DE1050449B - - Google Patents

Info

Publication number
DE1050449B
DE1050449B DENDAT1050449D DE1050449DA DE1050449B DE 1050449 B DE1050449 B DE 1050449B DE NDAT1050449 D DENDAT1050449 D DE NDAT1050449D DE 1050449D A DE1050449D A DE 1050449DA DE 1050449 B DE1050449 B DE 1050449B
Authority
DE
Germany
Prior art keywords
electrode
welding
electrodes
welds
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DENDAT1050449D
Other languages
German (de)
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Publication of DE1050449B publication Critical patent/DE1050449B/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/002—Resistance welding; Severing by resistance heating specially adapted for particular articles or work
    • B23K11/0026—Welding of thin articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01051—Antimony [Sb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Wire Bonding (AREA)
  • Resistance Welding (AREA)
DENDAT1050449D 1957-04-18 Pending DE1050449B (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DES53212A DE1034274B (de) 1957-04-18 1957-04-18 Verfahren zur Herstellung einer Verbindung eines draht- oder bandfoermigen elektrischen Leiters mit einer Elektrode eines Halbleiterelementes
DES0056233 1957-12-13

Publications (1)

Publication Number Publication Date
DE1050449B true DE1050449B (fr) 1959-02-12

Family

ID=25995379

Family Applications (2)

Application Number Title Priority Date Filing Date
DENDAT1050449D Pending DE1050449B (fr) 1957-04-18
DES53212A Pending DE1034274B (de) 1957-04-18 1957-04-18 Verfahren zur Herstellung einer Verbindung eines draht- oder bandfoermigen elektrischen Leiters mit einer Elektrode eines Halbleiterelementes

Family Applications After (1)

Application Number Title Priority Date Filing Date
DES53212A Pending DE1034274B (de) 1957-04-18 1957-04-18 Verfahren zur Herstellung einer Verbindung eines draht- oder bandfoermigen elektrischen Leiters mit einer Elektrode eines Halbleiterelementes

Country Status (5)

Country Link
CH (1) CH363725A (fr)
DE (2) DE1034274B (fr)
FR (1) FR1205947A (fr)
GB (1) GB850119A (fr)
NL (2) NL226947A (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1240995B (de) * 1960-11-02 1967-05-24 Siemens Ag Verfahren zum Kontaktieren einer Elektrode eines Halbleiterelementes mit einem elektrischen Anschlussleiter
DE1295697B (de) * 1962-05-23 1969-05-22 Walter Brandt Gmbh Halbleiterbauelement und Verfahren zu seiner Herstellung
DE3426200A1 (de) * 1984-07-17 1986-01-23 Brown, Boveri & Cie Ag, 6800 Mannheim Ueberbrueckungselement
DE3426199A1 (de) * 1984-07-17 1986-01-23 Brown, Boveri & Cie Ag, 6800 Mannheim Ueberbrueckungselement

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1256802B (de) * 1957-04-18 1967-12-21 Siemens Ag Vorrichtung zum Durchfuehren des Verfahrens zum Herstellen einer festen Verbindung einer draht- oder bandfoermigen Zuleitungselektrode mit einer flaechenhaften Kontaktelektrode eines Halbleiterbauelements
NL270438A (fr) * 1960-11-02 1900-01-01
NL260810A (fr) * 1961-02-03
NL283249A (fr) * 1961-09-19 1900-01-01
US3197608A (en) * 1962-01-23 1965-07-27 Sylvania Electric Prod Method of manufacture of semiconductor devices
US3132239A (en) * 1962-04-25 1964-05-05 United Aircraft Corp Electron beam compression welding
JPS5842262A (ja) * 1981-09-07 1983-03-11 Toshiba Corp 混成集積回路のリ−ド線接続方法
DE3609654A1 (de) * 1985-03-22 1986-09-25 Copal Electronics Co., Ltd., Tokio/Tokyo Regelwiderstand
JPH0690962B2 (ja) * 1986-03-31 1994-11-14 日本メクトロン株式会社 Ｐｔｃ素子の製造法
JPH0690964B2 (ja) * 1986-03-31 1994-11-14 日本メクトロン株式会社 Ｐｔｃ素子の製造法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1240995B (de) * 1960-11-02 1967-05-24 Siemens Ag Verfahren zum Kontaktieren einer Elektrode eines Halbleiterelementes mit einem elektrischen Anschlussleiter
DE1295697B (de) * 1962-05-23 1969-05-22 Walter Brandt Gmbh Halbleiterbauelement und Verfahren zu seiner Herstellung
DE3426200A1 (de) * 1984-07-17 1986-01-23 Brown, Boveri & Cie Ag, 6800 Mannheim Ueberbrueckungselement
DE3426199A1 (de) * 1984-07-17 1986-01-23 Brown, Boveri & Cie Ag, 6800 Mannheim Ueberbrueckungselement

Also Published As

Publication number Publication date
CH363725A (de) 1962-08-15
NL112688C (fr) 1900-01-01
GB850119A (en) 1960-09-28
FR1205947A (fr) 1960-02-05
NL226947A (fr) 1900-01-01
DE1034274B (de) 1958-07-17

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