DE3780242T2 - Halbleiterbeschleunigungsmesser. - Google Patents
Halbleiterbeschleunigungsmesser.Info
- Publication number
- DE3780242T2 DE3780242T2 DE8787113466T DE3780242T DE3780242T2 DE 3780242 T2 DE3780242 T2 DE 3780242T2 DE 8787113466 T DE8787113466 T DE 8787113466T DE 3780242 T DE3780242 T DE 3780242T DE 3780242 T2 DE3780242 T2 DE 3780242T2
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor accelerometer
- accelerometer
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/003—Details of instruments used for damping
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
- G01P15/123—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/0825—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
- G01P2015/0828—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being of the paddle type being suspended at one of its longitudinal ends
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Pressure Sensors (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61224122A JPS6378577A (ja) | 1986-09-22 | 1986-09-22 | 半導体式加速度センサ |
JP61225437A JPH0711535B2 (ja) | 1986-09-23 | 1986-09-23 | 半導体式加速度センサ |
JP61232223A JPS6386576A (ja) | 1986-09-30 | 1986-09-30 | 半導体式加速度センサ |
JP61262557A JPS63116473A (ja) | 1986-11-04 | 1986-11-04 | 半導体式加速度センサの組付け方法 |
JP61277991A JPS63132171A (ja) | 1986-11-21 | 1986-11-21 | 半導体式加速度検出装置 |
JP21771887A JPS6459075A (en) | 1987-08-30 | 1987-08-30 | Semiconductor acceleration sensor |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3780242D1 DE3780242D1 (de) | 1992-08-13 |
DE3780242T2 true DE3780242T2 (de) | 1993-03-18 |
Family
ID=27553941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8787113466T Expired - Fee Related DE3780242T2 (de) | 1986-09-22 | 1987-09-15 | Halbleiterbeschleunigungsmesser. |
Country Status (3)
Country | Link |
---|---|
US (1) | US4829822A (de) |
EP (3) | EP0454190A3 (de) |
DE (1) | DE3780242T2 (de) |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5121633A (en) * | 1987-12-18 | 1992-06-16 | Nissan Motor Co., Ltd. | Semiconductor accelerometer |
GB2215914B (en) * | 1988-03-17 | 1991-07-03 | Emi Plc Thorn | A microengineered diaphragm pressure switch and a method of manufacture thereof |
DE68907121T2 (de) * | 1988-04-11 | 1994-01-27 | Nippon Denso Co | Beschleunigungsaufnehmer. |
CA1330265C (en) * | 1988-09-23 | 1994-06-21 | Craig W. White | Self-calibrating accelerometer |
JPH0623780B2 (ja) * | 1989-09-21 | 1994-03-30 | 日本電装株式会社 | 半導体加速度センサの製造方法 |
EP0543901B1 (de) * | 1990-08-17 | 1995-10-04 | Analog Devices, Inc. | Monolithischer beschleunigungsmesser |
US5314572A (en) * | 1990-08-17 | 1994-05-24 | Analog Devices, Inc. | Method for fabricating microstructures |
US5326726A (en) * | 1990-08-17 | 1994-07-05 | Analog Devices, Inc. | Method for fabricating monolithic chip containing integrated circuitry and suspended microstructure |
US5417111A (en) * | 1990-08-17 | 1995-05-23 | Analog Devices, Inc. | Monolithic chip containing integrated circuitry and suspended microstructure |
JPH0830716B2 (ja) * | 1990-11-30 | 1996-03-27 | 三菱電機株式会社 | 半導体加速度検出装置 |
US5191794A (en) * | 1990-12-24 | 1993-03-09 | Litton Systems, Inc. | Integrated accelerometer with resilient limit stops |
US6295870B1 (en) * | 1991-02-08 | 2001-10-02 | Alliedsignal Inc. | Triaxial angular rate and acceleration sensor |
US5408112A (en) * | 1991-06-03 | 1995-04-18 | Nippondenso Co., Ltd. | Semiconductor strain sensor having improved resistance to bonding strain effects |
JPH057006A (ja) * | 1991-06-28 | 1993-01-14 | Mitsubishi Electric Corp | 半導体加速度検出装置 |
US5233873A (en) * | 1991-07-03 | 1993-08-10 | Texas Instruments Incorporated | Accelerometer |
JPH05119057A (ja) * | 1991-10-23 | 1993-05-14 | Nec Corp | 半導体加速度センサ |
JPH05164775A (ja) * | 1991-12-17 | 1993-06-29 | Atsugi Unisia Corp | 加速度センサ |
DE4202148A1 (de) * | 1992-01-27 | 1993-07-29 | Kansei Kk | Beschleunigungs-sensor-baugruppe |
US5277064A (en) * | 1992-04-08 | 1994-01-11 | General Motors Corporation | Thick film accelerometer |
FR2690275B1 (fr) * | 1992-04-21 | 1994-06-10 | Asulab Sa | Moyens de positionnement d'un dispositif microelectronique et ensemble de montage d'un tel dispositif. |
JP2804874B2 (ja) * | 1992-12-25 | 1998-09-30 | 三菱電機株式会社 | 半導体加速度検出装置 |
US5780742A (en) * | 1993-04-15 | 1998-07-14 | Honeywell Inc. | Mechanical resonance, silicon accelerometer |
US6911727B1 (en) | 1995-06-06 | 2005-06-28 | Analog Devices, Inc. | Package for sealing an integrated circuit die |
FR2736723B1 (fr) * | 1995-07-12 | 1997-09-19 | Sagem | Accelerometre pendulaire a actionneur capacitif de test |
EP0793103A3 (de) * | 1996-02-27 | 1998-10-07 | Seiko Instruments R&D Center Inc. | Halbleiter-Beschleunigungssensor |
JP2800112B2 (ja) * | 1996-02-28 | 1998-09-21 | 株式会社エスアイアイ・アールディセンター | 半導体装置 |
JP3117925B2 (ja) * | 1996-04-19 | 2000-12-18 | 株式会社エスアイアイ・アールディセンター | 半導体加速度センサ |
EP0948059A1 (de) * | 1998-02-05 | 1999-10-06 | Asulab S.A. | Positionierungsmittel in einem mikroelektronischen Bauelement und Bildsensor mit Verwendung dieses Bauelements |
AU2001265084A1 (en) * | 2000-05-30 | 2001-12-11 | Input/Output, Inc. | Accelerometer with re-entrant grooves |
FI119078B (fi) * | 2002-02-12 | 2008-07-15 | Nokia Corp | Kiihtyvyysanturi |
EP1443331A3 (de) | 2003-02-03 | 2005-10-12 | Denso Corporation | Messaufnehmer und keramische Verpackung zur Montage von elektronischen Komponenten |
CN100399550C (zh) * | 2003-02-03 | 2008-07-02 | 株式会社电装 | 传感器器件以及用于安装电子元件的陶瓷封装外壳 |
US7109580B2 (en) | 2004-03-03 | 2006-09-19 | Hymite A/S | Hermetically sealed package for optical, electronic, opto-electronic and other devices |
DE102004034290A1 (de) * | 2004-07-15 | 2007-01-11 | Siemens Ag | Sensor für Kraftfahrzeuge |
JP2006133161A (ja) * | 2004-11-09 | 2006-05-25 | Fujitsu Media Device Kk | 加速度センサー |
US7243544B2 (en) | 2005-06-16 | 2007-07-17 | Honeywell International Inc. | Passive and wireless acoustic wave accelerometer |
JP7024349B2 (ja) * | 2017-11-24 | 2022-02-24 | セイコーエプソン株式会社 | センサーユニット、センサーユニットの製造方法、慣性計測装置、電子機器、および移動体 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3089343A (en) * | 1960-08-04 | 1963-05-14 | Lockheed Aircraft Corp | Transducer devices employing a fluid film for improvement of sensitivity and frequency response characteristics |
US3557628A (en) * | 1967-12-27 | 1971-01-26 | Toyoda Chuo Kenkyusho Kk | Accelerometer |
US3884085A (en) * | 1972-04-05 | 1975-05-20 | Robinson Halpern Company | Accelerometer assembly |
US3893156A (en) * | 1973-06-29 | 1975-07-01 | Ibm | Novel beam lead integrated circuit structure and method for making the same including automatic registration of beam leads with corresponding dielectric substrate leads |
DE2655604C2 (de) * | 1976-12-08 | 1984-11-29 | Robert Bosch Gmbh, 7000 Stuttgart | Verzögerungsaufnehmer zur Auslösung von Insassenschutzvorrichtungen im Kraftfahrzeug |
DE2801969C2 (de) * | 1978-01-18 | 1982-11-04 | Robert Bosch Gmbh, 7000 Stuttgart | Sensor für Schwingungen |
DE2835999A1 (de) * | 1978-08-17 | 1980-03-06 | Bosch Gmbh Robert | Beschleunigungsaufnehmer, insbesondere zur ausloesung von insassenschutzvorrichtungen in kraftfahrzeugen |
GB2130373B (en) * | 1982-11-17 | 1986-12-31 | Stc Plc | Accelerometer device |
JPS59158566A (ja) * | 1983-02-28 | 1984-09-08 | Nippon Denso Co Ltd | 半導体加速度センサ |
US4488445A (en) * | 1983-10-28 | 1984-12-18 | Honeywell Inc. | Integrated silicon accelerometer with cross-axis compensation |
JPS6169151A (ja) * | 1984-05-18 | 1986-04-09 | Toshiba Corp | 気密封止用キヤツプ半田付装置 |
FR2564826B1 (fr) * | 1984-05-25 | 1986-08-22 | Thomson Csf | Procede d'assemblage d'au moins deux pieces en ceramique, presentant chacune au moins une surface plane |
JPH0660906B2 (ja) * | 1984-12-18 | 1994-08-10 | 日産自動車株式会社 | 半導体加速度センサ |
JPH0515669A (ja) * | 1991-06-28 | 1993-01-26 | Juki Corp | ミシンの布押え装置 |
US5149980A (en) * | 1991-11-01 | 1992-09-22 | Hewlett-Packard Company | Substrate advance measurement system using cross-correlation of light sensor array signals |
-
1987
- 1987-09-15 EP EP19910112438 patent/EP0454190A3/en not_active Withdrawn
- 1987-09-15 EP EP87113466A patent/EP0261555B1/de not_active Expired - Lifetime
- 1987-09-15 DE DE8787113466T patent/DE3780242T2/de not_active Expired - Fee Related
- 1987-09-15 EP EP19910112458 patent/EP0456285A3/en not_active Withdrawn
- 1987-09-17 US US07/098,050 patent/US4829822A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0261555A2 (de) | 1988-03-30 |
EP0456285A3 (en) | 1992-01-02 |
EP0261555B1 (de) | 1992-07-08 |
US4829822A (en) | 1989-05-16 |
EP0454190A2 (de) | 1991-10-30 |
DE3780242D1 (de) | 1992-08-13 |
EP0261555A3 (en) | 1989-07-26 |
EP0456285A2 (de) | 1991-11-13 |
EP0454190A3 (en) | 1992-01-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8320 | Willingness to grant licences declared (paragraph 23) | ||
8339 | Ceased/non-payment of the annual fee |