DE112005000504B4 - Mehrschichtüberlagerungsmessungs- und Korrekturtechnik für die IC-Herstellung - Google Patents

Mehrschichtüberlagerungsmessungs- und Korrekturtechnik für die IC-Herstellung Download PDF

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Publication number
DE112005000504B4
DE112005000504B4 DE112005000504T DE112005000504T DE112005000504B4 DE 112005000504 B4 DE112005000504 B4 DE 112005000504B4 DE 112005000504 T DE112005000504 T DE 112005000504T DE 112005000504 T DE112005000504 T DE 112005000504T DE 112005000504 B4 DE112005000504 B4 DE 112005000504B4
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Germany
Prior art keywords
overlay
layers
error
correction
target
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Expired - Fee Related
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DE112005000504T
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German (de)
English (en)
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DE112005000504T5 (de
Inventor
Khoi A. Phan
Bharath Rangarajan
Bhanwar Singh
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GlobalFoundries Inc
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GlobalFoundries Inc
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706835—Metrology information management or control
    • G03F7/706837—Data analysis, e.g. filtering, weighting, flyer removal, fingerprints or root cause analysis
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • H10P74/277—Circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or circuits in testing wafers

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Data Mining & Analysis (AREA)
  • Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE112005000504T 2004-03-01 2005-02-26 Mehrschichtüberlagerungsmessungs- und Korrekturtechnik für die IC-Herstellung Expired - Fee Related DE112005000504B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/790,296 US7065737B2 (en) 2004-03-01 2004-03-01 Multi-layer overlay measurement and correction technique for IC manufacturing
US10/790,296 2004-03-01
PCT/US2005/006178 WO2005086223A2 (en) 2004-03-01 2005-02-26 Multi-layer overlay measurement and correction technique for ic manufacturing

Publications (2)

Publication Number Publication Date
DE112005000504T5 DE112005000504T5 (de) 2007-01-11
DE112005000504B4 true DE112005000504B4 (de) 2012-02-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE112005000504T Expired - Fee Related DE112005000504B4 (de) 2004-03-01 2005-02-26 Mehrschichtüberlagerungsmessungs- und Korrekturtechnik für die IC-Herstellung

Country Status (8)

Country Link
US (1) US7065737B2 (https=)
JP (1) JP2007528126A (https=)
KR (1) KR101187061B1 (https=)
CN (1) CN1926677A (https=)
DE (1) DE112005000504B4 (https=)
GB (1) GB2427268B (https=)
TW (1) TWI375251B (https=)
WO (1) WO2005086223A2 (https=)

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JP2007324371A (ja) * 2006-06-01 2007-12-13 Ebara Corp オーバーレイ検査用オーバーレイマーク及びレンズ収差調査用マーク
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CN105323181A (zh) * 2015-12-10 2016-02-10 成都捷科菲友信息技术有限公司 一种可安放于墙角处的无影照明吸附路由器
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CN112514039B (zh) * 2018-07-30 2024-03-29 科磊股份有限公司 减少装置覆盖误差
CN109753718B (zh) * 2018-12-28 2023-09-05 山西潞安太阳能科技有限责任公司 一种基于最小二乘法的pecvd色差改善方法
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CN111761060B (zh) * 2020-06-08 2022-03-29 湖南华曙高科技股份有限公司 应用于3d打印的风量控制方法、系统及可读存储介质
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KR102871169B1 (ko) * 2021-12-17 2025-10-14 케이엘에이 코포레이션 개선된 타겟 배치 정확성을 위한 오버레이 타겟 설계
CN117957497A (zh) * 2022-01-13 2024-04-30 科磊股份有限公司 使用小目标的叠加误差的校准测量
CN114428445A (zh) * 2022-01-27 2022-05-03 华虹半导体(无锡)有限公司 套刻误差量测方法和装置
CN117012760A (zh) * 2022-04-29 2023-11-07 联芯集成电路制造(厦门)有限公司 叠对标记
CN117192902B (zh) * 2022-05-31 2026-04-24 长鑫存储技术有限公司 套刻误差模型的构建方法和套刻校正方法
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Also Published As

Publication number Publication date
TW200534362A (en) 2005-10-16
GB0617132D0 (en) 2006-10-11
KR20060129421A (ko) 2006-12-15
US20050193362A1 (en) 2005-09-01
JP2007528126A (ja) 2007-10-04
DE112005000504T5 (de) 2007-01-11
GB2427268B (en) 2008-01-02
WO2005086223A3 (en) 2006-09-08
US7065737B2 (en) 2006-06-20
GB2427268A (en) 2006-12-20
TWI375251B (en) 2012-10-21
CN1926677A (zh) 2007-03-07
WO2005086223A2 (en) 2005-09-15
KR101187061B1 (ko) 2012-09-28

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