GB850119A - Improvements in or relating to a method of connecting an electrical conductor to an electrode of a semi-conductor element - Google Patents

Improvements in or relating to a method of connecting an electrical conductor to an electrode of a semi-conductor element

Info

Publication number
GB850119A
GB850119A GB12377/58A GB1237758A GB850119A GB 850119 A GB850119 A GB 850119A GB 12377/58 A GB12377/58 A GB 12377/58A GB 1237758 A GB1237758 A GB 1237758A GB 850119 A GB850119 A GB 850119A
Authority
GB
United Kingdom
Prior art keywords
conductor
electrode
welding
electrodes
cup
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB12377/58A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens AG
Original Assignee
Siemens Schuckertwerke AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens AG filed Critical Siemens Schuckertwerke AG
Publication of GB850119A publication Critical patent/GB850119A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/002—Resistance welding; Severing by resistance heating specially adapted for particular articles or work
    • B23K11/0026—Welding of thin articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01051—Antimony [Sb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Resistance Welding (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

850,119. Welding by pressure. SIEMENSSCHUCKERTWERKE A.G. April 18, 1958 [April 18, 1957; Dec. 13, 1957], No. 12377/58. Class 83 (4). [Also in Group XXXVI] A connecting conductor is fixed to a metallic electrode of a semi-conductor device by applying a pair of welding electrodes to closely-spaced parts of the conductor where it overlies the electrode and passing a pulse of current between them to weld the conductor to the electrode. In one embodiment, Fig. 1, a silver wire 2 is welded to a gold antimony alloy electrode 1a on a PN junction silicon or germanium body 5 by passing. current between welding electrodes 3 and 4. The two ends of the wire may afterwards be twisted together. In another embodiment a cup-shaped conductor 105 (Fig. 11) is welded over an annular region to the gold antimony electrode 104 on a silicon plate. To effect the welding, current is passed between a pair of coaxial cylindrical electrodes 107, 108 pressed against the bottom of the cup. Such a cupshaped conductor may alternatively be welded to the electrode at a series of spaced points. The points may, for instance, be arranged along the sides of or at the corners of a square, on the periphery of a circle or concentric circles, or along parallel or inter sectinglines, e.g. lines radiating from a point or lines intersecting at right-angles. The various welds may be produced singly, in groups, or all together by using a suitable number of welding electrodes. For example where the points lie on a circle, Fig. 13, the cup-shaped conductor may be provided with concentric ridges 110 notched at intervals for the purpose of locating suitably-shaped welding- electrodes 111, 112. The electrodes are moved around between pairs of adjacent notches to form the welds individually. As an alternative the conductor may be provided with suitablyplaced indentations for locating the welding electrodes, or with pin-shaped projections which co-operate with recessed welding electrodes. A tape-like conductor formed with a square or circular cup-like indentation similar to conductor 105 may be welded to the electrode of a semi-conductor device by processes similar to those described above.
GB12377/58A 1957-04-18 1958-04-18 Improvements in or relating to a method of connecting an electrical conductor to an electrode of a semi-conductor element Expired GB850119A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DES53212A DE1034274B (en) 1957-04-18 1957-04-18 Method for producing a connection of a wire or tape-shaped electrical conductor with an electrode of a semiconductor element
DES0056233 1957-12-13

Publications (1)

Publication Number Publication Date
GB850119A true GB850119A (en) 1960-09-28

Family

ID=25995379

Family Applications (1)

Application Number Title Priority Date Filing Date
GB12377/58A Expired GB850119A (en) 1957-04-18 1958-04-18 Improvements in or relating to a method of connecting an electrical conductor to an electrode of a semi-conductor element

Country Status (5)

Country Link
CH (1) CH363725A (en)
DE (2) DE1034274B (en)
FR (1) FR1205947A (en)
GB (1) GB850119A (en)
NL (2) NL112688C (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1256802B (en) * 1957-04-18 1967-12-21 Siemens Ag Device for carrying out the method for producing a permanent connection between a wire-shaped or strip-shaped lead electrode with a flat contact electrode of a semiconductor component
NL270438A (en) * 1960-11-02 1900-01-01
DE1240995B (en) * 1960-11-02 1967-05-24 Siemens Ag Method for contacting an electrode of a semiconductor element with an electrical connection conductor
NL260810A (en) * 1961-02-03
NL283249A (en) * 1961-09-19 1900-01-01
US3197608A (en) * 1962-01-23 1965-07-27 Sylvania Electric Prod Method of manufacture of semiconductor devices
US3132239A (en) * 1962-04-25 1964-05-05 United Aircraft Corp Electron beam compression welding
DE1295697B (en) * 1962-05-23 1969-05-22 Walter Brandt Gmbh Semiconductor component and method for its manufacture
JPS5842262A (en) * 1981-09-07 1983-03-11 Toshiba Corp Connection of lead wire for hybrid integrated circuit
DE3426200C2 (en) * 1984-07-17 1994-02-10 Asea Brown Boveri Bridging element
DE3426199C2 (en) * 1984-07-17 1994-02-03 Asea Brown Boveri Bridging element
DE3609654A1 (en) * 1985-03-22 1986-09-25 Copal Electronics Co., Ltd., Tokio/Tokyo REGULAR RESISTANCE
JPH0690962B2 (en) * 1986-03-31 1994-11-14 日本メクトロン株式会社 Method for manufacturing PTC element
JPH0690964B2 (en) * 1986-03-31 1994-11-14 日本メクトロン株式会社 Method for manufacturing PTC element

Also Published As

Publication number Publication date
DE1050449B (en) 1959-02-12
FR1205947A (en) 1960-02-05
NL112688C (en) 1900-01-01
NL226947A (en) 1900-01-01
DE1034274B (en) 1958-07-17
CH363725A (en) 1962-08-15

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