DE10297676B4 - Verfahren zum Kalibrieren einer Messanlage auf Streumessungsbasis, die zum Messen von Abmessungen von Strukturelementen auf einem Halbleiterbauelement verwendet wird - Google Patents
Verfahren zum Kalibrieren einer Messanlage auf Streumessungsbasis, die zum Messen von Abmessungen von Strukturelementen auf einem Halbleiterbauelement verwendet wird Download PDFInfo
- Publication number
- DE10297676B4 DE10297676B4 DE10297676.7T DE10297676T DE10297676B4 DE 10297676 B4 DE10297676 B4 DE 10297676B4 DE 10297676 T DE10297676 T DE 10297676T DE 10297676 B4 DE10297676 B4 DE 10297676B4
- Authority
- DE
- Germany
- Prior art keywords
- structures
- critical dimension
- grid
- size
- critical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
- G01N21/4788—Diffraction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/103,223 | 2002-03-19 | ||
| US10/103,223 US6742168B1 (en) | 2002-03-19 | 2002-03-19 | Method and structure for calibrating scatterometry-based metrology tool used to measure dimensions of features on a semiconductor device |
| PCT/US2002/040264 WO2003081662A1 (en) | 2002-03-19 | 2002-12-17 | Method and structure for calibrating scatterometry-based metrology tool used to measure dimensions of features on a semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE10297676T5 DE10297676T5 (de) | 2005-07-07 |
| DE10297676B4 true DE10297676B4 (de) | 2015-03-19 |
Family
ID=28452364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE10297676.7T Expired - Lifetime DE10297676B4 (de) | 2002-03-19 | 2002-12-17 | Verfahren zum Kalibrieren einer Messanlage auf Streumessungsbasis, die zum Messen von Abmessungen von Strukturelementen auf einem Halbleiterbauelement verwendet wird |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6742168B1 (https=) |
| JP (1) | JP4864290B2 (https=) |
| KR (1) | KR100942037B1 (https=) |
| CN (1) | CN100407391C (https=) |
| AU (1) | AU2002357274A1 (https=) |
| DE (1) | DE10297676B4 (https=) |
| GB (1) | GB2406215B (https=) |
| WO (1) | WO2003081662A1 (https=) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7016054B2 (en) * | 2003-03-31 | 2006-03-21 | Lsi Logic Corporation | Lithography line width monitor reflecting chip-wide average feature size |
| US6859746B1 (en) * | 2003-05-01 | 2005-02-22 | Advanced Micro Devices, Inc. | Methods of using adaptive sampling techniques based upon categorization of process variations, and system for performing same |
| JP2005051210A (ja) * | 2003-07-15 | 2005-02-24 | Matsushita Electric Ind Co Ltd | 面内分布データの圧縮法、面内分布の測定方法、面内分布の最適化方法、プロセス装置の管理方法及びプロセス管理方法 |
| DE102004006258B4 (de) * | 2004-02-09 | 2007-08-02 | Infineon Technologies Ag | Verfahren zum Angleichen von zwei Messverfahren für die Messung von Strukturbreiten auf einem Substrat |
| KR100625168B1 (ko) * | 2004-08-23 | 2006-09-20 | 삼성전자주식회사 | 기판에 형성된 패턴의 검사방법 및 이를 수행하기 위한검사장치 |
| US7052921B1 (en) | 2004-09-03 | 2006-05-30 | Advanced Micro Devices, Inc. | System and method using in situ scatterometry to detect photoresist pattern integrity during the photolithography process |
| US7427457B1 (en) | 2004-09-03 | 2008-09-23 | Advanced Micro Devices, Inc. | Methods for designing grating structures for use in situ scatterometry to detect photoresist defects |
| US20060222975A1 (en) * | 2005-04-02 | 2006-10-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrated optical metrology and lithographic process track for dynamic critical dimension control |
| US7738694B2 (en) * | 2006-03-23 | 2010-06-15 | Pratt & Whitney Canada Corp. | Calibration of optical patternator spray parameter measurements |
| CN100535759C (zh) * | 2006-03-30 | 2009-09-02 | 联华电子股份有限公司 | 判定半导体工艺条件的方法 |
| DE102007009901B4 (de) * | 2007-02-28 | 2011-07-07 | Globalfoundries Inc. | Technik zum Strukturieren unterschiedlich verspannter Schichten, die über Transistoren ausgebildet sind, durch verbesserte Ätzsteuerungsstrategien |
| TWI416096B (zh) | 2007-07-11 | 2013-11-21 | Nova Measuring Instr Ltd | 用於監控圖案化結構的性質之方法及系統 |
| CN102005436B (zh) * | 2009-09-01 | 2012-02-08 | 中芯国际集成电路制造(上海)有限公司 | 度量衡校准晶圆 |
| CN102136438B (zh) * | 2010-01-21 | 2012-08-01 | 上海华虹Nec电子有限公司 | 快速检测芯片堆栈结构间段差高度的方法 |
| US9123649B1 (en) * | 2013-01-21 | 2015-09-01 | Kla-Tencor Corporation | Fit-to-pitch overlay measurement targets |
| US9091667B2 (en) * | 2013-10-25 | 2015-07-28 | Globalfoundries Inc. | Detection of particle contamination on wafers |
| AT513185B1 (de) * | 2013-11-13 | 2015-12-15 | Ditest Fahrzeugdiagnose Gmbh | Kalibrierelement |
| KR20150085956A (ko) | 2014-01-17 | 2015-07-27 | 삼성전자주식회사 | 반도체 소자의 계측 방법, 반도체 계측 시스템, 및 이들을 이용한 반도체 소자의 제조방법 |
| EP3221897A1 (en) * | 2014-09-08 | 2017-09-27 | The Research Foundation Of State University Of New York | Metallic gratings and measurement methods thereof |
| CN107037694A (zh) * | 2017-05-25 | 2017-08-11 | 苏州灯龙光电科技有限公司 | 一种检测显示性能的检测板及其检测方法 |
| US10928739B2 (en) | 2019-02-22 | 2021-02-23 | Kla-Tencor Corporation | Method of measuring misregistration of semiconductor devices |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5949547A (en) * | 1997-02-20 | 1999-09-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | System for in-line monitoring of photo processing in VLSI fabrication |
| DE19922614A1 (de) * | 1998-12-04 | 2000-06-15 | Fraunhofer Ges Forschung | Verfahren und Vorrichtung zur optischen Kontrolle von Fertigungsprozessen feinstrukturierter Oberflächen in der Halbleiterfertigung |
| WO2001011656A1 (en) * | 1999-08-11 | 2001-02-15 | Kla Tencor Corporation | Calibration of a scanning electron microscope |
| WO2002013232A2 (en) * | 2000-08-09 | 2002-02-14 | Jordan Valley Applied Radiation Ltd. | Measurement of critical dimensions using x-rays |
| US6354133B1 (en) * | 2000-10-25 | 2002-03-12 | Advanced Micro Devices, Inc. | Use of carbon nanotubes to calibrate conventional tips used in AFM |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5607800A (en) | 1995-02-15 | 1997-03-04 | Lucent Technologies Inc. | Method and arrangement for characterizing micro-size patterns |
| US5880838A (en) | 1996-06-05 | 1999-03-09 | California Institute Of California | System and method for optically measuring a structure |
| US6594012B2 (en) * | 1996-07-05 | 2003-07-15 | Canon Kabushiki Kaisha | Exposure apparatus |
| EP0847895B1 (en) | 1996-12-13 | 2001-08-01 | Denso Corporation | Apparatus for automatically adjusting aiming of headlights of an automotive vehicle |
| US5867276A (en) | 1997-03-07 | 1999-02-02 | Bio-Rad Laboratories, Inc. | Method for broad wavelength scatterometry |
| US6081334A (en) | 1998-04-17 | 2000-06-27 | Applied Materials, Inc | Endpoint detection for semiconductor processes |
| US6514648B2 (en) | 1998-08-28 | 2003-02-04 | International Business Machines Corporation | Method to produce equal sized features in microlithography |
| US6272392B1 (en) | 1998-12-04 | 2001-08-07 | Advanced Micro Devices, Inc. | Methodology for extracting effective lens aberrations using a neural network |
| US6245584B1 (en) | 1999-07-01 | 2001-06-12 | Advanced Micro Devices | Method for detecting adjustment error in photolithographic stepping printer |
| IL130874A (en) * | 1999-07-09 | 2002-12-01 | Nova Measuring Instr Ltd | System and method for measuring pattern structures |
| US6051348A (en) | 1999-08-17 | 2000-04-18 | Advanced Micro Devices | Method for detecting malfunction in photolithographic fabrication track |
| FR2812755B1 (fr) * | 2000-08-04 | 2002-10-31 | St Microelectronics Sa | Inductance integree |
| US6782337B2 (en) * | 2000-09-20 | 2004-08-24 | Kla-Tencor Technologies Corp. | Methods and systems for determining a critical dimension an a presence of defects on a specimen |
| TW519746B (en) * | 2001-01-26 | 2003-02-01 | Timbre Tech Inc | System and method for characterizing macro-grating test patterns in advanced lithography and etch processes |
| US6433878B1 (en) * | 2001-01-29 | 2002-08-13 | Timbre Technology, Inc. | Method and apparatus for the determination of mask rules using scatterometry |
| US6650422B2 (en) | 2001-03-26 | 2003-11-18 | Advanced Micro Devices, Inc. | Scatterometry techniques to ascertain asymmetry profile of features and generate a feedback or feedforward process control data associated therewith |
| US6563578B2 (en) * | 2001-04-02 | 2003-05-13 | Advanced Micro Devices, Inc. | In-situ thickness measurement for use in semiconductor processing |
| JP4348412B2 (ja) * | 2001-04-26 | 2009-10-21 | 東京エレクトロン株式会社 | 計測システムクラスター |
| US6545753B2 (en) * | 2001-06-27 | 2003-04-08 | Advanced Micro Devices, Inc. | Using scatterometry for etch end points for dual damascene process |
| US6561706B2 (en) * | 2001-06-28 | 2003-05-13 | Advanced Micro Devices, Inc. | Critical dimension monitoring from latent image |
| US6583871B1 (en) * | 2001-07-23 | 2003-06-24 | Advanced Micro Devices, Inc. | System and method to measure closed area defects |
| US6448097B1 (en) * | 2001-07-23 | 2002-09-10 | Advanced Micro Devices Inc. | Measure fluorescence from chemical released during trim etch |
| US6643008B1 (en) * | 2002-02-26 | 2003-11-04 | Advanced Micro Devices, Inc. | Method of detecting degradation in photolithography processes based upon scatterometric measurements of grating structures, and a device comprising such structures |
-
2002
- 2002-03-19 US US10/103,223 patent/US6742168B1/en not_active Expired - Lifetime
- 2002-12-17 KR KR1020047014727A patent/KR100942037B1/ko not_active Expired - Lifetime
- 2002-12-17 CN CN028285476A patent/CN100407391C/zh not_active Expired - Lifetime
- 2002-12-17 GB GB0419077A patent/GB2406215B/en not_active Expired - Lifetime
- 2002-12-17 WO PCT/US2002/040264 patent/WO2003081662A1/en not_active Ceased
- 2002-12-17 AU AU2002357274A patent/AU2002357274A1/en not_active Abandoned
- 2002-12-17 DE DE10297676.7T patent/DE10297676B4/de not_active Expired - Lifetime
- 2002-12-17 JP JP2003579273A patent/JP4864290B2/ja not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5949547A (en) * | 1997-02-20 | 1999-09-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | System for in-line monitoring of photo processing in VLSI fabrication |
| DE19922614A1 (de) * | 1998-12-04 | 2000-06-15 | Fraunhofer Ges Forschung | Verfahren und Vorrichtung zur optischen Kontrolle von Fertigungsprozessen feinstrukturierter Oberflächen in der Halbleiterfertigung |
| WO2001011656A1 (en) * | 1999-08-11 | 2001-02-15 | Kla Tencor Corporation | Calibration of a scanning electron microscope |
| WO2002013232A2 (en) * | 2000-08-09 | 2002-02-14 | Jordan Valley Applied Radiation Ltd. | Measurement of critical dimensions using x-rays |
| US6354133B1 (en) * | 2000-10-25 | 2002-03-12 | Advanced Micro Devices, Inc. | Use of carbon nanotubes to calibrate conventional tips used in AFM |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100942037B1 (ko) | 2010-02-11 |
| JP4864290B2 (ja) | 2012-02-01 |
| WO2003081662A1 (en) | 2003-10-02 |
| US6742168B1 (en) | 2004-05-25 |
| JP2005521261A (ja) | 2005-07-14 |
| KR20050002869A (ko) | 2005-01-10 |
| AU2002357274A1 (en) | 2003-10-08 |
| CN1623224A (zh) | 2005-06-01 |
| CN100407391C (zh) | 2008-07-30 |
| GB2406215A (en) | 2005-03-23 |
| DE10297676T5 (de) | 2005-07-07 |
| GB0419077D0 (en) | 2004-09-29 |
| GB2406215B (en) | 2005-12-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8110 | Request for examination paragraph 44 | ||
| R016 | Response to examination communication | ||
| R018 | Grant decision by examination section/examining division | ||
| R020 | Patent grant now final | ||
| R071 | Expiry of right |