CN102318090B - 封装过的带有焊接停止层的光电子半导体装置以及相应方法 - Google Patents

封装过的带有焊接停止层的光电子半导体装置以及相应方法 Download PDF

Info

Publication number
CN102318090B
CN102318090B CN201080007536.6A CN201080007536A CN102318090B CN 102318090 B CN102318090 B CN 102318090B CN 201080007536 A CN201080007536 A CN 201080007536A CN 102318090 B CN102318090 B CN 102318090B
Authority
CN
China
Prior art keywords
layer
upside
conductor means
stop
downside
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201080007536.6A
Other languages
English (en)
Chinese (zh)
Other versions
CN102318090A (zh
Inventor
迈克尔·齐茨尔斯佩格
马蒂亚斯·斯佩尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of CN102318090A publication Critical patent/CN102318090A/zh
Application granted granted Critical
Publication of CN102318090B publication Critical patent/CN102318090B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/458—Materials of insulating layers on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CN201080007536.6A 2009-02-12 2010-01-29 封装过的带有焊接停止层的光电子半导体装置以及相应方法 Expired - Fee Related CN102318090B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009008738A DE102009008738A1 (de) 2009-02-12 2009-02-12 Halbleiteranordnung und Verfahren zum Herstellen einer Halbleiteranordnung
DE102009008738.9 2009-02-12
PCT/EP2010/051116 WO2010091967A1 (de) 2009-02-12 2010-01-29 Verkapselte optoeleketronische halbleiteranordnung mit lötstoppschicht und entsprechendes verfahren

Publications (2)

Publication Number Publication Date
CN102318090A CN102318090A (zh) 2012-01-11
CN102318090B true CN102318090B (zh) 2015-04-08

Family

ID=42091769

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080007536.6A Expired - Fee Related CN102318090B (zh) 2009-02-12 2010-01-29 封装过的带有焊接停止层的光电子半导体装置以及相应方法

Country Status (8)

Country Link
US (1) US8710609B2 (https=)
EP (1) EP2396832B1 (https=)
JP (1) JP5385411B2 (https=)
KR (1) KR101616153B1 (https=)
CN (1) CN102318090B (https=)
DE (1) DE102009008738A1 (https=)
TW (1) TWI422076B (https=)
WO (1) WO2010091967A1 (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010026344A1 (de) * 2010-07-07 2012-01-12 Osram Opto Semiconductors Gmbh Leuchtdiode
DE102010027313A1 (de) * 2010-07-16 2012-01-19 Osram Opto Semiconductors Gmbh Trägervorrichtung für einen Halbleiterchip, elektronisches Bauelement mit einer Trägervorrichtung und optoelektronisches Bauelement mit einer Trägervorrichtung
JP5652175B2 (ja) * 2010-12-08 2015-01-14 日亜化学工業株式会社 発光装置及びその製造方法
JP5817297B2 (ja) * 2011-06-03 2015-11-18 東芝ライテック株式会社 発光装置及び照明装置
US9397274B2 (en) 2011-08-24 2016-07-19 Lg Innotek Co., Ltd. Light emitting device package
KR101849712B1 (ko) * 2011-09-02 2018-04-17 엘지이노텍 주식회사 발광소자 패키지, 백라이트 유닛 및 영상표시장치
US8803326B2 (en) * 2011-11-15 2014-08-12 Xintec Inc. Chip package
US20130307013A1 (en) * 2012-05-15 2013-11-21 Avago Technlogies Ecbu Ip (Singapore) Pte. Ltd. Light emitting device with dark layer
JP2015115432A (ja) * 2013-12-11 2015-06-22 ローム株式会社 半導体装置
DE102014104819A1 (de) * 2014-03-26 2015-10-01 Heraeus Deutschland GmbH & Co. KG Träger und/oder Clip für Halbleiterelemente, Halbleiterbauelement und Verfahren zur Herstellung
JP2017157593A (ja) * 2016-02-29 2017-09-07 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 発光ダイオード、発光ダイオードの製造方法、発光ダイオード表示装置及び発光ダイオード表示装置の製造方法
DE102016124373A1 (de) * 2016-12-14 2018-06-14 Osram Opto Semiconductors Gmbh Strahlungsemittierende Vorrichtung, Pixelmodul, und Verfahren zur Herstellung einer strahlungsemittierenden Vorrichtung
DE102017105235B4 (de) 2017-03-13 2022-06-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Bauelement mit Verstärkungsschicht und Verfahren zur Herstellung eines Bauelements
JP7004397B2 (ja) * 2017-06-09 2022-01-21 ローム株式会社 光学装置
DE102018128109A1 (de) * 2018-11-09 2020-05-14 Infineon Technologies Ag Ein clip mit einem diebefestigungsabschnitt, der konfiguriert ist, um das entfernen von hohlräumen beim löten zu fördern
US10923436B2 (en) * 2019-03-25 2021-02-16 Qualcomm Incorporated Techniques for thermal matching of integrated circuits
IT201900009501A1 (it) * 2019-06-19 2020-12-19 St Microelectronics Srl Procedimento di die attachment per dispositivi a semiconduttore e dispositivo a semiconduttore corrispondente
CN116435201B (zh) * 2023-06-12 2023-09-12 四川遂宁市利普芯微电子有限公司 一种塑封封装方法以及器件封装结构
WO2026012714A1 (en) * 2024-07-12 2026-01-15 Ams-Osram International Gmbh Electronic device, electronic assembly, lead frame, and method for producing an electronic device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5973337A (en) * 1997-08-25 1999-10-26 Motorola, Inc. Ball grid device with optically transmissive coating

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2531382B2 (ja) * 1994-05-26 1996-09-04 日本電気株式会社 ボ―ルグリッドアレイ半導体装置およびその製造方法
JP3115807B2 (ja) 1995-08-25 2000-12-11 株式会社三井ハイテック 半導体装置
US6667541B1 (en) * 1998-10-21 2003-12-23 Matsushita Electric Industrial Co., Ltd. Terminal land frame and method for manufacturing the same
EP1059668A3 (en) * 1999-06-09 2007-07-18 Sanyo Electric Co., Ltd. Hybrid integrated circuit device
JP2001094026A (ja) 1999-09-22 2001-04-06 Toshiba Corp リードフレーム及びその製造方法
EP1153792A1 (de) * 2000-05-09 2001-11-14 SIDLER GMBH & CO Leuchtenanordnung mit mehreren LED's
JP2002026198A (ja) * 2000-07-04 2002-01-25 Nec Corp 半導体装置及びその製造方法
TW473951B (en) * 2001-01-17 2002-01-21 Siliconware Precision Industries Co Ltd Non-leaded quad flat image sensor package
US6649832B1 (en) * 2001-08-31 2003-11-18 Cypress Semiconductor Corporation Apparatus and method for coupling with components in a surface mount package
JP2003110058A (ja) 2001-10-01 2003-04-11 Dainippon Printing Co Ltd 半導体パッケージ及びその製造方法体装置用回路部材
WO2003034508A1 (fr) 2001-10-12 2003-04-24 Nichia Corporation Dispositif d'emission de lumiere et procede de fabrication de celui-ci
EP1357595A1 (en) * 2002-04-22 2003-10-29 Scientek Corporation Ball grid array semiconductor package with resin coated core
JP5068075B2 (ja) 2003-10-15 2012-11-07 奇美電子股▲ふん▼有限公司 電子デバイス及びその製造方法
CN100403565C (zh) * 2004-09-16 2008-07-16 日立Aic株式会社 Led器件
KR100674871B1 (ko) * 2005-06-01 2007-01-30 삼성전기주식회사 측면 발광형 엘이디 패키지 및 그 제조 방법
TW200707768A (en) * 2005-08-15 2007-02-16 Silicon Touch Tech Inc Sensing apparatus capable of easily selecting the light-sensing curve
JP4049186B2 (ja) * 2006-01-26 2008-02-20 ソニー株式会社 光源装置
JP5232369B2 (ja) * 2006-02-03 2013-07-10 日立化成株式会社 光半導体素子搭載用パッケージ基板の製造方法およびこれを用いた光半導体装置の製造方法
JP2007324205A (ja) * 2006-05-30 2007-12-13 Toyoda Gosei Co Ltd 発光装置
JP2008140646A (ja) * 2006-12-01 2008-06-19 Sony Corp バックライト装置及び液晶表示装置
JP5089212B2 (ja) * 2007-03-23 2012-12-05 シャープ株式会社 発光装置およびそれを用いたｌｅｄランプ、発光装置の製造方法
JP2008282917A (ja) 2007-05-09 2008-11-20 C I Kasei Co Ltd 発光装置および発光装置を作製する基板用リードフレーム

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5973337A (en) * 1997-08-25 1999-10-26 Motorola, Inc. Ball grid device with optically transmissive coating

Also Published As

Publication number Publication date
EP2396832A1 (de) 2011-12-21
US8710609B2 (en) 2014-04-29
CN102318090A (zh) 2012-01-11
DE102009008738A1 (de) 2010-08-19
EP2396832B1 (de) 2016-03-30
US20110303945A1 (en) 2011-12-15
TW201112458A (en) 2011-04-01
KR20110127199A (ko) 2011-11-24
WO2010091967A1 (de) 2010-08-19
JP2012517709A (ja) 2012-08-02
KR101616153B1 (ko) 2016-04-27
JP5385411B2 (ja) 2014-01-08
TWI422076B (zh) 2014-01-01

Similar Documents

Publication Publication Date Title
CN102318090B (zh) 封装过的带有焊接停止层的光电子半导体装置以及相应方法
US8853841B2 (en) Lead frame which includes terminal portion having through groove covered by lid portion, semiconductor package, and manufacturing method of the same
KR101843402B1 (ko) 표면 장착 가능한 광전자 소자 그리고 표면 장착 가능한 광전자 소자를 제조하기 위한 방법
US10930581B2 (en) Semiconductor package with wettable flank
CN102683509B (zh) Led模块
CN105144416B (zh) 具有光电子器件的照明设备
KR101059361B1 (ko) 리드 프레임 및 반도체 발광장치
JP5802695B2 (ja) 半導体装置、半導体装置の製造方法
US8513695B2 (en) LED package and method for making the same
CN103069563B (zh) 用于制造至少一个光电子半导体器件的方法
US9318677B2 (en) Light emitting device package
CN116210095A (zh) 光电子半导体器件和制造方法
CN108701740A (zh) 半导体器件和用于制造半导体器件的方法
KR20130083898A (ko) 땜납 크립에 대한 땜납 배리어를 가진 반도체 칩을 위한 캐리어 장치, 전자 소자, 및 그것들이 제공된 광전 소자
US20120111628A1 (en) Electronic Device
CN102738373B (zh) 发光二极管封装结构及其制造方法
JP2006165411A (ja) 半導体装置およびその製造方法
US20240379926A1 (en) Light-emitting device, and method for producing light-emitting device
TW201448286A (zh) 發光二極體封裝結構及其製造方法
CN117413370A (zh) 光电半导体部件及面板
JP2024039359A (ja) 半導体装置およびその製造方法
JP4051379B2 (ja) 半導体装置の製造方法
KR20160140534A (ko) 반도체 발광소자 패키지용 기판 및 이를 가지는 반도체 발광소자 패키지

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150408

Termination date: 20200129

CF01 Termination of patent right due to non-payment of annual fee