KR102015666B1 - 양두 평면 연삭에 있어서의 워크 반입출 방법 및 양두 평면 연삭기 - Google Patents

양두 평면 연삭에 있어서의 워크 반입출 방법 및 양두 평면 연삭기 Download PDF

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Publication number
KR102015666B1
KR102015666B1 KR1020130033289A KR20130033289A KR102015666B1 KR 102015666 B1 KR102015666 B1 KR 102015666B1 KR 1020130033289 A KR1020130033289 A KR 1020130033289A KR 20130033289 A KR20130033289 A KR 20130033289A KR 102015666 B1 KR102015666 B1 KR 102015666B1
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South Korea
Prior art keywords
workpiece
positive pressure
pressure pad
grinding
carrier
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KR1020130033289A
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Korean (ko)
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KR20130113367A (ko
Inventor
아츠시 시바나카
사토시 가와바타
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고요 기카이 고교 가부시키가이샤
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
KR1020130033289A 2012-04-05 2013-03-28 양두 평면 연삭에 있어서의 워크 반입출 방법 및 양두 평면 연삭기 Active KR102015666B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012086335A JP5872947B2 (ja) 2012-04-05 2012-04-05 両頭平面研削におけるワーク搬入出方法及び両頭平面研削盤
JPJP-P-2012-086335 2012-04-05

Publications (2)

Publication Number Publication Date
KR20130113367A KR20130113367A (ko) 2013-10-15
KR102015666B1 true KR102015666B1 (ko) 2019-08-28

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KR1020130033289A Active KR102015666B1 (ko) 2012-04-05 2013-03-28 양두 평면 연삭에 있어서의 워크 반입출 방법 및 양두 평면 연삭기

Country Status (5)

Country Link
JP (1) JP5872947B2 (enrdf_load_stackoverflow)
KR (1) KR102015666B1 (enrdf_load_stackoverflow)
DE (1) DE102013205446A1 (enrdf_load_stackoverflow)
SG (1) SG193771A1 (enrdf_load_stackoverflow)
TW (1) TWI574781B (enrdf_load_stackoverflow)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6250435B2 (ja) * 2014-02-26 2017-12-20 光洋機械工業株式会社 両頭平面研削法
JP6183301B2 (ja) * 2014-06-16 2017-08-23 信越半導体株式会社 自動ハンドリング装置
JP6383700B2 (ja) * 2015-04-07 2018-08-29 光洋機械工業株式会社 薄板状ワークの製造方法及び両頭平面研削装置
JP6707831B2 (ja) 2015-10-09 2020-06-10 株式会社Sumco 研削装置および研削方法
CN105448795B (zh) * 2015-11-30 2018-03-16 北京中电科电子装备有限公司 一种晶圆抓取系统
CN114227524A (zh) * 2021-12-30 2022-03-25 西安奕斯伟材料科技有限公司 双面研磨装置和双面研磨方法
CN115070604B (zh) * 2022-06-09 2023-09-29 西安奕斯伟材料科技股份有限公司 双面研磨装置和双面研磨方法
CN114986381B (zh) * 2022-06-16 2023-08-22 西安奕斯伟材料科技股份有限公司 双面研磨装置和双面研磨方法
CN117206999B (zh) * 2023-11-08 2024-02-20 瓦房店威远滚动体制造有限公司 一种能够提高打磨精度的双端面磨床

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000280155A (ja) * 1999-03-30 2000-10-10 Koyo Mach Ind Co Ltd 薄板円板状ワークの両面研削装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10249687A (ja) * 1997-03-07 1998-09-22 Super Silicon Kenkyusho:Kk 薄板状工作物の両面研削・研磨装置
JP4798480B2 (ja) * 2005-05-25 2011-10-19 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェーハの製造方法および両面研削方法並びに半導体ウェーハの両面研削装置
JP4621261B2 (ja) * 2008-02-01 2011-01-26 株式会社住友金属ファインテック 両面研摩装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000280155A (ja) * 1999-03-30 2000-10-10 Koyo Mach Ind Co Ltd 薄板円板状ワークの両面研削装置

Also Published As

Publication number Publication date
KR20130113367A (ko) 2013-10-15
DE102013205446A1 (de) 2013-10-24
JP2013215813A (ja) 2013-10-24
SG193771A1 (en) 2013-10-30
JP5872947B2 (ja) 2016-03-01
TW201402271A (zh) 2014-01-16
TWI574781B (zh) 2017-03-21

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