DE102011008836B4 - Elektrolyt und Verfahren zur Abscheidung von Kupfer-Zinn-Legierungsschichten - Google Patents

Elektrolyt und Verfahren zur Abscheidung von Kupfer-Zinn-Legierungsschichten Download PDF

Info

Publication number
DE102011008836B4
DE102011008836B4 DE102011008836A DE102011008836A DE102011008836B4 DE 102011008836 B4 DE102011008836 B4 DE 102011008836B4 DE 102011008836 A DE102011008836 A DE 102011008836A DE 102011008836 A DE102011008836 A DE 102011008836A DE 102011008836 B4 DE102011008836 B4 DE 102011008836B4
Authority
DE
Germany
Prior art keywords
electrolyte
acid
copper
tin
metals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE102011008836A
Other languages
German (de)
English (en)
Other versions
DE102011008836A1 (de
Inventor
Bernd Weymüller
Klaus Bronder
Uwe Manz
Frank Oberst
Mario Tomazzoni
Sascha Berger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Umicore Galvanotechnik GmbH
Original Assignee
Umicore Galvanotechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Umicore Galvanotechnik GmbH filed Critical Umicore Galvanotechnik GmbH
Priority to DE102011008836A priority Critical patent/DE102011008836B4/de
Publication of DE102011008836A1 publication Critical patent/DE102011008836A1/de
Application granted granted Critical
Publication of DE102011008836B4 publication Critical patent/DE102011008836B4/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/58Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/60Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16Apparatus for electrolytic coating of small objects in bulk

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
DE102011008836A 2010-08-17 2011-01-19 Elektrolyt und Verfahren zur Abscheidung von Kupfer-Zinn-Legierungsschichten Expired - Fee Related DE102011008836B4 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE102011008836A DE102011008836B4 (de) 2010-08-17 2011-01-19 Elektrolyt und Verfahren zur Abscheidung von Kupfer-Zinn-Legierungsschichten

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102010034646 2010-08-17
DE102010034646.2 2010-08-17
DE102011008836A DE102011008836B4 (de) 2010-08-17 2011-01-19 Elektrolyt und Verfahren zur Abscheidung von Kupfer-Zinn-Legierungsschichten

Publications (2)

Publication Number Publication Date
DE102011008836A1 DE102011008836A1 (de) 2012-02-23
DE102011008836B4 true DE102011008836B4 (de) 2013-01-10

Family

ID=44514714

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102011008836A Expired - Fee Related DE102011008836B4 (de) 2010-08-17 2011-01-19 Elektrolyt und Verfahren zur Abscheidung von Kupfer-Zinn-Legierungsschichten

Country Status (7)

Country Link
US (1) US20130140185A1 (https=)
EP (1) EP2606164A1 (https=)
JP (1) JP2013534276A (https=)
KR (1) KR20130098304A (https=)
CN (1) CN103069054B (https=)
DE (1) DE102011008836B4 (https=)
WO (1) WO2012022689A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012008544A1 (de) 2012-05-02 2013-11-07 Umicore Galvanotechnik Gmbh Verchromte Verbundwerkstoffe ohne Nickelschicht
EP2735627A1 (en) * 2012-11-26 2014-05-28 ATOTECH Deutschland GmbH Copper plating bath composition
US20160298249A1 (en) * 2014-09-30 2016-10-13 Rohm And Haas Electronic Materials Llc Cyanide-free electroplating baths for white bronze based on copper (i) ions
ES2762748T3 (es) 2015-05-22 2020-05-25 Basf Se Beta-naftoletersulfonatos, procedimiento para su preparación y su uso como mejoradores de brillo
CN105220189A (zh) * 2015-10-30 2016-01-06 无锡市嘉邦电力管道厂 一种钐-锡-铜合金电镀液及其电镀方法
DE102021117095A1 (de) 2021-07-02 2023-01-05 Umicore Galvanotechnik Gmbh Bronzeschichten als Edelmetallersatz
DE202021004169U1 (de) 2021-07-02 2022-12-07 Umicore Galvanotechnik Gmbh Bronzeschicht als Edelmetallersatz in Smart Cards

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1111097A2 (en) * 1999-12-22 2001-06-27 Nippon MacDermid Co., Ltd. Bright tin-copper alloy electroplating solution
EP1146148A2 (en) * 2000-04-14 2001-10-17 Nihon New Chrome Co. Ltd. Cyanide-free pyrophosphoric acid bath for use in copper-tin alloy plating
WO2004005528A2 (en) * 2002-07-05 2004-01-15 Nihon New Chrome Co., Ltd. Pyrophosphoric acid bath for use in copper-tin alloy plating
EP1408141A1 (de) * 2002-10-11 2004-04-14 Enthone Inc. Verfahren zur galvanischen Abscheidung von Bronzen
EP1325175B1 (de) * 2000-09-20 2005-05-04 Dr.Ing. Max Schlötter GmbH & Co. KG Elektrolyt und verfahren zur abscheidung von zinn-kupfer-legierungsschichten
EP1874982A1 (en) * 2005-04-14 2008-01-09 Enthone, Inc. Method for electrodeposition of bronzes

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3833486A (en) * 1973-03-26 1974-09-03 Lea Ronal Inc Cyanide-free electroplating
US5730854A (en) * 1996-05-30 1998-03-24 Enthone-Omi, Inc. Alkoxylated dimercaptans as copper additives and de-polarizing additives
US6251249B1 (en) * 1996-09-20 2001-06-26 Atofina Chemicals, Inc. Precious metal deposition composition and process
TW577938B (en) * 1998-11-05 2004-03-01 Uyemura C & Co Ltd Tin-copper alloy electroplating bath and plating process therewith
JP3433291B2 (ja) * 1999-09-27 2003-08-04 石原薬品株式会社 スズ−銅含有合金メッキ浴、スズ−銅含有合金メッキ方法及びスズ−銅含有合金メッキ皮膜が形成された物品
DE10046600C2 (de) * 2000-09-20 2003-02-20 Schloetter Fa Dr Ing Max Elektrolyt und Verfahren zur Abscheidung von Zinn-Kupfer-Legierungsschichten und Verwendung des Elektrolyten
DE60226196T2 (de) * 2001-05-24 2009-05-14 Shipley Co., L.L.C., Marlborough Zinn-Plattieren
BR0211457A (pt) * 2001-07-27 2004-08-17 Pirelli Processo eletrolìtico para depositar cobre sobre um cabo de aço, cabo de aço revestido com uma camada de latão, cordonel metálico e artigo feito de um material elastomérico vulcanizado
JP4698904B2 (ja) * 2001-09-20 2011-06-08 株式会社大和化成研究所 錫又は錫系合金めっき浴、該めっき浴の建浴用又は維持・補給用の錫塩及び酸又は錯化剤溶液並びに該めっき浴を用いて製作した電気・電子部品
JP3876383B2 (ja) * 2002-06-03 2007-01-31 京都市 銅−錫合金めっき浴及び該めっき浴を用いた銅−錫合金めっき方法
JP4332667B2 (ja) * 2003-10-16 2009-09-16 石原薬品株式会社 スズ及びスズ合金メッキ浴
TW200613586A (en) * 2004-07-22 2006-05-01 Rohm & Haas Elect Mat Leveler compounds

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1111097A2 (en) * 1999-12-22 2001-06-27 Nippon MacDermid Co., Ltd. Bright tin-copper alloy electroplating solution
EP1146148A2 (en) * 2000-04-14 2001-10-17 Nihon New Chrome Co. Ltd. Cyanide-free pyrophosphoric acid bath for use in copper-tin alloy plating
EP1325175B1 (de) * 2000-09-20 2005-05-04 Dr.Ing. Max Schlötter GmbH & Co. KG Elektrolyt und verfahren zur abscheidung von zinn-kupfer-legierungsschichten
WO2004005528A2 (en) * 2002-07-05 2004-01-15 Nihon New Chrome Co., Ltd. Pyrophosphoric acid bath for use in copper-tin alloy plating
EP1408141A1 (de) * 2002-10-11 2004-04-14 Enthone Inc. Verfahren zur galvanischen Abscheidung von Bronzen
EP1874982A1 (en) * 2005-04-14 2008-01-09 Enthone, Inc. Method for electrodeposition of bronzes

Also Published As

Publication number Publication date
WO2012022689A1 (en) 2012-02-23
US20130140185A1 (en) 2013-06-06
CN103069054A (zh) 2013-04-24
JP2013534276A (ja) 2013-09-02
KR20130098304A (ko) 2013-09-04
DE102011008836A1 (de) 2012-02-23
CN103069054B (zh) 2016-08-10
EP2606164A1 (en) 2013-06-26

Similar Documents

Publication Publication Date Title
DE102011008836B4 (de) Elektrolyt und Verfahren zur Abscheidung von Kupfer-Zinn-Legierungsschichten
EP2116634B1 (de) Modifizierter Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten
EP1961840B1 (de) Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten
DE102008050135B4 (de) Verfahren zur Abscheidung von Platin-Rhodiumschichten mit verbesserter Helligkeit
DE102008032398A1 (de) Verbesserter Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten
EP1408141B1 (de) Verfahren und Elektrolyt zur galvanischen Abscheidung von Bronzen
AT514818A1 (de) Abscheidung von Cu, Sn, Zn-Beschichtungen auf metallischen Substraten
DE102009024396A1 (de) Cyanid-freier Elektrolyt zur galvanischen Abscheidung von Gold oder dessen Legierungen
EP2130948A1 (de) Pyrophosphathaltiges Bad zur cyanidfreien Abscheidung von Kupfer-Zinn-Legierungen
DE2355581B2 (https=)
JP2013534276A5 (https=)
DE2143806C3 (de) Bad zur galvanischen Abscheidung blanker bis glänzender Blei-Zinn-Legierungsschichten
EP3067444B1 (de) Abscheidung von dekorativen palladium-eisen-legierungsbeschichtungen auf metallischen substanzen
AT514427B1 (de) Elektrolytbad sowie damit erhältliche Objekte bzw. Artikel
EP0115020B1 (de) Saures galvanisches Zinkbad
DE19924895B4 (de) Verfahren zur Herstellung einer cyanidfreien, für galvanische Gold-Bäder geeigneten Goldverbindungslösung
DE102020131371B4 (de) Verwendung eines Elektrolyten zur Erzeugung einer Rutheniumlegierungsschicht
DE102020133188B4 (de) Verwendung eines Silber-Bismut-Elektrolyt zur Abscheidung von Hartsilberschichten
EP0163944A2 (de) Wässrige, saure, Nickel- und Cobalt-Ionen enthaltende Elektrolyte zur galvanischen Abscheidung von harten, anlaufbeständigen, weiss glänzenden Legierungsüberzügen
DE102011056318B3 (de) Elektrolytisches Bad zum Abscheiden einer Goldkupferlegierung
AT528141A1 (de) Elektrolytbad zur Abscheidung einer Palladium-Zinn-Legierung
HK1152352B (en) Modified copper-tin electrolyte and process for the deposition of bronze layers

Legal Events

Date Code Title Description
R016 Response to examination communication
R016 Response to examination communication
R018 Grant decision by examination section/examining division
R020 Patent grant now final

Effective date: 20130411

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee