CN1889812A - 用于半添加法印刷布线基板制造的蚀刻除去方法及蚀刻液 - Google Patents
用于半添加法印刷布线基板制造的蚀刻除去方法及蚀刻液 Download PDFInfo
- Publication number
- CN1889812A CN1889812A CNA2005100811746A CN200510081174A CN1889812A CN 1889812 A CN1889812 A CN 1889812A CN A2005100811746 A CNA2005100811746 A CN A2005100811746A CN 200510081174 A CN200510081174 A CN 200510081174A CN 1889812 A CN1889812 A CN 1889812A
- Authority
- CN
- China
- Prior art keywords
- etching
- etching solution
- weight
- copper plating
- semi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Inorganic Chemistry (AREA)
- Electrochemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004191559A JP4488188B2 (ja) | 2004-06-29 | 2004-06-29 | セミアディティブ法プリント配線基板製造用エッチング液 |
JP2004191559 | 2004-06-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN1889812A true CN1889812A (zh) | 2007-01-03 |
Family
ID=35780184
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2005100811746A Pending CN1889812A (zh) | 2004-06-29 | 2005-06-29 | 用于半添加法印刷布线基板制造的蚀刻除去方法及蚀刻液 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4488188B2 (ja) |
KR (1) | KR101162370B1 (ja) |
CN (1) | CN1889812A (ja) |
TW (1) | TWI353201B (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102199771A (zh) * | 2010-03-26 | 2011-09-28 | Mec股份有限公司 | 铜的蚀刻液和基板的制造方法 |
CN103510089A (zh) * | 2012-06-29 | 2014-01-15 | 三菱瓦斯化学株式会社 | 蚀刻用液体组合物和使用其的多层印刷电路板的制造方法 |
CN103966606A (zh) * | 2014-05-06 | 2014-08-06 | 汕头超声印制板(二厂)有限公司 | 一种用于印制电路板的减铜蚀刻药水 |
CN104120427A (zh) * | 2013-04-23 | 2014-10-29 | 三菱瓦斯化学株式会社 | 配线基板的处理方法以及使用该方法制造的配线基板 |
CN104170532A (zh) * | 2012-03-16 | 2014-11-26 | 住友电木株式会社 | 层压板及印刷电路板的制造方法 |
CN104651840A (zh) * | 2013-11-22 | 2015-05-27 | 三菱瓦斯化学株式会社 | 蚀刻用组合物以及使用了其的印刷电路板的制造方法 |
TWI575110B (zh) * | 2012-06-29 | 2017-03-21 | Mitsubishi Gas Chemical Co | The liquid composition for etching and the manufacturing method of the multilayer printed circuit board using the liquid composition |
TWI627884B (zh) * | 2013-08-01 | 2018-06-21 | Mitsubishi Gas Chemical Co | 印刷電路板之製造方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5273710B2 (ja) * | 2007-11-27 | 2013-08-28 | メック株式会社 | エッチング剤 |
KR102048495B1 (ko) * | 2018-03-27 | 2019-11-25 | 김용석 | Msap 기판 제조용 에칭액 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000064067A (ja) * | 1998-06-09 | 2000-02-29 | Ebara Densan Ltd | エッチング液および銅表面の粗化処理方法 |
JP4687852B2 (ja) | 2001-06-25 | 2011-05-25 | 三菱瓦斯化学株式会社 | 銅および銅合金の表面処理剤 |
JP4032712B2 (ja) * | 2001-11-22 | 2008-01-16 | 日立化成工業株式会社 | プリント配線板の製造方法 |
-
2004
- 2004-06-29 JP JP2004191559A patent/JP4488188B2/ja not_active Expired - Fee Related
-
2005
- 2005-06-13 KR KR1020050050229A patent/KR101162370B1/ko not_active IP Right Cessation
- 2005-06-27 TW TW094121364A patent/TWI353201B/zh not_active IP Right Cessation
- 2005-06-29 CN CNA2005100811746A patent/CN1889812A/zh active Pending
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI489004B (zh) * | 2010-03-26 | 2015-06-21 | Mec Co Ltd | 銅之蝕刻液及基板之製造方法 |
CN102199771A (zh) * | 2010-03-26 | 2011-09-28 | Mec股份有限公司 | 铜的蚀刻液和基板的制造方法 |
CN102199771B (zh) * | 2010-03-26 | 2015-08-19 | Mec股份有限公司 | 铜的蚀刻液和基板的制造方法 |
CN104170532B (zh) * | 2012-03-16 | 2017-02-22 | 住友电木株式会社 | 层压板及印刷电路板的制造方法 |
CN104170532A (zh) * | 2012-03-16 | 2014-11-26 | 住友电木株式会社 | 层压板及印刷电路板的制造方法 |
CN103510089A (zh) * | 2012-06-29 | 2014-01-15 | 三菱瓦斯化学株式会社 | 蚀刻用液体组合物和使用其的多层印刷电路板的制造方法 |
TWI575110B (zh) * | 2012-06-29 | 2017-03-21 | Mitsubishi Gas Chemical Co | The liquid composition for etching and the manufacturing method of the multilayer printed circuit board using the liquid composition |
CN103510089B (zh) * | 2012-06-29 | 2017-04-12 | 三菱瓦斯化学株式会社 | 蚀刻用液体组合物和使用其的多层印刷电路板的制造方法 |
CN104120427A (zh) * | 2013-04-23 | 2014-10-29 | 三菱瓦斯化学株式会社 | 配线基板的处理方法以及使用该方法制造的配线基板 |
CN104120427B (zh) * | 2013-04-23 | 2017-11-28 | 三菱瓦斯化学株式会社 | 配线基板的处理方法以及使用该方法制造的配线基板 |
TWI627884B (zh) * | 2013-08-01 | 2018-06-21 | Mitsubishi Gas Chemical Co | 印刷電路板之製造方法 |
CN104651840A (zh) * | 2013-11-22 | 2015-05-27 | 三菱瓦斯化学株式会社 | 蚀刻用组合物以及使用了其的印刷电路板的制造方法 |
CN104651840B (zh) * | 2013-11-22 | 2018-05-01 | 三菱瓦斯化学株式会社 | 蚀刻用组合物以及使用了其的印刷电路板的制造方法 |
CN103966606A (zh) * | 2014-05-06 | 2014-08-06 | 汕头超声印制板(二厂)有限公司 | 一种用于印制电路板的减铜蚀刻药水 |
CN103966606B (zh) * | 2014-05-06 | 2016-04-06 | 汕头超声印制板(二厂)有限公司 | 一种用于印制电路板的减铜蚀刻药水 |
Also Published As
Publication number | Publication date |
---|---|
KR20060046430A (ko) | 2006-05-17 |
JP4488188B2 (ja) | 2010-06-23 |
TW200607413A (en) | 2006-02-16 |
JP2006013340A (ja) | 2006-01-12 |
TWI353201B (en) | 2011-11-21 |
KR101162370B1 (ko) | 2012-07-04 |
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