DE102009008738A1 - Halbleiteranordnung und Verfahren zum Herstellen einer Halbleiteranordnung - Google Patents

Halbleiteranordnung und Verfahren zum Herstellen einer Halbleiteranordnung Download PDF

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Publication number
DE102009008738A1
DE102009008738A1 DE102009008738A DE102009008738A DE102009008738A1 DE 102009008738 A1 DE102009008738 A1 DE 102009008738A1 DE 102009008738 A DE102009008738 A DE 102009008738A DE 102009008738 A DE102009008738 A DE 102009008738A DE 102009008738 A1 DE102009008738 A1 DE 102009008738A1
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DE
Germany
Prior art keywords
semiconductor
conductor
arrangement
semiconductor device
conductor arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102009008738A
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German (de)
English (en)
Inventor
Matthias Sperl
Michael Dr. Zitzlsperger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Priority to DE102009008738A priority Critical patent/DE102009008738A1/de
Priority to CN201080007536.6A priority patent/CN102318090B/zh
Priority to US13/127,623 priority patent/US8710609B2/en
Priority to JP2011549511A priority patent/JP5385411B2/ja
Priority to EP10701548.9A priority patent/EP2396832B1/de
Priority to PCT/EP2010/051116 priority patent/WO2010091967A1/de
Priority to KR1020117021181A priority patent/KR101616153B1/ko
Priority to TW099103472A priority patent/TWI422076B/zh
Publication of DE102009008738A1 publication Critical patent/DE102009008738A1/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/458—Materials of insulating layers on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
DE102009008738A 2009-02-12 2009-02-12 Halbleiteranordnung und Verfahren zum Herstellen einer Halbleiteranordnung Withdrawn DE102009008738A1 (de)

Priority Applications (8)

Application Number Priority Date Filing Date Title
DE102009008738A DE102009008738A1 (de) 2009-02-12 2009-02-12 Halbleiteranordnung und Verfahren zum Herstellen einer Halbleiteranordnung
CN201080007536.6A CN102318090B (zh) 2009-02-12 2010-01-29 封装过的带有焊接停止层的光电子半导体装置以及相应方法
US13/127,623 US8710609B2 (en) 2009-02-12 2010-01-29 Semiconductor arrangement with a solder resist layer
JP2011549511A JP5385411B2 (ja) 2009-02-12 2010-01-29 半導体構造および半導体構造の製造方法
EP10701548.9A EP2396832B1 (de) 2009-02-12 2010-01-29 Verkapselte optoeleketronische halbleiteranordnung mit lötstoppschicht und entsprechendes verfahren
PCT/EP2010/051116 WO2010091967A1 (de) 2009-02-12 2010-01-29 Verkapselte optoeleketronische halbleiteranordnung mit lötstoppschicht und entsprechendes verfahren
KR1020117021181A KR101616153B1 (ko) 2009-02-12 2010-01-29 땜납 레지스트층을 갖는 봉지된 광전 반도체 장치 및 그 제조 방법
TW099103472A TWI422076B (zh) 2009-02-12 2010-02-05 半導體裝置及半導體裝置之製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102009008738A DE102009008738A1 (de) 2009-02-12 2009-02-12 Halbleiteranordnung und Verfahren zum Herstellen einer Halbleiteranordnung

Publications (1)

Publication Number Publication Date
DE102009008738A1 true DE102009008738A1 (de) 2010-08-19

Family

ID=42091769

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102009008738A Withdrawn DE102009008738A1 (de) 2009-02-12 2009-02-12 Halbleiteranordnung und Verfahren zum Herstellen einer Halbleiteranordnung

Country Status (8)

Country Link
US (1) US8710609B2 (https=)
EP (1) EP2396832B1 (https=)
JP (1) JP5385411B2 (https=)
KR (1) KR101616153B1 (https=)
CN (1) CN102318090B (https=)
DE (1) DE102009008738A1 (https=)
TW (1) TWI422076B (https=)
WO (1) WO2010091967A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010027313A1 (de) * 2010-07-16 2012-01-19 Osram Opto Semiconductors Gmbh Trägervorrichtung für einen Halbleiterchip, elektronisches Bauelement mit einer Trägervorrichtung und optoelektronisches Bauelement mit einer Trägervorrichtung
EP2531010A3 (en) * 2011-06-03 2014-11-26 Toshiba Lighting & Technology Corporation Light-emitting device and luminaire
CN116435201A (zh) * 2023-06-12 2023-07-14 四川遂宁市利普芯微电子有限公司 一种塑封封装方法以及器件封装结构

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DE102010026344A1 (de) * 2010-07-07 2012-01-12 Osram Opto Semiconductors Gmbh Leuchtdiode
JP5652175B2 (ja) * 2010-12-08 2015-01-14 日亜化学工業株式会社 発光装置及びその製造方法
US9397274B2 (en) 2011-08-24 2016-07-19 Lg Innotek Co., Ltd. Light emitting device package
KR101849712B1 (ko) * 2011-09-02 2018-04-17 엘지이노텍 주식회사 발광소자 패키지, 백라이트 유닛 및 영상표시장치
US8803326B2 (en) * 2011-11-15 2014-08-12 Xintec Inc. Chip package
US20130307013A1 (en) * 2012-05-15 2013-11-21 Avago Technlogies Ecbu Ip (Singapore) Pte. Ltd. Light emitting device with dark layer
JP2015115432A (ja) * 2013-12-11 2015-06-22 ローム株式会社 半導体装置
DE102014104819A1 (de) * 2014-03-26 2015-10-01 Heraeus Deutschland GmbH & Co. KG Träger und/oder Clip für Halbleiterelemente, Halbleiterbauelement und Verfahren zur Herstellung
JP2017157593A (ja) * 2016-02-29 2017-09-07 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 発光ダイオード、発光ダイオードの製造方法、発光ダイオード表示装置及び発光ダイオード表示装置の製造方法
DE102016124373A1 (de) * 2016-12-14 2018-06-14 Osram Opto Semiconductors Gmbh Strahlungsemittierende Vorrichtung, Pixelmodul, und Verfahren zur Herstellung einer strahlungsemittierenden Vorrichtung
DE102017105235B4 (de) 2017-03-13 2022-06-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Bauelement mit Verstärkungsschicht und Verfahren zur Herstellung eines Bauelements
JP7004397B2 (ja) * 2017-06-09 2022-01-21 ローム株式会社 光学装置
DE102018128109A1 (de) * 2018-11-09 2020-05-14 Infineon Technologies Ag Ein clip mit einem diebefestigungsabschnitt, der konfiguriert ist, um das entfernen von hohlräumen beim löten zu fördern
US10923436B2 (en) * 2019-03-25 2021-02-16 Qualcomm Incorporated Techniques for thermal matching of integrated circuits
IT201900009501A1 (it) * 2019-06-19 2020-12-19 St Microelectronics Srl Procedimento di die attachment per dispositivi a semiconduttore e dispositivo a semiconduttore corrispondente
WO2026012714A1 (en) * 2024-07-12 2026-01-15 Ams-Osram International Gmbh Electronic device, electronic assembly, lead frame, and method for producing an electronic device

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JP2007324205A (ja) * 2006-05-30 2007-12-13 Toyoda Gosei Co Ltd 発光装置
US20080128736A1 (en) * 2005-06-01 2008-06-05 Samsung Electro-Mechanics Co., Ltd. Side-emitting LED package and manufacturing method of the same
JP2008140646A (ja) * 2006-12-01 2008-06-19 Sony Corp バックライト装置及び液晶表示装置
US20080231169A1 (en) * 2007-03-23 2008-09-25 Sharp Kabushiki Kaisha Light emitting device and method for manufacturing the same
EP1978566A1 (en) * 2006-01-26 2008-10-08 Sony Corporation Light source device and display device

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JP2003110058A (ja) 2001-10-01 2003-04-11 Dainippon Printing Co Ltd 半導体パッケージ及びその製造方法体装置用回路部材
WO2003034508A1 (fr) 2001-10-12 2003-04-24 Nichia Corporation Dispositif d'emission de lumiere et procede de fabrication de celui-ci
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EP1059678A2 (en) * 1999-06-09 2000-12-13 Sanyo Electric Co., Ltd. Hybrid integrated circuit device
US20070063209A1 (en) * 2004-09-16 2007-03-22 Ryouji Sugiura Led reflecting plate and led device
US20080128736A1 (en) * 2005-06-01 2008-06-05 Samsung Electro-Mechanics Co., Ltd. Side-emitting LED package and manufacturing method of the same
EP1978566A1 (en) * 2006-01-26 2008-10-08 Sony Corporation Light source device and display device
JP2007324205A (ja) * 2006-05-30 2007-12-13 Toyoda Gosei Co Ltd 発光装置
JP2008140646A (ja) * 2006-12-01 2008-06-19 Sony Corp バックライト装置及び液晶表示装置
US20080231169A1 (en) * 2007-03-23 2008-09-25 Sharp Kabushiki Kaisha Light emitting device and method for manufacturing the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010027313A1 (de) * 2010-07-16 2012-01-19 Osram Opto Semiconductors Gmbh Trägervorrichtung für einen Halbleiterchip, elektronisches Bauelement mit einer Trägervorrichtung und optoelektronisches Bauelement mit einer Trägervorrichtung
US9076781B2 (en) 2010-07-16 2015-07-07 Osram Opto Semiconductors Gmbh Support device for a semiconductor chip and optoelectronic component with a carrier device and electronic component with a carrier device
EP2531010A3 (en) * 2011-06-03 2014-11-26 Toshiba Lighting & Technology Corporation Light-emitting device and luminaire
CN116435201A (zh) * 2023-06-12 2023-07-14 四川遂宁市利普芯微电子有限公司 一种塑封封装方法以及器件封装结构
CN116435201B (zh) * 2023-06-12 2023-09-12 四川遂宁市利普芯微电子有限公司 一种塑封封装方法以及器件封装结构

Also Published As

Publication number Publication date
EP2396832A1 (de) 2011-12-21
US8710609B2 (en) 2014-04-29
CN102318090A (zh) 2012-01-11
EP2396832B1 (de) 2016-03-30
US20110303945A1 (en) 2011-12-15
TW201112458A (en) 2011-04-01
CN102318090B (zh) 2015-04-08
KR20110127199A (ko) 2011-11-24
WO2010091967A1 (de) 2010-08-19
JP2012517709A (ja) 2012-08-02
KR101616153B1 (ko) 2016-04-27
JP5385411B2 (ja) 2014-01-08
TWI422076B (zh) 2014-01-01

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