DE102013205446A1 - Werkstückeinbring- und Ausbringverfahren beim Doppelendflächenschleifen und eine Doppelendflächenschleifmaschine - Google Patents
Werkstückeinbring- und Ausbringverfahren beim Doppelendflächenschleifen und eine Doppelendflächenschleifmaschine Download PDFInfo
- Publication number
- DE102013205446A1 DE102013205446A1 DE102013205446A DE102013205446A DE102013205446A1 DE 102013205446 A1 DE102013205446 A1 DE 102013205446A1 DE 102013205446 A DE102013205446 A DE 102013205446A DE 102013205446 A DE102013205446 A DE 102013205446A DE 102013205446 A1 DE102013205446 A1 DE 102013205446A1
- Authority
- DE
- Germany
- Prior art keywords
- workpiece
- static pressure
- carrier
- pressure pad
- suction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 12
- 230000037431 insertion Effects 0.000 title claims description 7
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- 239000012530 fluid Substances 0.000 claims description 7
- 238000000605 extraction Methods 0.000 claims 1
- 238000012966 insertion method Methods 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 24
- 238000010586 diagram Methods 0.000 description 13
- 239000003795 chemical substances by application Substances 0.000 description 8
- 239000003570 air Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
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- 241000252254 Catostomidae Species 0.000 description 3
- 229940124447 delivery agent Drugs 0.000 description 3
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- 230000002996 emotional effect Effects 0.000 description 2
- BUHVIAUBTBOHAG-FOYDDCNASA-N (2r,3r,4s,5r)-2-[6-[[2-(3,5-dimethoxyphenyl)-2-(2-methylphenyl)ethyl]amino]purin-9-yl]-5-(hydroxymethyl)oxolane-3,4-diol Chemical compound COC1=CC(OC)=CC(C(CNC=2C=3N=CN(C=3N=CN=2)[C@H]2[C@@H]([C@H](O)[C@@H](CO)O2)O)C=2C(=CC=CC=2)C)=C1 BUHVIAUBTBOHAG-FOYDDCNASA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
- B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012086335A JP5872947B2 (ja) | 2012-04-05 | 2012-04-05 | 両頭平面研削におけるワーク搬入出方法及び両頭平面研削盤 |
| JP2012-086335 | 2012-04-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE102013205446A1 true DE102013205446A1 (de) | 2013-10-24 |
Family
ID=49290307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102013205446A Pending DE102013205446A1 (de) | 2012-04-05 | 2013-03-27 | Werkstückeinbring- und Ausbringverfahren beim Doppelendflächenschleifen und eine Doppelendflächenschleifmaschine |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5872947B2 (enrdf_load_stackoverflow) |
| KR (1) | KR102015666B1 (enrdf_load_stackoverflow) |
| DE (1) | DE102013205446A1 (enrdf_load_stackoverflow) |
| SG (1) | SG193771A1 (enrdf_load_stackoverflow) |
| TW (1) | TWI574781B (enrdf_load_stackoverflow) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6250435B2 (ja) * | 2014-02-26 | 2017-12-20 | 光洋機械工業株式会社 | 両頭平面研削法 |
| JP6183301B2 (ja) * | 2014-06-16 | 2017-08-23 | 信越半導体株式会社 | 自動ハンドリング装置 |
| JP6383700B2 (ja) * | 2015-04-07 | 2018-08-29 | 光洋機械工業株式会社 | 薄板状ワークの製造方法及び両頭平面研削装置 |
| JP6707831B2 (ja) | 2015-10-09 | 2020-06-10 | 株式会社Sumco | 研削装置および研削方法 |
| CN105448795B (zh) * | 2015-11-30 | 2018-03-16 | 北京中电科电子装备有限公司 | 一种晶圆抓取系统 |
| CN114227524A (zh) * | 2021-12-30 | 2022-03-25 | 西安奕斯伟材料科技有限公司 | 双面研磨装置和双面研磨方法 |
| CN115070604B (zh) * | 2022-06-09 | 2023-09-29 | 西安奕斯伟材料科技股份有限公司 | 双面研磨装置和双面研磨方法 |
| CN114986381B (zh) * | 2022-06-16 | 2023-08-22 | 西安奕斯伟材料科技股份有限公司 | 双面研磨装置和双面研磨方法 |
| CN117206999B (zh) * | 2023-11-08 | 2024-02-20 | 瓦房店威远滚动体制造有限公司 | 一种能够提高打磨精度的双端面磨床 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006332281A (ja) | 2005-05-25 | 2006-12-07 | Komatsu Electronic Metals Co Ltd | 半導体ウェーハの製造方法および両面研削方法並びに半導体ウェーハの両面研削装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10249687A (ja) * | 1997-03-07 | 1998-09-22 | Super Silicon Kenkyusho:Kk | 薄板状工作物の両面研削・研磨装置 |
| JP3951496B2 (ja) * | 1999-03-30 | 2007-08-01 | 光洋機械工業株式会社 | 薄板円板状ワークの両面研削装置 |
| JP4621261B2 (ja) * | 2008-02-01 | 2011-01-26 | 株式会社住友金属ファインテック | 両面研摩装置 |
-
2012
- 2012-04-05 JP JP2012086335A patent/JP5872947B2/ja active Active
-
2013
- 2013-03-27 DE DE102013205446A patent/DE102013205446A1/de active Pending
- 2013-03-28 KR KR1020130033289A patent/KR102015666B1/ko active Active
- 2013-04-02 TW TW102111803A patent/TWI574781B/zh active
- 2013-04-02 SG SG2013024195A patent/SG193771A1/en unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006332281A (ja) | 2005-05-25 | 2006-12-07 | Komatsu Electronic Metals Co Ltd | 半導体ウェーハの製造方法および両面研削方法並びに半導体ウェーハの両面研削装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20130113367A (ko) | 2013-10-15 |
| JP2013215813A (ja) | 2013-10-24 |
| SG193771A1 (en) | 2013-10-30 |
| JP5872947B2 (ja) | 2016-03-01 |
| TW201402271A (zh) | 2014-01-16 |
| TWI574781B (zh) | 2017-03-21 |
| KR102015666B1 (ko) | 2019-08-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R123 | Application deemed withdrawn due to non-payment of filing fee | ||
| R409 | Internal rectification of the legal status completed | ||
| R409 | Internal rectification of the legal status completed | ||
| R012 | Request for examination validly filed | ||
| R016 | Response to examination communication |