KR20130098304A - 구리-주석 합금 층들을 전착시키기 위한 전해질 및 공정 - Google Patents

구리-주석 합금 층들을 전착시키기 위한 전해질 및 공정 Download PDF

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Publication number
KR20130098304A
KR20130098304A KR1020137003759A KR20137003759A KR20130098304A KR 20130098304 A KR20130098304 A KR 20130098304A KR 1020137003759 A KR1020137003759 A KR 1020137003759A KR 20137003759 A KR20137003759 A KR 20137003759A KR 20130098304 A KR20130098304 A KR 20130098304A
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KR
South Korea
Prior art keywords
electrolyte
acid
copper
tin
range
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020137003759A
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English (en)
Korean (ko)
Inventor
베른트 바이흐뮬러
클라우스 브론더
우베 만츠
프랑크 오베르스트
마리오 토마초니
사샤 베르거
Original Assignee
유미코아 갈바노테히닉 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 유미코아 갈바노테히닉 게엠베하 filed Critical 유미코아 갈바노테히닉 게엠베하
Publication of KR20130098304A publication Critical patent/KR20130098304A/ko
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
KR1020137003759A 2010-08-17 2011-08-12 구리-주석 합금 층들을 전착시키기 위한 전해질 및 공정 Ceased KR20130098304A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102010034646 2010-08-17
DE102010034646.2 2010-08-17
PCT/EP2011/063923 WO2012022689A1 (en) 2010-08-17 2011-08-12 Electrolyte and process for the deposition of copper-tin alloy layers

Publications (1)

Publication Number Publication Date
KR20130098304A true KR20130098304A (ko) 2013-09-04

Family

ID=44514714

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137003759A Ceased KR20130098304A (ko) 2010-08-17 2011-08-12 구리-주석 합금 층들을 전착시키기 위한 전해질 및 공정

Country Status (7)

Country Link
US (1) US20130140185A1 (https=)
EP (1) EP2606164A1 (https=)
JP (1) JP2013534276A (https=)
KR (1) KR20130098304A (https=)
CN (1) CN103069054B (https=)
DE (1) DE102011008836B4 (https=)
WO (1) WO2012022689A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012008544A1 (de) 2012-05-02 2013-11-07 Umicore Galvanotechnik Gmbh Verchromte Verbundwerkstoffe ohne Nickelschicht
EP2735627A1 (en) * 2012-11-26 2014-05-28 ATOTECH Deutschland GmbH Copper plating bath composition
US20160298249A1 (en) * 2014-09-30 2016-10-13 Rohm And Haas Electronic Materials Llc Cyanide-free electroplating baths for white bronze based on copper (i) ions
ES2762748T3 (es) 2015-05-22 2020-05-25 Basf Se Beta-naftoletersulfonatos, procedimiento para su preparación y su uso como mejoradores de brillo
CN105220189A (zh) * 2015-10-30 2016-01-06 无锡市嘉邦电力管道厂 一种钐-锡-铜合金电镀液及其电镀方法
DE102021117095A1 (de) 2021-07-02 2023-01-05 Umicore Galvanotechnik Gmbh Bronzeschichten als Edelmetallersatz
DE202021004169U1 (de) 2021-07-02 2022-12-07 Umicore Galvanotechnik Gmbh Bronzeschicht als Edelmetallersatz in Smart Cards

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3833486A (en) * 1973-03-26 1974-09-03 Lea Ronal Inc Cyanide-free electroplating
US5730854A (en) * 1996-05-30 1998-03-24 Enthone-Omi, Inc. Alkoxylated dimercaptans as copper additives and de-polarizing additives
US6251249B1 (en) * 1996-09-20 2001-06-26 Atofina Chemicals, Inc. Precious metal deposition composition and process
TW577938B (en) * 1998-11-05 2004-03-01 Uyemura C & Co Ltd Tin-copper alloy electroplating bath and plating process therewith
JP3433291B2 (ja) * 1999-09-27 2003-08-04 石原薬品株式会社 スズ−銅含有合金メッキ浴、スズ−銅含有合金メッキ方法及びスズ−銅含有合金メッキ皮膜が形成された物品
JP2001181889A (ja) * 1999-12-22 2001-07-03 Nippon Macdermid Kk 光沢錫−銅合金電気めっき浴
JP3455712B2 (ja) * 2000-04-14 2003-10-14 日本ニュークローム株式会社 銅−スズ合金めっき用ピロリン酸浴
DE10046600C2 (de) * 2000-09-20 2003-02-20 Schloetter Fa Dr Ing Max Elektrolyt und Verfahren zur Abscheidung von Zinn-Kupfer-Legierungsschichten und Verwendung des Elektrolyten
JP2004510053A (ja) * 2000-09-20 2004-04-02 デーエル．−イーエヌゲー．マックス　シュレッター　ゲーエムベーハー　ウント　ツェーオー．カーゲー 錫−銅合金層を析出させるための電解質及び方法
DE60226196T2 (de) * 2001-05-24 2009-05-14 Shipley Co., L.L.C., Marlborough Zinn-Plattieren
BR0211457A (pt) * 2001-07-27 2004-08-17 Pirelli Processo eletrolìtico para depositar cobre sobre um cabo de aço, cabo de aço revestido com uma camada de latão, cordonel metálico e artigo feito de um material elastomérico vulcanizado
JP4698904B2 (ja) * 2001-09-20 2011-06-08 株式会社大和化成研究所 錫又は錫系合金めっき浴、該めっき浴の建浴用又は維持・補給用の錫塩及び酸又は錯化剤溶液並びに該めっき浴を用いて製作した電気・電子部品
JP3876383B2 (ja) * 2002-06-03 2007-01-31 京都市 銅−錫合金めっき浴及び該めっき浴を用いた銅−錫合金めっき方法
JP4249438B2 (ja) * 2002-07-05 2009-04-02 日本ニュークローム株式会社 銅―錫合金めっき用ピロリン酸浴
ES2531163T3 (es) * 2002-10-11 2015-03-11 Enthone Procedimiento y electrolito para la deposición galvánica de bronces
JP4332667B2 (ja) * 2003-10-16 2009-09-16 石原薬品株式会社 スズ及びスズ合金メッキ浴
TW200613586A (en) * 2004-07-22 2006-05-01 Rohm & Haas Elect Mat Leveler compounds
US20060260948A2 (en) * 2005-04-14 2006-11-23 Enthone Inc. Method for electrodeposition of bronzes

Also Published As

Publication number Publication date
WO2012022689A1 (en) 2012-02-23
US20130140185A1 (en) 2013-06-06
CN103069054A (zh) 2013-04-24
JP2013534276A (ja) 2013-09-02
DE102011008836A1 (de) 2012-02-23
CN103069054B (zh) 2016-08-10
DE102011008836B4 (de) 2013-01-10
EP2606164A1 (en) 2013-06-26

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