DE102010064378A1 - Organische lichtemittierende Diodenanzeige - Google Patents
Organische lichtemittierende Diodenanzeige Download PDFInfo
- Publication number
- DE102010064378A1 DE102010064378A1 DE102010064378A DE102010064378A DE102010064378A1 DE 102010064378 A1 DE102010064378 A1 DE 102010064378A1 DE 102010064378 A DE102010064378 A DE 102010064378A DE 102010064378 A DE102010064378 A DE 102010064378A DE 102010064378 A1 DE102010064378 A1 DE 102010064378A1
- Authority
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- Germany
- Prior art keywords
- layer
- organic light
- organic
- photofunctional
- oled display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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- 239000010410 layer Substances 0.000 claims abstract description 119
- 238000005538 encapsulation Methods 0.000 claims abstract description 40
- 239000012044 organic layer Substances 0.000 claims abstract description 40
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 230000005855 radiation Effects 0.000 claims description 8
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 7
- 229910016036 BaF 2 Inorganic materials 0.000 claims description 6
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 6
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 6
- 239000012965 benzophenone Substances 0.000 claims description 6
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 claims description 6
- 239000004925 Acrylic resin Substances 0.000 claims description 5
- 229920000178 Acrylic resin Polymers 0.000 claims description 5
- 230000000903 blocking effect Effects 0.000 claims description 4
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 claims description 3
- 239000010409 thin film Substances 0.000 description 12
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 239000003990 capacitor Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007735 ion beam assisted deposition Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XVIZMMSINIOIQP-UHFFFAOYSA-N 1,2-dichloro-3-(2-chlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C(=CC=CC=2)Cl)=C1Cl XVIZMMSINIOIQP-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
- H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/351—Thickness
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- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Surface Treatment Of Optical Elements (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2010-0000206 | 2010-01-04 | ||
KR1020100000206A KR101155904B1 (ko) | 2010-01-04 | 2010-01-04 | 유기 발광 표시 장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE102010064378A1 true DE102010064378A1 (de) | 2011-07-21 |
Family
ID=44224190
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102010064378A Ceased DE102010064378A1 (de) | 2010-01-04 | 2010-12-30 | Organische lichtemittierende Diodenanzeige |
Country Status (6)
Country | Link |
---|---|
US (2) | US20110163330A1 (zh) |
JP (2) | JP2011138748A (zh) |
KR (1) | KR101155904B1 (zh) |
CN (1) | CN102157543B (zh) |
DE (1) | DE102010064378A1 (zh) |
TW (1) | TWI455386B (zh) |
Families Citing this family (55)
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US11038144B2 (en) * | 2010-12-16 | 2021-06-15 | Samsung Display Co., Ltd. | Organic light-emitting display apparatus |
KR101784994B1 (ko) * | 2011-03-31 | 2017-10-13 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
US9853245B2 (en) | 2011-10-14 | 2017-12-26 | Samsung Display Co., Ltd. | Organic light emitting diode display and method for manufacturing the same |
KR101892711B1 (ko) * | 2011-12-28 | 2018-08-29 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법 |
KR101363121B1 (ko) * | 2012-06-07 | 2014-02-14 | 엘지디스플레이 주식회사 | 유기전계발광표시장치 및 그 제조방법 |
KR101935552B1 (ko) | 2012-06-27 | 2019-04-08 | 삼성디스플레이 주식회사 | 가요성 표시 패널 및 상기 가요성 표시 패널을 포함하는 표시 장치 |
KR101903054B1 (ko) * | 2012-07-11 | 2018-10-02 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법 |
JP6142151B2 (ja) * | 2012-07-31 | 2017-06-07 | 株式会社Joled | 表示装置および電子機器 |
KR20140018548A (ko) * | 2012-08-02 | 2014-02-13 | 삼성디스플레이 주식회사 | 광효율이 향상된 유기발광 표시장치 및 그 제조방법 |
JP6210473B2 (ja) * | 2012-08-03 | 2017-10-11 | 国立大学法人山形大学 | 有機光学デバイス及びこれを用いた有機電子デバイス |
KR101970361B1 (ko) * | 2012-08-20 | 2019-04-19 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 이의 제조방법 |
US8598786B1 (en) * | 2012-10-23 | 2013-12-03 | Samsung Display Co., Ltd. | Organic light-emitting display apparatus having a hydroxyquinoline-based layer as part of the sealing structure and method of manufacturing the same |
KR101410102B1 (ko) * | 2012-11-20 | 2014-06-27 | 삼성디스플레이 주식회사 | 유기발광 표시장치 |
US9692010B2 (en) | 2012-11-20 | 2017-06-27 | Samsung Display Co., Ltd. | Organic light emitting display device |
KR101502206B1 (ko) | 2012-11-20 | 2015-03-12 | 삼성디스플레이 주식회사 | 발광효율이 향상된 유기발광 표시장치 |
US9349988B2 (en) | 2012-11-20 | 2016-05-24 | Samsung Display Co., Ltd. | Organic light emitting display device |
CN103904240A (zh) * | 2012-12-25 | 2014-07-02 | 海洋王照明科技股份有限公司 | 有机电致发光器件及其制备方法 |
KR101991100B1 (ko) * | 2013-01-09 | 2019-06-20 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
KR102103421B1 (ko) | 2013-02-07 | 2020-04-23 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
WO2014137529A1 (en) * | 2013-03-04 | 2014-09-12 | Applied Materials, Inc. | Fluorine-containing plasma polymerized hmdso for oled thin film encapsulation |
KR102028680B1 (ko) * | 2013-03-20 | 2019-11-05 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
CN104078593A (zh) * | 2013-03-27 | 2014-10-01 | 海洋王照明科技股份有限公司 | 一种有机电致发光器件及其制备方法 |
KR102111562B1 (ko) * | 2013-04-25 | 2020-05-18 | 삼성디스플레이 주식회사 | 표시 장치 |
KR102047006B1 (ko) * | 2013-06-07 | 2019-12-03 | 삼성디스플레이 주식회사 | 유기발광표시장치 |
TWM506372U (zh) * | 2013-07-03 | 2015-08-01 | Rosenberger Hochfrequenztech | 晶粒封裝所使用的引線 |
KR20150011231A (ko) * | 2013-07-22 | 2015-01-30 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 이의 제조 방법 |
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US9293730B2 (en) | 2013-10-15 | 2016-03-22 | Samsung Display Co., Ltd. | Flexible organic light emitting diode display and manufacturing method thereof |
KR102212764B1 (ko) * | 2013-10-15 | 2021-02-08 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 이의 제조 방법 |
KR102193783B1 (ko) * | 2013-11-28 | 2020-12-23 | 삼성디스플레이 주식회사 | 유기 발광 표시장치 |
CN103715366A (zh) | 2013-12-20 | 2014-04-09 | 京东方科技集团股份有限公司 | Oled薄膜封装结构、oled器件以及显示装置 |
JP6490921B2 (ja) * | 2014-08-08 | 2019-03-27 | 株式会社ジャパンディスプレイ | 表示装置、及びその製造方法 |
KR20160019589A (ko) * | 2014-08-11 | 2016-02-22 | 삼성디스플레이 주식회사 | 플렉서블 디스플레이 장치와, 이의 제조 방법 |
CN104269426A (zh) * | 2014-09-01 | 2015-01-07 | 京东方科技集团股份有限公司 | 一种显示面板及其制备方法和显示装置 |
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US20160322603A1 (en) * | 2015-04-30 | 2016-11-03 | EverDisplay Optonics (Shanghai) Limited | Display structure and manufacturing method of display device |
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CN105514298B (zh) * | 2015-12-31 | 2018-12-18 | 固安翌光科技有限公司 | 一种薄膜封装结构及薄膜封装方法 |
JP2017147191A (ja) * | 2016-02-19 | 2017-08-24 | 株式会社ジャパンディスプレイ | 表示装置、及び表示装置の製造方法 |
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KR102608091B1 (ko) * | 2016-10-07 | 2023-12-04 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
CN108039421B (zh) * | 2017-12-27 | 2020-05-05 | 武汉华星光电半导体显示技术有限公司 | 一种oled薄膜封装结构及封装方法 |
US10497838B2 (en) * | 2018-04-12 | 2019-12-03 | Osram Opto Semiconductors Gmbh | Method for producing an optic device, optic device and assembly comprising such an optic device |
CN109103219A (zh) * | 2018-08-10 | 2018-12-28 | 武汉华星光电半导体显示技术有限公司 | 复合膜层及其制作方法、oled显示面板的制作方法 |
KR102021029B1 (ko) * | 2018-10-16 | 2019-09-16 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 이의 제조 방법 |
CN109509776A (zh) * | 2018-11-22 | 2019-03-22 | 武汉华星光电技术有限公司 | 一种oled显示器 |
TWI688094B (zh) * | 2019-04-17 | 2020-03-11 | 友達光電股份有限公司 | 發光裝置 |
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-
2010
- 2010-01-04 KR KR1020100000206A patent/KR101155904B1/ko active IP Right Grant
- 2010-09-16 JP JP2010208412A patent/JP2011138748A/ja active Pending
- 2010-12-30 TW TW099146865A patent/TWI455386B/zh active
- 2010-12-30 DE DE102010064378A patent/DE102010064378A1/de not_active Ceased
-
2011
- 2011-01-04 US US12/984,518 patent/US20110163330A1/en not_active Abandoned
- 2011-01-04 CN CN201110004261.7A patent/CN102157543B/zh active Active
-
2012
- 2012-10-05 US US13/646,543 patent/US8735936B2/en active Active
-
2014
- 2014-05-07 JP JP2014096267A patent/JP6072724B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2014179335A (ja) | 2014-09-25 |
KR101155904B1 (ko) | 2012-06-20 |
TW201208172A (en) | 2012-02-16 |
JP2011138748A (ja) | 2011-07-14 |
CN102157543B (zh) | 2015-05-06 |
JP6072724B2 (ja) | 2017-02-01 |
US8735936B2 (en) | 2014-05-27 |
US20130037792A1 (en) | 2013-02-14 |
CN102157543A (zh) | 2011-08-17 |
KR20110080050A (ko) | 2011-07-12 |
US20110163330A1 (en) | 2011-07-07 |
TWI455386B (zh) | 2014-10-01 |
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