CN103069054B - 用于沉积铜-锡合金层的电解质和方法 - Google Patents

用于沉积铜-锡合金层的电解质和方法 Download PDF

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Publication number
CN103069054B
CN103069054B CN201180038728.8A CN201180038728A CN103069054B CN 103069054 B CN103069054 B CN 103069054B CN 201180038728 A CN201180038728 A CN 201180038728A CN 103069054 B CN103069054 B CN 103069054B
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CN
China
Prior art keywords
electrolyte
acid
copper
tin
range
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201180038728.8A
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English (en)
Chinese (zh)
Other versions
CN103069054A (zh
Inventor
B·威伊米勒
K·布隆德
U·曼茨
F·奥伯斯特
M·托马佐尼
S·博格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Umicore Galvanotechnik GmbH
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Umicore Galvanotechnik GmbH
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Publication of CN103069054A publication Critical patent/CN103069054A/zh
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Publication of CN103069054B publication Critical patent/CN103069054B/zh
Expired - Fee Related legal-status Critical Current
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
CN201180038728.8A 2010-08-17 2011-08-12 用于沉积铜-锡合金层的电解质和方法 Expired - Fee Related CN103069054B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102010034646 2010-08-17
DE102010034646.2 2010-08-17
PCT/EP2011/063923 WO2012022689A1 (en) 2010-08-17 2011-08-12 Electrolyte and process for the deposition of copper-tin alloy layers

Publications (2)

Publication Number Publication Date
CN103069054A CN103069054A (zh) 2013-04-24
CN103069054B true CN103069054B (zh) 2016-08-10

Family

ID=44514714

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180038728.8A Expired - Fee Related CN103069054B (zh) 2010-08-17 2011-08-12 用于沉积铜-锡合金层的电解质和方法

Country Status (7)

Country Link
US (1) US20130140185A1 (https=)
EP (1) EP2606164A1 (https=)
JP (1) JP2013534276A (https=)
KR (1) KR20130098304A (https=)
CN (1) CN103069054B (https=)
DE (1) DE102011008836B4 (https=)
WO (1) WO2012022689A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012008544A1 (de) 2012-05-02 2013-11-07 Umicore Galvanotechnik Gmbh Verchromte Verbundwerkstoffe ohne Nickelschicht
EP2735627A1 (en) * 2012-11-26 2014-05-28 ATOTECH Deutschland GmbH Copper plating bath composition
US20160298249A1 (en) * 2014-09-30 2016-10-13 Rohm And Haas Electronic Materials Llc Cyanide-free electroplating baths for white bronze based on copper (i) ions
ES2762748T3 (es) 2015-05-22 2020-05-25 Basf Se Beta-naftoletersulfonatos, procedimiento para su preparación y su uso como mejoradores de brillo
CN105220189A (zh) * 2015-10-30 2016-01-06 无锡市嘉邦电力管道厂 一种钐-锡-铜合金电镀液及其电镀方法
DE102021117095A1 (de) 2021-07-02 2023-01-05 Umicore Galvanotechnik Gmbh Bronzeschichten als Edelmetallersatz
DE202021004169U1 (de) 2021-07-02 2022-12-07 Umicore Galvanotechnik Gmbh Bronzeschicht als Edelmetallersatz in Smart Cards

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3833486A (en) * 1973-03-26 1974-09-03 Lea Ronal Inc Cyanide-free electroplating
CN1220709A (zh) * 1996-05-30 1999-06-23 恩索恩Omi公司 作铜添加剂用的烷氧基化二硫醇
DE10046600A1 (de) * 2000-09-20 2002-04-25 Schloetter Fa Dr Ing Max Elektrolyt und Verfahren zur Abscheidung von Zinn-Kupfer-Legierungsschichten
US20020104763A1 (en) * 1998-11-05 2002-08-08 Isamu Yanada Tin - copper alloy electroplating bath and plating process therewith
US20030150743A1 (en) * 2001-09-20 2003-08-14 Daiwa Fine Chemicals Co., Ltd. Tin or tin alloy plating bath, tin salt solution and acid or complexing agent solution for preparing or controlling and making up the plating bath, and electrical and electric components prepared by the use of the plating bath
US20040247865A1 (en) * 2001-07-27 2004-12-09 Federico Pavan Electrolytic process for depositing a layer of copper on a steel wire
CN1733978A (zh) * 2004-07-22 2006-02-15 罗门哈斯电子材料有限公司 匀涂剂化合物
CN101194049A (zh) * 2005-04-14 2008-06-04 恩索恩公司 电沉积青铜的方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6251249B1 (en) * 1996-09-20 2001-06-26 Atofina Chemicals, Inc. Precious metal deposition composition and process
JP3433291B2 (ja) * 1999-09-27 2003-08-04 石原薬品株式会社 スズ−銅含有合金メッキ浴、スズ−銅含有合金メッキ方法及びスズ−銅含有合金メッキ皮膜が形成された物品
JP2001181889A (ja) * 1999-12-22 2001-07-03 Nippon Macdermid Kk 光沢錫−銅合金電気めっき浴
JP3455712B2 (ja) * 2000-04-14 2003-10-14 日本ニュークローム株式会社 銅−スズ合金めっき用ピロリン酸浴
JP2004510053A (ja) * 2000-09-20 2004-04-02 デーエル．−イーエヌゲー．マックス　シュレッター　ゲーエムベーハー　ウント　ツェーオー．カーゲー 錫−銅合金層を析出させるための電解質及び方法
DE60226196T2 (de) * 2001-05-24 2009-05-14 Shipley Co., L.L.C., Marlborough Zinn-Plattieren
JP3876383B2 (ja) * 2002-06-03 2007-01-31 京都市 銅−錫合金めっき浴及び該めっき浴を用いた銅−錫合金めっき方法
JP4249438B2 (ja) * 2002-07-05 2009-04-02 日本ニュークローム株式会社 銅―錫合金めっき用ピロリン酸浴
ES2531163T3 (es) * 2002-10-11 2015-03-11 Enthone Procedimiento y electrolito para la deposición galvánica de bronces
JP4332667B2 (ja) * 2003-10-16 2009-09-16 石原薬品株式会社 スズ及びスズ合金メッキ浴

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3833486A (en) * 1973-03-26 1974-09-03 Lea Ronal Inc Cyanide-free electroplating
CN1220709A (zh) * 1996-05-30 1999-06-23 恩索恩Omi公司 作铜添加剂用的烷氧基化二硫醇
US20020104763A1 (en) * 1998-11-05 2002-08-08 Isamu Yanada Tin - copper alloy electroplating bath and plating process therewith
DE10046600A1 (de) * 2000-09-20 2002-04-25 Schloetter Fa Dr Ing Max Elektrolyt und Verfahren zur Abscheidung von Zinn-Kupfer-Legierungsschichten
US20040247865A1 (en) * 2001-07-27 2004-12-09 Federico Pavan Electrolytic process for depositing a layer of copper on a steel wire
US20030150743A1 (en) * 2001-09-20 2003-08-14 Daiwa Fine Chemicals Co., Ltd. Tin or tin alloy plating bath, tin salt solution and acid or complexing agent solution for preparing or controlling and making up the plating bath, and electrical and electric components prepared by the use of the plating bath
CN1733978A (zh) * 2004-07-22 2006-02-15 罗门哈斯电子材料有限公司 匀涂剂化合物
CN101194049A (zh) * 2005-04-14 2008-06-04 恩索恩公司 电沉积青铜的方法

Also Published As

Publication number Publication date
WO2012022689A1 (en) 2012-02-23
US20130140185A1 (en) 2013-06-06
CN103069054A (zh) 2013-04-24
JP2013534276A (ja) 2013-09-02
KR20130098304A (ko) 2013-09-04
DE102011008836A1 (de) 2012-02-23
DE102011008836B4 (de) 2013-01-10
EP2606164A1 (en) 2013-06-26

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