DE102017221223B4 - Anschlussverarbeitungsvorrichtung und halbleitervorrichtung, die mittels dieser hergestellt wird - Google Patents

Anschlussverarbeitungsvorrichtung und halbleitervorrichtung, die mittels dieser hergestellt wird Download PDF

Info

Publication number
DE102017221223B4
DE102017221223B4 DE102017221223.3A DE102017221223A DE102017221223B4 DE 102017221223 B4 DE102017221223 B4 DE 102017221223B4 DE 102017221223 A DE102017221223 A DE 102017221223A DE 102017221223 B4 DE102017221223 B4 DE 102017221223B4
Authority
DE
Germany
Prior art keywords
mold plate
external terminals
punch
mold
external
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102017221223.3A
Other languages
German (de)
English (en)
Other versions
DE102017221223A1 (de
Inventor
Tetsuya Ueda
Shinji Mataga
Ken Sakamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE102017221223A1 publication Critical patent/DE102017221223A1/de
Application granted granted Critical
Publication of DE102017221223B4 publication Critical patent/DE102017221223B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B29C33/123—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels for centering the inserts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/04—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member
    • B26D1/06—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member wherein the cutting member reciprocates
    • B26D1/08—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member wherein the cutting member reciprocates of the guillotine type
    • B26D1/09—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member wherein the cutting member reciprocates of the guillotine type with a plurality of cutting members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/40—Cutting-out; Stamping-out using a press, e.g. of the ram type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/26—Moulds or cores
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
    • B29C45/14262—Clamping or tensioning means for the insert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/33—Moulds having transversely, e.g. radially, movable mould parts
    • B29C45/332—Mountings or guides therefor; Drives therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H10W74/017—Auxiliary layers for moulds, e.g. release layers or layers preventing residue
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D28/00—Shaping by press-cutting; Perforating
    • B21D28/02—Punching blanks or articles with or without obtaining scrap; Notching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Ceramic Engineering (AREA)
  • Punching Or Piercing (AREA)
  • Mounting, Exchange, And Manufacturing Of Dies (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE102017221223.3A 2016-12-06 2017-11-27 Anschlussverarbeitungsvorrichtung und halbleitervorrichtung, die mittels dieser hergestellt wird Active DE102017221223B4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016236565A JP6783128B2 (ja) 2016-12-06 2016-12-06 リード加工装置
JP2016-236565 2016-12-06

Publications (2)

Publication Number Publication Date
DE102017221223A1 DE102017221223A1 (de) 2018-06-07
DE102017221223B4 true DE102017221223B4 (de) 2020-12-24

Family

ID=62164254

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102017221223.3A Active DE102017221223B4 (de) 2016-12-06 2017-11-27 Anschlussverarbeitungsvorrichtung und halbleitervorrichtung, die mittels dieser hergestellt wird

Country Status (4)

Country Link
JP (1) JP6783128B2 (https=)
KR (1) KR102024522B1 (https=)
CN (1) CN108155119B (https=)
DE (1) DE102017221223B4 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110695184B (zh) * 2019-10-25 2020-07-03 徐州瑞益晟机械有限公司 一种可减少工件形变冲裁模具设备
CN112802787B (zh) * 2021-04-13 2021-06-22 四川旭茂微科技有限公司 一种用于引线框架组装的送料装置
CN115091685B (zh) * 2022-07-21 2023-09-05 南通超达装备股份有限公司 一种能自动去除边料的汽车座椅发泡模具
CN115846477B (zh) * 2023-03-01 2023-05-16 山西建投装备制造有限公司 一种钢材加工用钢材折弯设备及其操作方法
CN117564137B (zh) * 2024-01-15 2024-04-26 德阳华智精密科技有限公司 一种灯杆燕尾槽成型模具
CN119076726A (zh) * 2024-09-10 2024-12-06 苏州联展汽车科技有限公司 一种汽车冲压件热冲压装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09260562A (ja) * 1996-03-25 1997-10-03 Mitsubishi Electric Corp リード成形方法、リード成形装置、リード成形装置の異物除去方法、リード切断装置、外部リードの取り付け方法、外部リード加工装置、及び外部リードの異物除去方法
JPH10223825A (ja) * 1997-02-04 1998-08-21 Rohm Co Ltd 樹脂パッケージ型半導体装置、およびその製造方法
JP2003234448A (ja) * 2002-02-07 2003-08-22 Mitsubishi Electric Corp リードフレームのタイバー切断装置および切断方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5948435A (ja) * 1982-09-10 1984-03-19 Daicel Chem Ind Ltd ジクロルアセチルクロライドの製造方法
JPH064176B2 (ja) * 1988-12-07 1994-01-19 松下電器産業株式会社 プレス装置
JP3491481B2 (ja) * 1996-08-20 2004-01-26 株式会社日立製作所 半導体装置とその製造方法
JP2001018028A (ja) * 1999-06-30 2001-01-23 Ueno Seiki Kk 金型装置
JP3741995B2 (ja) * 2001-10-31 2006-02-01 株式会社ルネサステクノロジ 半導体装置の樹脂封止後におけるタイバーの除去装置及び方法、並びに半導体装置の製造方法
JP2004214497A (ja) * 2003-01-07 2004-07-29 Renesas Technology Corp 半導体素子のリード成形装置およびリード成形方法
JP4019989B2 (ja) * 2003-03-26 2007-12-12 株式会社デンソー 半導体装置
JP4372508B2 (ja) * 2003-10-06 2009-11-25 ローム株式会社 リードフレームの製造方法およびそれを用いた半導体装置の製造方法、ならびに半導体装置ならびにそれを備えた携帯機器および電子装置
JP4723406B2 (ja) * 2006-03-30 2011-07-13 富士通セミコンダクター株式会社 樹脂封止装置、半導体装置の製造方法、および樹脂封止方法
JP2008246493A (ja) * 2007-03-29 2008-10-16 Kayaba Ind Co Ltd 穴開け装置及び穴開け方法
JP2008300628A (ja) 2007-05-31 2008-12-11 Fujitsu General Ltd リードフレーム及び同リードフレームを用いた回路基板
JP2009202228A (ja) * 2008-02-29 2009-09-10 Daihatsu Motor Co Ltd 穴あけ加工装置
KR100862320B1 (ko) 2008-04-21 2008-10-13 김남국 리드의 절단이 가능한 2단 절곡식 리드 절곡금형
JP2010056372A (ja) * 2008-08-29 2010-03-11 Sanyo Electric Co Ltd 樹脂封止型半導体装置とその製造方法
JPWO2010052856A1 (ja) * 2008-11-06 2012-04-05 パナソニック株式会社 リード、配線部材、パッケージ部品、樹脂付金属部品及び樹脂封止半導体装置、並びにこれらの製造方法
JP5636946B2 (ja) * 2010-12-20 2014-12-10 三菱電機株式会社 半導体装置の製造方法
JP5602095B2 (ja) * 2011-06-09 2014-10-08 三菱電機株式会社 半導体装置
CN202343696U (zh) * 2011-11-15 2012-07-25 安徽恒明模具科技有限公司 U形钣金件冲孔模具
JP5956783B2 (ja) * 2012-03-02 2016-07-27 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP5881589B2 (ja) * 2012-12-10 2016-03-09 三菱電機株式会社 リード加工装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09260562A (ja) * 1996-03-25 1997-10-03 Mitsubishi Electric Corp リード成形方法、リード成形装置、リード成形装置の異物除去方法、リード切断装置、外部リードの取り付け方法、外部リード加工装置、及び外部リードの異物除去方法
JPH10223825A (ja) * 1997-02-04 1998-08-21 Rohm Co Ltd 樹脂パッケージ型半導体装置、およびその製造方法
JP2003234448A (ja) * 2002-02-07 2003-08-22 Mitsubishi Electric Corp リードフレームのタイバー切断装置および切断方法

Also Published As

Publication number Publication date
JP2018093103A (ja) 2018-06-14
KR20180064981A (ko) 2018-06-15
DE102017221223A1 (de) 2018-06-07
CN108155119A (zh) 2018-06-12
JP6783128B2 (ja) 2020-11-11
CN108155119B (zh) 2022-01-14
KR102024522B1 (ko) 2019-09-24

Similar Documents

Publication Publication Date Title
DE102017221223B4 (de) Anschlussverarbeitungsvorrichtung und halbleitervorrichtung, die mittels dieser hergestellt wird
DE102015210603B4 (de) Verfahren zur Herstellung einer Halbleitervorrichtung
DE112016002302B4 (de) Leistungs-Halbleitervorrichtung
DE69522116T2 (de) Einspritzung von einkapselungsmaterial auf ein optoelektronisches bauelement
DE112014007140B4 (de) Leistungshalbleiteranordnung und Verfahren zum Herstellen derselben
DE1564354B2 (de) Metallteil für seriengefertigte Halbleiter-Bauelemente
DE69534483T2 (de) Leiterrahmen und Halbleiterbauelement
DE112006003372T5 (de) Vorrichtung und Verfahren zur Montage eines oben und unten freiliegenden eingehausten Halbleiters
DE112017007135T5 (de) Halbleitervorrichtung und Verfahren zur Herstellung der Halbleitervorrichtung
DE69628964T2 (de) Harzvergossenes Halbleiterbauteil und Herstellungsverfahren
DE102016224796A1 (de) Anschlussquetschvorrichtung
DE19503823C2 (de) Verfahren zur Herstellung einer Halbleitervorrichtung
DE102014223863A1 (de) Leistungshalbleitereinrichtung
DE10138982A1 (de) Zuleitungsrahmen, unter Verwendung desselben hergestelltes Halbleiter-Bauelement und Verfahren zum Herstellen des Halbleiter-Bauelements
DE69024731T2 (de) Verfahren zur Herstellung einer plastikumhüllten Halbleiteranordnung
DE102005051313A1 (de) Fassung für elektrische Teile
DE102020203244A1 (de) Leistungshalbleitervorrichtung und Verfahren zu deren Herstellung
DE2221886A1 (de) Anschlussstueck fuer Halbleiterschaltungsbausteine und Verfahren zum Anschliessen eines Halbleiterschaltungsbausteines
DE10065535C2 (de) Spritzgießform
DE2557371A1 (de) Halbleiterelement
DE102007013100A1 (de) Verfahren zur Herstellung einer Wedge Wedge Drahtbrücke
DE112015007004B4 (de) Fertigungsverfahren für eine halbleitervorrichtung
DE102009042390A1 (de) Leistungshalbleitermodul und Verfahren zu dessen Herstellung
DE112006001866T5 (de) Gefalzter Rahmenträger für MOSFET GBA
EP3996894B1 (de) Gehäuse eines elektronikmoduls und dessen herstellung

Legal Events

Date Code Title Description
R012 Request for examination validly filed
R016 Response to examination communication
R018 Grant decision by examination section/examining division
R020 Patent grant now final
R084 Declaration of willingness to licence
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0021560000

Ipc: H10W0074010000