CN202261188U - 表面声波器件、表面声波振荡器以及电子设备 - Google Patents

表面声波器件、表面声波振荡器以及电子设备 Download PDF

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Publication number
CN202261188U
CN202261188U CN2011203138119U CN201120313811U CN202261188U CN 202261188 U CN202261188 U CN 202261188U CN 2011203138119 U CN2011203138119 U CN 2011203138119U CN 201120313811 U CN201120313811 U CN 201120313811U CN 202261188 U CN202261188 U CN 202261188U
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CN
China
Prior art keywords
acoustic wave
surface acoustic
frequency
film thickness
relationship
Prior art date
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Expired - Lifetime
Application number
CN2011203138119U
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English (en)
Chinese (zh)
Inventor
大胁卓弥
山中国人
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Seiko Epson Corp
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Seiko Epson Corp
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Publication of CN202261188U publication Critical patent/CN202261188U/zh
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02551—Characteristics of substrate, e.g. cutting angles of quartz substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02614—Treatment of substrates, e.g. curved, spherical, cylindrical substrates ensuring closed round-about circuits for the acoustical waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02834—Means for compensation or elimination of undesirable effects of temperature influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/058—Holders or supports for surface acoustic wave devices
    • H03H9/0585—Holders or supports for surface acoustic wave devices consisting of an adhesive layer
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H03H9/14538—Formation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
CN2011203138119U 2010-08-26 2011-08-24 表面声波器件、表面声波振荡器以及电子设备 Expired - Lifetime CN202261188U (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010189863A JP2012049817A (ja) 2010-08-26 2010-08-26 弾性表面波デバイス、および弾性表面波発振器、ならびに電子機器
JP2010-189863 2010-08-26

Publications (1)

Publication Number Publication Date
CN202261188U true CN202261188U (zh) 2012-05-30

Family

ID=45696364

Family Applications (3)

Application Number Title Priority Date Filing Date
CN2011203138119U Expired - Lifetime CN202261188U (zh) 2010-08-26 2011-08-24 表面声波器件、表面声波振荡器以及电子设备
CN201410616565.2A Pending CN104506159A (zh) 2010-08-26 2011-08-24 表面声波器件、表面声波振荡器以及电子设备
CN201110246685.4A Expired - Fee Related CN102386880B (zh) 2010-08-26 2011-08-24 表面声波器件、表面声波振荡器以及电子设备

Family Applications After (2)

Application Number Title Priority Date Filing Date
CN201410616565.2A Pending CN104506159A (zh) 2010-08-26 2011-08-24 表面声波器件、表面声波振荡器以及电子设备
CN201110246685.4A Expired - Fee Related CN102386880B (zh) 2010-08-26 2011-08-24 表面声波器件、表面声波振荡器以及电子设备

Country Status (3)

Country Link
US (1) US8471434B2 (https=)
JP (1) JP2012049817A (https=)
CN (3) CN202261188U (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102386880A (zh) * 2010-08-26 2012-03-21 精工爱普生株式会社 表面声波器件、表面声波振荡器以及电子设备

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WO2010098139A1 (ja) * 2009-02-27 2010-09-02 エプソントヨコム株式会社 弾性表面波共振子、弾性表面波発振器、及び電子機器
US11606078B2 (en) 2019-07-18 2023-03-14 Skyworks Solutions, Inc. Acoustic wave resonator with rotated and tilted interdigital transducer electrode
CN111273470B (zh) * 2020-03-26 2023-04-18 京东方科技集团股份有限公司 液晶移相器及电子装置
US12525951B2 (en) 2021-10-01 2026-01-13 Skyworks Solutions, Inc. Surface acoustic wave device having a trapezoidal electrode
US20230208385A1 (en) * 2021-12-28 2023-06-29 Skyworks Solutions, Inc. Acoustic wave device with tilted interdigital transducer electrode
US12483226B2 (en) 2021-12-29 2025-11-25 Skyworks Solutions, Inc. Acoustic wave device with tilted multilayer interdigital transducer electrode
US12470199B2 (en) 2022-01-13 2025-11-11 Skyworks Solutions, Inc. Acoustic wave device with vertically mass loaded multi-layer interdigital transducer electrode for transverse mode suppression
US20230344411A1 (en) 2022-04-15 2023-10-26 Skyworks Solutions, Inc. Multiplexer with dies of different acoustic velocity

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102386880A (zh) * 2010-08-26 2012-03-21 精工爱普生株式会社 表面声波器件、表面声波振荡器以及电子设备
CN102386880B (zh) * 2010-08-26 2014-12-10 精工爱普生株式会社 表面声波器件、表面声波振荡器以及电子设备

Also Published As

Publication number Publication date
US20120049968A1 (en) 2012-03-01
CN102386880B (zh) 2014-12-10
CN104506159A (zh) 2015-04-08
CN102386880A (zh) 2012-03-21
JP2012049817A (ja) 2012-03-08
US8471434B2 (en) 2013-06-25

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