DE102020210774A1 - Anzeigegerät - Google Patents

Anzeigegerät Download PDF

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Publication number
DE102020210774A1
DE102020210774A1 DE102020210774.2A DE102020210774A DE102020210774A1 DE 102020210774 A1 DE102020210774 A1 DE 102020210774A1 DE 102020210774 A DE102020210774 A DE 102020210774A DE 102020210774 A1 DE102020210774 A1 DE 102020210774A1
Authority
DE
Germany
Prior art keywords
display device
insulating layer
interlayer insulating
emitting element
metal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE102020210774.2A
Other languages
German (de)
English (en)
Inventor
Yasuhiro Kanaya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Display Inc
Original Assignee
Japan Display Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Display Inc filed Critical Japan Display Inc
Publication of DE102020210774A1 publication Critical patent/DE102020210774A1/de
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/0698—Local interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/872—Periodic patterns for optical field-shaping, e.g. photonic bandgap structures

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
  • Vehicle Body Suspensions (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
DE102020210774.2A 2019-08-29 2020-08-26 Anzeigegerät Ceased DE102020210774A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-157392 2019-08-29
JP2019157392A JP7317635B2 (ja) 2019-08-29 2019-08-29 表示装置

Publications (1)

Publication Number Publication Date
DE102020210774A1 true DE102020210774A1 (de) 2021-03-04

Family

ID=74564718

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102020210774.2A Ceased DE102020210774A1 (de) 2019-08-29 2020-08-26 Anzeigegerät

Country Status (6)

Country Link
US (1) US11581462B2 (https=)
JP (1) JP7317635B2 (https=)
KR (1) KR102439691B1 (https=)
CN (1) CN112447689B (https=)
DE (1) DE102020210774A1 (https=)
TW (1) TWI815032B (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102949495B1 (ko) * 2020-11-30 2026-04-07 삼성디스플레이 주식회사 표시 장치
EP4383336A4 (en) * 2021-09-06 2025-06-18 LG Electronics Inc. DISPLAY DEVICE
TWI797768B (zh) * 2021-10-06 2023-04-01 友達光電股份有限公司 可拉伸基板以及可拉伸顯示裝置
CN114220904B (zh) 2021-12-12 2023-09-26 武汉华星光电半导体显示技术有限公司 显示面板
JP7805804B2 (ja) * 2022-01-28 2026-01-26 上海天馬微電子有限公司 光デバイスパッケージ
CN117202746A (zh) * 2022-05-25 2023-12-08 群创光电股份有限公司 电子装置
FR3137497A1 (fr) * 2022-06-30 2024-01-05 Aledia Dispositif optoélectronique à réflecteur
KR20240106174A (ko) * 2022-12-29 2024-07-08 엘지디스플레이 주식회사 표시 장치
KR20250071980A (ko) * 2023-11-15 2025-05-23 엘지디스플레이 주식회사 표시 장치 및 그 제조방법
CN119894241A (zh) * 2025-01-14 2025-04-25 京东方科技集团股份有限公司 发光二极管、显示基板和显示装置

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005107327A1 (ja) * 2004-04-30 2005-11-10 Sanyo Electric Co., Ltd. 発光ディスプレイ
JP2008234928A (ja) 2007-03-19 2008-10-02 Toshiba Matsushita Display Technology Co Ltd 有機ｅｌ表示装置
KR101283282B1 (ko) * 2007-07-25 2013-07-11 엘지이노텍 주식회사 발광 소자 패키지 및 그 제조방법
CN101414653B (zh) 2007-10-18 2010-04-14 泰谷光电科技股份有限公司 发光二极管结构及制造方法
TWI362766B (en) 2007-12-03 2012-04-21 Lite On Technology Corp Optoelectronic semiconductor component capable of emitting light concentratively
JP2010003978A (ja) 2008-06-23 2010-01-07 Panasonic Electric Works Co Ltd 発光装置
WO2012108142A1 (ja) 2011-02-07 2012-08-16 シャープ株式会社 有機ｅｌ表示装置及びその製造方法
KR20130007003A (ko) * 2011-06-28 2013-01-18 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법
KR101820275B1 (ko) 2013-03-15 2018-01-19 애플 인크. 리던던시 스킴을 갖춘 발광 다이오드 디스플레이 및 통합 결함 검출 테스트를 갖는 발광 다이오드 디스플레이를 제작하는 방법
KR102067376B1 (ko) * 2013-05-21 2020-01-17 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조방법
KR102610028B1 (ko) 2016-04-12 2023-12-06 삼성디스플레이 주식회사 디스플레이 장치
CN107564928B (zh) 2016-06-30 2020-04-14 群创光电股份有限公司 显示装置
KR102632615B1 (ko) * 2016-12-05 2024-02-02 삼성디스플레이 주식회사 디스플레이 장치
US20180190672A1 (en) 2017-01-03 2018-07-05 Innolux Corporation Display device
KR20180081647A (ko) 2017-01-06 2018-07-17 삼성전자주식회사 발광 패키지
US10021762B1 (en) 2017-06-30 2018-07-10 Innolux Corporation Display device
KR102429944B1 (ko) 2017-09-27 2022-08-04 엘지디스플레이 주식회사 전계발광장치
KR102460376B1 (ko) 2017-10-27 2022-10-31 삼성디스플레이 주식회사 표시 장치 및 그의 제조 방법
KR102582649B1 (ko) 2018-02-12 2023-09-25 삼성디스플레이 주식회사 표시 장치
KR102492199B1 (ko) * 2018-03-09 2023-01-26 삼성디스플레이 주식회사 표시 장치
CN111969121B (zh) * 2019-05-20 2024-06-25 乐金显示有限公司 发光显示装置

Also Published As

Publication number Publication date
TWI815032B (zh) 2023-09-11
CN112447689A (zh) 2021-03-05
US20210066564A1 (en) 2021-03-04
JP7317635B2 (ja) 2023-07-31
JP2021033240A (ja) 2021-03-01
KR102439691B1 (ko) 2022-09-02
KR20210027097A (ko) 2021-03-10
CN112447689B (zh) 2024-07-30
US11581462B2 (en) 2023-02-14
TW202114471A (zh) 2021-04-01

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