CN1926677A - 用于集成电路制造之多层覆盖测量及修正技术 - Google Patents

用于集成电路制造之多层覆盖测量及修正技术 Download PDF

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Publication number
CN1926677A
CN1926677A CN200580006568.3A CN200580006568A CN1926677A CN 1926677 A CN1926677 A CN 1926677A CN 200580006568 A CN200580006568 A CN 200580006568A CN 1926677 A CN1926677 A CN 1926677A
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CN
China
Prior art keywords
overlay
layers
wafer
coverage
errors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200580006568.3A
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English (en)
Chinese (zh)
Inventor
K·A·攀
B·兰加拉贾
B·辛格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GlobalFoundries Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of CN1926677A publication Critical patent/CN1926677A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706835—Metrology information management or control
    • G03F7/706837—Data analysis, e.g. filtering, weighting, flyer removal, fingerprints or root cause analysis
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • H10P74/277—Circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or circuits in testing wafers

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Data Mining & Analysis (AREA)
  • Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN200580006568.3A 2004-03-01 2005-02-26 用于集成电路制造之多层覆盖测量及修正技术 Pending CN1926677A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/790,296 US7065737B2 (en) 2004-03-01 2004-03-01 Multi-layer overlay measurement and correction technique for IC manufacturing
US10/790,296 2004-03-01

Publications (1)

Publication Number Publication Date
CN1926677A true CN1926677A (zh) 2007-03-07

Family

ID=34887442

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200580006568.3A Pending CN1926677A (zh) 2004-03-01 2005-02-26 用于集成电路制造之多层覆盖测量及修正技术

Country Status (8)

Country Link
US (1) US7065737B2 (https=)
JP (1) JP2007528126A (https=)
KR (1) KR101187061B1 (https=)
CN (1) CN1926677A (https=)
DE (1) DE112005000504B4 (https=)
GB (1) GB2427268B (https=)
TW (1) TWI375251B (https=)
WO (1) WO2005086223A2 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101614953A (zh) * 2008-06-10 2009-12-30 以色列商·应用材料以色列公司 用于评估具有重复图形的目标物体的方法和系统
CN107146783A (zh) * 2016-03-01 2017-09-08 格罗方德半导体公司 将虚设图型用于套迭目标设计及套迭控制的方法
CN114428445A (zh) * 2022-01-27 2022-05-03 华虹半导体(无锡)有限公司 套刻误差量测方法和装置
CN117192902A (zh) * 2022-05-31 2023-12-08 长鑫存储技术有限公司 套刻误差模型的构建方法和套刻校正方法

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JP5965819B2 (ja) * 2012-10-26 2016-08-10 株式会社日立ハイテクノロジーズ 荷電粒子線装置及び重ね合わせずれ量測定方法
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KR101564312B1 (ko) * 2015-07-07 2015-10-29 (주)오로스 테크놀로지 오버레이 마크 및 이를 이용한 오버레이 계측방법 및 반도체 디바이스 제조방법
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CN106547171B (zh) * 2015-09-17 2019-01-18 上海微电子装备（集团）股份有限公司 一种用于光刻装置的套刻补偿系统及方法
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CN105337878A (zh) * 2015-12-10 2016-02-17 成都捷科菲友信息技术有限公司 一种按压吸附式无影照明路由器
CN105323181A (zh) * 2015-12-10 2016-02-10 成都捷科菲友信息技术有限公司 一种可安放于墙角处的无影照明吸附路由器
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CN112514039B (zh) * 2018-07-30 2024-03-29 科磊股份有限公司 减少装置覆盖误差
CN109753718B (zh) * 2018-12-28 2023-09-05 山西潞安太阳能科技有限责任公司 一种基于最小二乘法的pecvd色差改善方法
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TWI814909B (zh) * 2019-09-27 2023-09-11 聯華電子股份有限公司 多層對位標記及其對位方法
CN111761060B (zh) * 2020-06-08 2022-03-29 湖南华曙高科技股份有限公司 应用于3d打印的风量控制方法、系统及可读存储介质
US11726410B2 (en) * 2021-04-20 2023-08-15 Kla Corporation Multi-resolution overlay metrology targets
US20230068016A1 (en) * 2021-08-26 2023-03-02 Kla Corporation Systems and methods for rotational calibration of metrology tools
KR102871169B1 (ko) * 2021-12-17 2025-10-14 케이엘에이 코포레이션 개선된 타겟 배치 정확성을 위한 오버레이 타겟 설계
CN117957497A (zh) * 2022-01-13 2024-04-30 科磊股份有限公司 使用小目标的叠加误差的校准测量
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101614953A (zh) * 2008-06-10 2009-12-30 以色列商·应用材料以色列公司 用于评估具有重复图形的目标物体的方法和系统
CN107146783A (zh) * 2016-03-01 2017-09-08 格罗方德半导体公司 将虚设图型用于套迭目标设计及套迭控制的方法
CN114428445A (zh) * 2022-01-27 2022-05-03 华虹半导体(无锡)有限公司 套刻误差量测方法和装置
CN117192902A (zh) * 2022-05-31 2023-12-08 长鑫存储技术有限公司 套刻误差模型的构建方法和套刻校正方法

Also Published As

Publication number Publication date
TW200534362A (en) 2005-10-16
GB0617132D0 (en) 2006-10-11
DE112005000504B4 (de) 2012-02-16
KR20060129421A (ko) 2006-12-15
US20050193362A1 (en) 2005-09-01
JP2007528126A (ja) 2007-10-04
DE112005000504T5 (de) 2007-01-11
GB2427268B (en) 2008-01-02
WO2005086223A3 (en) 2006-09-08
US7065737B2 (en) 2006-06-20
GB2427268A (en) 2006-12-20
TWI375251B (en) 2012-10-21
WO2005086223A2 (en) 2005-09-15
KR101187061B1 (ko) 2012-09-28

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