surfaces
DE1061593B (de) * 1956-06-25 1959-07-16 Siemens Ag Vorrichtung zur Gewinnung reinsten Halbleitermaterials fuer elektrotechnische Zwecke
US2841477A (en) * 1957-03-04 1958-07-01 Pacific Semiconductors Inc Photochemically activated gaseous etching method

Also Published As

Publication number Publication date
US3171755A (en) 1965-03-02
GB914042A (en) 1962-12-28
NL236697A (fr)
DE1187098B (de) 1965-02-11
BE578542A (fr)
NL123477C (fr)
CH416576A (de) 1966-07-15

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