FR1230860A - Procédé pour la fabrication de dispositifs semi-conducteurs - Google Patents

Procédé pour la fabrication de dispositifs semi-conducteurs

Info

Publication number
FR1230860A
FR1230860A FR800621A FR800621A FR1230860A FR 1230860 A FR1230860 A FR 1230860A FR 800621 A FR800621 A FR 800621A FR 800621 A FR800621 A FR 800621A FR 1230860 A FR1230860 A FR 1230860A
Authority
FR
France
Prior art keywords
semiconductor devices
manufacturing semiconductor
manufacturing
devices
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR800621A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Radio Corporation of America
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp, Radio Corporation of America filed Critical RCA Corp
Application granted granted Critical
Publication of FR1230860A publication Critical patent/FR1230860A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/028—Dicing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/051—Etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/106—Masks, special
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • ing And Chemical Polishing (AREA)
  • Weting (AREA)
  • Dicing (AREA)
FR800621A 1958-07-25 1959-07-21 Procédé pour la fabrication de dispositifs semi-conducteurs Expired FR1230860A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US751046A US3046176A (en) 1958-07-25 1958-07-25 Fabricating semiconductor devices

Publications (1)

Publication Number Publication Date
FR1230860A true FR1230860A (fr) 1960-09-20

Family

ID=25020244

Family Applications (1)

Application Number Title Priority Date Filing Date
FR800621A Expired FR1230860A (fr) 1958-07-25 1959-07-21 Procédé pour la fabrication de dispositifs semi-conducteurs

Country Status (5)

Country Link
US (1) US3046176A (fr)
DE (1) DE1092132B (fr)
FR (1) FR1230860A (fr)
GB (1) GB922583A (fr)
NL (2) NL241641A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2019285A1 (fr) * 1968-06-17 1970-07-03 Texas Instruments Inc

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL252383A (fr) * 1960-06-07
US3260634A (en) * 1961-02-17 1966-07-12 Motorola Inc Method of etching a semiconductor wafer to provide tapered dice
US3180751A (en) * 1961-05-26 1965-04-27 Bausch & Lomb Method of forming a composite article
US3226255A (en) * 1961-10-31 1965-12-28 Western Electric Co Masking method for semiconductor
US3245794A (en) * 1962-10-29 1966-04-12 Ihilco Corp Sequential registration scheme
GB1064290A (en) * 1963-01-14 1967-04-05 Motorola Inc Method of making semiconductor devices
US3165430A (en) * 1963-01-21 1965-01-12 Siliconix Inc Method of ultra-fine semiconductor manufacture
US3265546A (en) * 1963-04-01 1966-08-09 North American Aviation Inc Chemical drilling of circuit boards
NL294370A (fr) * 1963-06-20
US3288662A (en) * 1963-07-18 1966-11-29 Rca Corp Method of etching to dice a semiconductor slice
GB1065192A (en) * 1963-09-03 1967-04-12 Rosemount Eng Co Ltd Pressure gauge
US3349476A (en) * 1963-11-26 1967-10-31 Ibm Formation of large area contacts to semiconductor devices
US3319317A (en) * 1963-12-23 1967-05-16 Ibm Method of making a multilayered laminated circuit board
DE1221363B (de) * 1964-04-25 1966-07-21 Telefunken Patent Verfahren zum Verringern des Bahnwiderstands von Halbleiterbauelementen
US3274670A (en) * 1965-03-18 1966-09-27 Bell Telephone Labor Inc Semiconductor contact
US3421962A (en) * 1965-04-05 1969-01-14 Int Rectifier Corp Apparatus for dicing semiconductor wafers
DE1275646B (de) * 1965-05-10 1968-08-22 Siemens Ag Verfahren zur Herstellung einer thermoelektrischen Anordnung
US3418226A (en) * 1965-05-18 1968-12-24 Ibm Method of electrolytically etching a semiconductor having a single impurity gradient
US3447984A (en) * 1965-06-24 1969-06-03 Ibm Method for forming sharply defined apertures in an insulating layer
US3372071A (en) * 1965-06-30 1968-03-05 Texas Instruments Inc Method of forming a small area junction semiconductor
US3237272A (en) * 1965-07-06 1966-03-01 Motorola Inc Method of making semiconductor device
US3513022A (en) * 1967-04-26 1970-05-19 Rca Corp Method of fabricating semiconductor devices
GB1189582A (en) * 1967-07-26 1970-04-29 Licentia Gmbh Method of Dividing Semiconductor Wafers.
US3597839A (en) * 1969-03-10 1971-08-10 Bell Telephone Labor Inc Circuit interconnection method for microelectronic circuitry
US3772100A (en) * 1971-06-30 1973-11-13 Denki Onkyo Co Ltd Method for forming strips on semiconductor device
US4037306A (en) * 1975-10-02 1977-07-26 Motorola, Inc. Integrated circuit and method
US4451972A (en) * 1980-01-21 1984-06-05 National Semiconductor Corporation Method of making electronic chip with metalized back including a surface stratum of solder
JPS5784135A (en) * 1980-11-14 1982-05-26 Toshiba Corp Manufacture of semiconductor element
DE3211391A1 (de) * 1982-03-27 1983-09-29 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum herstellen einer halbleiteranordnung
JP2004168584A (ja) * 2002-11-19 2004-06-17 Thk Co Ltd ガラス基板材の切断方法
CN102921666B (zh) * 2012-11-21 2014-12-17 南京熊猫电子股份有限公司 消除电容式触摸屏蚀刻残留溶液的方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE467188A (fr) * 1939-05-26
US2321523A (en) * 1942-06-27 1943-06-08 Standard Telephones Cables Ltd Method of reclaiming selenium elements
US2536383A (en) * 1943-10-13 1951-01-02 Buckbee Mears Co Process for making reticles and other precision articles by etching from both sides of the blank
NL153395B (nl) * 1949-02-10 Contraves Ag Verbetering van een bistabiele trekkerschakeling.
GB699050A (en) * 1950-09-09 1953-10-28 Sylvania Electric Prod Transistors, and their method of manufacture
US2743506A (en) * 1952-02-23 1956-05-01 Int Resistance Co Method of manufacturing rectifier cells
US2777192A (en) * 1952-12-03 1957-01-15 Philco Corp Method of forming a printed circuit and soldering components thereto
US2758074A (en) * 1953-08-26 1956-08-07 Rca Corp Printed circuits
US2829460A (en) * 1953-12-22 1958-04-08 Marcel J E Golay Etching method and etching plate
BE557842A (fr) * 1956-06-01

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2019285A1 (fr) * 1968-06-17 1970-07-03 Texas Instruments Inc

Also Published As

Publication number Publication date
GB922583A (en) 1963-04-03
NL241641A (fr)
DE1092132B (de) 1960-11-03
US3046176A (en) 1962-07-24
NL122283C (fr)

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