CN1889812A - 用于半添加法印刷布线基板制造的蚀刻除去方法及蚀刻液 - Google Patents

用于半添加法印刷布线基板制造的蚀刻除去方法及蚀刻液 Download PDF

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Publication number
CN1889812A
CN1889812A CNA2005100811746A CN200510081174A CN1889812A CN 1889812 A CN1889812 A CN 1889812A CN A2005100811746 A CNA2005100811746 A CN A2005100811746A CN 200510081174 A CN200510081174 A CN 200510081174A CN 1889812 A CN1889812 A CN 1889812A
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CN
China
Prior art keywords
etching
etching solution
weight
copper plating
semi
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Pending
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CNA2005100811746A
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English (en)
Chinese (zh)
Inventor
细见彰良
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Mitsubishi Gas Chemical Co Inc
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Mitsubishi Gas Chemical Co Inc
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Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Publication of CN1889812A publication Critical patent/CN1889812A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Inorganic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
CNA2005100811746A 2004-06-29 2005-06-29 用于半添加法印刷布线基板制造的蚀刻除去方法及蚀刻液 Pending CN1889812A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004191559A JP4488188B2 (ja) 2004-06-29 2004-06-29 セミアディティブ法プリント配線基板製造用エッチング液
JP2004191559 2004-06-29

Publications (1)

Publication Number Publication Date
CN1889812A true CN1889812A (zh) 2007-01-03

Family

ID=35780184

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2005100811746A Pending CN1889812A (zh) 2004-06-29 2005-06-29 用于半添加法印刷布线基板制造的蚀刻除去方法及蚀刻液

Country Status (4)

Country Link
JP (1) JP4488188B2 (ja)
KR (1) KR101162370B1 (ja)
CN (1) CN1889812A (ja)
TW (1) TWI353201B (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102199771A (zh) * 2010-03-26 2011-09-28 Mec股份有限公司 铜的蚀刻液和基板的制造方法
CN103510089A (zh) * 2012-06-29 2014-01-15 三菱瓦斯化学株式会社 蚀刻用液体组合物和使用其的多层印刷电路板的制造方法
CN103966606A (zh) * 2014-05-06 2014-08-06 汕头超声印制板（二厂）有限公司 一种用于印制电路板的减铜蚀刻药水
CN104120427A (zh) * 2013-04-23 2014-10-29 三菱瓦斯化学株式会社 配线基板的处理方法以及使用该方法制造的配线基板
CN104170532A (zh) * 2012-03-16 2014-11-26 住友电木株式会社 层压板及印刷电路板的制造方法
CN104651840A (zh) * 2013-11-22 2015-05-27 三菱瓦斯化学株式会社 蚀刻用组合物以及使用了其的印刷电路板的制造方法
TWI575110B (zh) * 2012-06-29 2017-03-21 Mitsubishi Gas Chemical Co The liquid composition for etching and the manufacturing method of the multilayer printed circuit board using the liquid composition
TWI627884B (zh) * 2013-08-01 2018-06-21 Mitsubishi Gas Chemical Co 印刷電路板之製造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5273710B2 (ja) * 2007-11-27 2013-08-28 メック株式会社 エッチング剤
KR102048495B1 (ko) * 2018-03-27 2019-11-25 김용석 Msap 기판 제조용 에칭액

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000064067A (ja) * 1998-06-09 2000-02-29 Ebara Densan Ltd エッチング液および銅表面の粗化処理方法
JP4687852B2 (ja) 2001-06-25 2011-05-25 三菱瓦斯化学株式会社 銅および銅合金の表面処理剤
JP4032712B2 (ja) * 2001-11-22 2008-01-16 日立化成工業株式会社 プリント配線板の製造方法

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI489004B (zh) * 2010-03-26 2015-06-21 Mec Co Ltd 銅之蝕刻液及基板之製造方法
CN102199771A (zh) * 2010-03-26 2011-09-28 Mec股份有限公司 铜的蚀刻液和基板的制造方法
CN102199771B (zh) * 2010-03-26 2015-08-19 Mec股份有限公司 铜的蚀刻液和基板的制造方法
CN104170532B (zh) * 2012-03-16 2017-02-22 住友电木株式会社 层压板及印刷电路板的制造方法
CN104170532A (zh) * 2012-03-16 2014-11-26 住友电木株式会社 层压板及印刷电路板的制造方法
CN103510089A (zh) * 2012-06-29 2014-01-15 三菱瓦斯化学株式会社 蚀刻用液体组合物和使用其的多层印刷电路板的制造方法
TWI575110B (zh) * 2012-06-29 2017-03-21 Mitsubishi Gas Chemical Co The liquid composition for etching and the manufacturing method of the multilayer printed circuit board using the liquid composition
CN103510089B (zh) * 2012-06-29 2017-04-12 三菱瓦斯化学株式会社 蚀刻用液体组合物和使用其的多层印刷电路板的制造方法
CN104120427A (zh) * 2013-04-23 2014-10-29 三菱瓦斯化学株式会社 配线基板的处理方法以及使用该方法制造的配线基板
CN104120427B (zh) * 2013-04-23 2017-11-28 三菱瓦斯化学株式会社 配线基板的处理方法以及使用该方法制造的配线基板
TWI627884B (zh) * 2013-08-01 2018-06-21 Mitsubishi Gas Chemical Co 印刷電路板之製造方法
CN104651840A (zh) * 2013-11-22 2015-05-27 三菱瓦斯化学株式会社 蚀刻用组合物以及使用了其的印刷电路板的制造方法
CN104651840B (zh) * 2013-11-22 2018-05-01 三菱瓦斯化学株式会社 蚀刻用组合物以及使用了其的印刷电路板的制造方法
CN103966606A (zh) * 2014-05-06 2014-08-06 汕头超声印制板（二厂）有限公司 一种用于印制电路板的减铜蚀刻药水
CN103966606B (zh) * 2014-05-06 2016-04-06 汕头超声印制板（二厂）有限公司 一种用于印制电路板的减铜蚀刻药水

Also Published As

Publication number Publication date
TWI353201B (en) 2011-11-21
KR20060046430A (ko) 2006-05-17
JP4488188B2 (ja) 2010-06-23
KR101162370B1 (ko) 2012-07-04
JP2006013340A (ja) 2006-01-12
TW200607413A (en) 2006-02-16

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