DE112019006628T5 - Halbleitervorrichtung und herstellungsverfahren dafür - Google Patents

Halbleitervorrichtung und herstellungsverfahren dafür Download PDF

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Publication number
DE112019006628T5
DE112019006628T5 DE112019006628.5T DE112019006628T DE112019006628T5 DE 112019006628 T5 DE112019006628 T5 DE 112019006628T5 DE 112019006628 T DE112019006628 T DE 112019006628T DE 112019006628 T5 DE112019006628 T5 DE 112019006628T5
Authority
DE
Germany
Prior art keywords
semiconductor package
pads
electrodes
solder
orientation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112019006628.5T
Other languages
German (de)
English (en)
Inventor
Takao Kasai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of DE112019006628T5 publication Critical patent/DE112019006628T5/de
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/048—Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
DE112019006628.5T 2019-01-10 2019-12-19 Halbleitervorrichtung und herstellungsverfahren dafür Pending DE112019006628T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019002913A JP7167721B2 (ja) 2019-01-10 2019-01-10 半導体装置およびその製造方法
JP2019-002913 2019-01-10
PCT/JP2019/049879 WO2020145076A1 (ja) 2019-01-10 2019-12-19 半導体装置およびその製造方法

Publications (1)

Publication Number Publication Date
DE112019006628T5 true DE112019006628T5 (de) 2021-09-23

Family

ID=71521501

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112019006628.5T Pending DE112019006628T5 (de) 2019-01-10 2019-12-19 Halbleitervorrichtung und herstellungsverfahren dafür

Country Status (5)

Country Link
US (1) US12354937B2 (https=)
JP (1) JP7167721B2 (https=)
CN (1) CN113287373B (https=)
DE (1) DE112019006628T5 (https=)
WO (1) WO2020145076A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023045844A (ja) * 2021-09-22 2023-04-03 キオクシア株式会社 半導体デバイス及びメモリシステム
JP7749436B2 (ja) * 2021-12-02 2025-10-06 三菱電機株式会社 プリント配線板
CN115988747A (zh) * 2022-12-30 2023-04-18 上海拿森汽车电子有限公司 一种兼容式pcb板触点的制作方法及pcb板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020192913A (ja) 2019-05-29 2020-12-03 スズキ株式会社 車両用加飾部材固定構造

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Publication number Priority date Publication date Assignee Title
JPH067272U (ja) 1992-06-25 1994-01-28 日本電子機器株式会社 面実装型電子部品用プリント基板
US6060780A (en) 1996-02-23 2000-05-09 Denson Corporation Surface mount type unit and transducer assembly using same
JPH1117319A (ja) * 1997-06-26 1999-01-22 Matsushita Electric Ind Co Ltd チップの実装方法
JP2001156432A (ja) * 1999-11-29 2001-06-08 Opnext Japan Inc モジュール及び電子部品の実装方法
JP2001196731A (ja) * 2000-01-13 2001-07-19 Sony Corp バンプ形成方法および半導体チップの接合方法
JP3656543B2 (ja) * 2000-10-25 2005-06-08 松下電器産業株式会社 電子部品実装方法
JP2002223062A (ja) * 2001-01-26 2002-08-09 Toyo Commun Equip Co Ltd プリント配線基板のパッド形状
JP4637380B2 (ja) * 2001-02-08 2011-02-23 ルネサスエレクトロニクス株式会社 半導体装置
JP2002350244A (ja) * 2001-05-25 2002-12-04 Hitachi Cable Ltd ニオイ検知式熱監視システム
JP3850755B2 (ja) * 2002-05-29 2006-11-29 シャープ株式会社 半導体装置およびその製造方法
JP4618298B2 (ja) * 2005-03-29 2011-01-26 株式会社村田製作所 電子部品の実装構造
JP2007043134A (ja) * 2005-07-05 2007-02-15 Oki Electric Ind Co Ltd 半導体チップパッケージ及びその製造方法
JP4807199B2 (ja) * 2006-09-13 2011-11-02 株式会社デンソー 湿度センサ装置
JP5220766B2 (ja) * 2007-12-26 2013-06-26 株式会社フジクラ 実装基板
JP2011193109A (ja) * 2010-03-12 2011-09-29 Seiko Epson Corp 電子デバイス
JP5229267B2 (ja) 2010-05-06 2013-07-03 株式会社デンソー 電子装置
JP5853525B2 (ja) * 2011-09-16 2016-02-09 富士電機株式会社 半導体チップの位置決め治具及び半導体装置の製造方法
JP5991915B2 (ja) * 2012-12-27 2016-09-14 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP2014236187A (ja) * 2013-06-05 2014-12-15 イビデン株式会社 配線板及びその製造方法
JP2015015362A (ja) * 2013-07-04 2015-01-22 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
DE112015005174T5 (de) * 2014-12-19 2017-08-17 Myron Walker Mit speichen versehener lötanschluss zum verbessern der lötbarkeit und selbstausrichtung von baugruppen integrierter schaltungen
JP6522980B2 (ja) * 2015-02-18 2019-05-29 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP5992078B2 (ja) * 2015-08-03 2016-09-14 ルネサスエレクトロニクス株式会社 半導体装置
JP2018056234A (ja) * 2016-09-27 2018-04-05 キヤノン株式会社 プリント回路板、電子機器及びプリント回路板の製造方法
JP6956552B2 (ja) * 2017-07-19 2021-11-02 株式会社小糸製作所 車載用電子回路実装基板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020192913A (ja) 2019-05-29 2020-12-03 スズキ株式会社 車両用加飾部材固定構造

Also Published As

Publication number Publication date
JP2020113626A (ja) 2020-07-27
WO2020145076A1 (ja) 2020-07-16
JP7167721B2 (ja) 2022-11-09
CN113287373A (zh) 2021-08-20
CN113287373B (zh) 2024-06-21
US12354937B2 (en) 2025-07-08
US20210335700A1 (en) 2021-10-28

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