CN1908116A - 蓝光无机发光材料及使用该材料的发光器件 - Google Patents

蓝光无机发光材料及使用该材料的发光器件 Download PDF

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Publication number
CN1908116A
CN1908116A CNA2006101084847A CN200610108484A CN1908116A CN 1908116 A CN1908116 A CN 1908116A CN A2006101084847 A CNA2006101084847 A CN A2006101084847A CN 200610108484 A CN200610108484 A CN 200610108484A CN 1908116 A CN1908116 A CN 1908116A
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CN
China
Prior art keywords
light
phosphor
general formula
blue
wavelength
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Pending
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CNA2006101084847A
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English (en)
Chinese (zh)
Inventor
增田昌嗣
植村丰德
井之口司
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Sharp Corp
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Sharp Corp
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Publication of CN1908116A publication Critical patent/CN1908116A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/7734—Aluminates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/0883—Arsenides; Nitrides; Phosphides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77342—Silicates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/14—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
CNA2006101084847A 2005-08-02 2006-08-01 蓝光无机发光材料及使用该材料的发光器件 Pending CN1908116A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005223783 2005-08-02
JP2005223783A JP4794235B2 (ja) 2005-08-02 2005-08-02 発光装置

Publications (1)

Publication Number Publication Date
CN1908116A true CN1908116A (zh) 2007-02-07

Family

ID=37699348

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2006101084847A Pending CN1908116A (zh) 2005-08-02 2006-08-01 蓝光无机发光材料及使用该材料的发光器件

Country Status (3)

Country Link
US (1) US20070029565A1 (https=)
JP (1) JP4794235B2 (https=)
CN (1) CN1908116A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102071015A (zh) * 2011-01-21 2011-05-25 中国计量学院 一种铕、锰共掺激活的白光荧光粉及其制备方法
CN102127429A (zh) * 2010-12-21 2011-07-20 中国计量学院 一种铕、锰共掺激活的蓝绿荧光粉及其制备方法

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JP2007049114A (ja) * 2005-05-30 2007-02-22 Sharp Corp 発光装置とその製造方法
US20070052342A1 (en) * 2005-09-01 2007-03-08 Sharp Kabushiki Kaisha Light-emitting device
JP2008135725A (ja) * 2006-10-31 2008-06-12 Toshiba Corp 半導体発光装置
JP5367218B2 (ja) 2006-11-24 2013-12-11 シャープ株式会社 蛍光体の製造方法および発光装置の製造方法
JP5186687B2 (ja) * 2007-10-23 2013-04-17 独立行政法人 国立印刷局 残光性発光体とその製造方法及び発光印刷物
JP5186686B2 (ja) * 2007-10-23 2013-04-17 独立行政法人 国立印刷局 複合機能発光体とその製造方法及び発光印刷物
US20090189514A1 (en) * 2008-01-29 2009-07-30 Kabushiki Kaisha Toshiba Luminescent material
KR100982992B1 (ko) 2008-09-08 2010-09-17 삼성엘이디 주식회사 양자점 파장변환시트, 및 양자점 파장변환시트를 포함하는 발광장치
CN102376860A (zh) 2010-08-05 2012-03-14 夏普株式会社 发光装置及其制造方法
JP2012036265A (ja) * 2010-08-05 2012-02-23 Sharp Corp 照明装置
WO2012033122A1 (ja) * 2010-09-07 2012-03-15 宇部マテリアルズ株式会社 青色発光蛍光体及び該青色発光蛍光体を用いた発光装置
JP6057770B2 (ja) * 2013-02-20 2017-01-11 三菱重工業株式会社 逆浸透膜装置の運転方法
US10283681B2 (en) * 2013-09-12 2019-05-07 Cree, Inc. Phosphor-converted light emitting device
EP3240807A4 (en) 2014-12-30 2018-08-08 Momentive Performance Materials Inc. Functionalized siloxane materials
US10287398B2 (en) 2014-12-30 2019-05-14 Momentive Performance Materials Inc. Siloxane coordination polymers
JP6354626B2 (ja) * 2015-03-09 2018-07-11 豊田合成株式会社 発光装置の製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102127429A (zh) * 2010-12-21 2011-07-20 中国计量学院 一种铕、锰共掺激活的蓝绿荧光粉及其制备方法
CN102127429B (zh) * 2010-12-21 2013-04-17 中国计量学院 一种铕、锰共掺激活的蓝绿荧光粉及其制备方法
CN102071015A (zh) * 2011-01-21 2011-05-25 中国计量学院 一种铕、锰共掺激活的白光荧光粉及其制备方法

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US20070029565A1 (en) 2007-02-08
JP2007039517A (ja) 2007-02-15

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