TWI375251B - Multi-layer overlay measurement and correction technique for ic manufacturing - Google Patents

Multi-layer overlay measurement and correction technique for ic manufacturing Download PDF

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Publication number
TWI375251B
TWI375251B TW094106008A TW94106008A TWI375251B TW I375251 B TWI375251 B TW I375251B TW 094106008 A TW094106008 A TW 094106008A TW 94106008 A TW94106008 A TW 94106008A TW I375251 B TWI375251 B TW I375251B
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TW
Taiwan
Prior art keywords
overlay
wafer
layers
error
coverage
Prior art date
Application number
TW094106008A
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English (en)
Chinese (zh)
Other versions
TW200534362A (en
Inventor
Khoi A Phan
Bharath Rangarajan
Bhanwar Singh
Original Assignee
Globalfoundries Us Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Globalfoundries Us Inc filed Critical Globalfoundries Us Inc
Publication of TW200534362A publication Critical patent/TW200534362A/zh
Application granted granted Critical
Publication of TWI375251B publication Critical patent/TWI375251B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706835—Metrology information management or control
    • G03F7/706837—Data analysis, e.g. filtering, weighting, flyer removal, fingerprints or root cause analysis
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • H10P74/277—Circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or circuits in testing wafers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Data Mining & Analysis (AREA)
  • Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW094106008A 2004-03-01 2005-03-01 Multi-layer overlay measurement and correction technique for ic manufacturing TWI375251B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/790,296 US7065737B2 (en) 2004-03-01 2004-03-01 Multi-layer overlay measurement and correction technique for IC manufacturing

Publications (2)

Publication Number Publication Date
TW200534362A TW200534362A (en) 2005-10-16
TWI375251B true TWI375251B (en) 2012-10-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW094106008A TWI375251B (en) 2004-03-01 2005-03-01 Multi-layer overlay measurement and correction technique for ic manufacturing

Country Status (8)

Country Link
US (1) US7065737B2 (https=)
JP (1) JP2007528126A (https=)
KR (1) KR101187061B1 (https=)
CN (1) CN1926677A (https=)
DE (1) DE112005000504B4 (https=)
GB (1) GB2427268B (https=)
TW (1) TWI375251B (https=)
WO (1) WO2005086223A2 (https=)

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Also Published As

Publication number Publication date
TW200534362A (en) 2005-10-16
GB0617132D0 (en) 2006-10-11
DE112005000504B4 (de) 2012-02-16
KR20060129421A (ko) 2006-12-15
US20050193362A1 (en) 2005-09-01
JP2007528126A (ja) 2007-10-04
DE112005000504T5 (de) 2007-01-11
GB2427268B (en) 2008-01-02
WO2005086223A3 (en) 2006-09-08
US7065737B2 (en) 2006-06-20
GB2427268A (en) 2006-12-20
CN1926677A (zh) 2007-03-07
WO2005086223A2 (en) 2005-09-15
KR101187061B1 (ko) 2012-09-28

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