CN1865520B - 片状制品的镀覆方法 - Google Patents
片状制品的镀覆方法 Download PDFInfo
- Publication number
- CN1865520B CN1865520B CN2006100757638A CN200610075763A CN1865520B CN 1865520 B CN1865520 B CN 1865520B CN 2006100757638 A CN2006100757638 A CN 2006100757638A CN 200610075763 A CN200610075763 A CN 200610075763A CN 1865520 B CN1865520 B CN 1865520B
- Authority
- CN
- China
- Prior art keywords
- sheet
- article
- shutter
- treated
- plating tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007747 plating Methods 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title abstract description 10
- 230000032258 transport Effects 0.000 claims description 21
- 238000000576 coating method Methods 0.000 claims description 11
- 239000000725 suspension Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 5
- 238000009713 electroplating Methods 0.000 abstract description 10
- 238000005452 bending Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 9
- 239000007788 liquid Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 6
- 230000003028 elevating effect Effects 0.000 description 5
- 230000003321 amplification Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Images
Landscapes
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005140980 | 2005-05-13 | ||
| JP2005140980A JP4700406B2 (ja) | 2005-05-13 | 2005-05-13 | シート状製品のめっき方法 |
| JP2005-140980 | 2005-05-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1865520A CN1865520A (zh) | 2006-11-22 |
| CN1865520B true CN1865520B (zh) | 2010-09-29 |
Family
ID=37424661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006100757638A Expired - Fee Related CN1865520B (zh) | 2005-05-13 | 2006-04-26 | 片状制品的镀覆方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4700406B2 (https=) |
| CN (1) | CN1865520B (https=) |
| TW (1) | TW200639276A (https=) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101054701B (zh) * | 2007-02-08 | 2010-12-08 | 上海美维科技有限公司 | 提高电镀均匀性的方法 |
| KR101070841B1 (ko) | 2011-06-02 | 2011-10-06 | 장병원 | 박판 인쇄 회로 기판의 동 도금라인에 있어서, 박판 인쇄 회로 기판의 도금방법 및 그 장치 |
| KR101080896B1 (ko) | 2011-06-10 | 2011-11-07 | 장병원 | 인쇄 회로 기판 제조 공정중 하나인 전기동 도금 라인의 전기동 도금조 내에서 인쇄 회로 기판에 도금액 흐름성을 좋게 하고 인쇄 회로 기판 표면의 동도금을 균일하게 할 수 있도록 한 고정구 |
| JP5731917B2 (ja) * | 2011-06-30 | 2015-06-10 | 上村工業株式会社 | 表面処理装置およびめっき槽 |
| CN102286770A (zh) * | 2011-08-26 | 2011-12-21 | 珠海市祥芝电子有限公司 | 电镀专用夹具 |
| KR101300325B1 (ko) * | 2011-12-21 | 2013-08-28 | 삼성전기주식회사 | 기판 도금 장치 및 그 제어 방법 |
| CN103305896B (zh) * | 2012-03-07 | 2015-09-09 | 昆山东威电镀设备技术有限公司 | 连续电镀液体导电装置及连续液体电镀方法 |
| TW201416302A (zh) * | 2012-10-19 | 2014-05-01 | Manz Taiwan Ltd | 夾具及輸送系統 |
| CN103374744A (zh) * | 2013-07-11 | 2013-10-30 | 皆利士多层线路版(中山)有限公司 | Pcb电镀铜附槽 |
| CN105239143B (zh) * | 2015-09-30 | 2018-11-20 | 东莞市威力固电路板设备有限公司 | 电镀设备入料系统及其控制方法 |
| JP6305485B2 (ja) * | 2016-09-14 | 2018-04-04 | 本田技研工業株式会社 | 搬送装置 |
| JP6329681B1 (ja) * | 2017-10-31 | 2018-05-23 | 株式会社荏原製作所 | めっき装置及びめっき方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1267341A (zh) * | 1997-08-21 | 2000-09-20 | 阿托特德国有限公司 | 使处理物品的电接触部位的金属镀层厚度均匀化的装置和方法 |
| CN1428462A (zh) * | 2001-12-27 | 2003-07-09 | 丸仲工业株式会社 | 电镀处理装置的产品导引机构 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6142937A (ja) * | 1984-08-07 | 1986-03-01 | Fujitsu Ltd | 集積回路基板の製造方法 |
| JPH0385849A (ja) * | 1989-08-30 | 1991-04-11 | Hitachi Ltd | ファクシミリ装置 |
| JPH05148693A (ja) * | 1992-01-14 | 1993-06-15 | Toshiba Corp | 電気銅鍍金用治具 |
| JP2728338B2 (ja) * | 1992-05-21 | 1998-03-18 | 上村工業株式会社 | プリント基板のマスキング装置 |
| JP3677488B2 (ja) * | 2002-05-14 | 2005-08-03 | 丸仲工業株式会社 | 電気メッキ装置におけるクリップ式のワークハンガー |
-
2005
- 2005-05-13 JP JP2005140980A patent/JP4700406B2/ja not_active Expired - Fee Related
- 2005-12-29 TW TW094147354A patent/TW200639276A/zh unknown
-
2006
- 2006-04-26 CN CN2006100757638A patent/CN1865520B/zh not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1267341A (zh) * | 1997-08-21 | 2000-09-20 | 阿托特德国有限公司 | 使处理物品的电接触部位的金属镀层厚度均匀化的装置和方法 |
| CN1428462A (zh) * | 2001-12-27 | 2003-07-09 | 丸仲工业株式会社 | 电镀处理装置的产品导引机构 |
Non-Patent Citations (4)
| Title |
|---|
| JP特开2003-105595A 2003.04.09 |
| JP特开2004-149858A 2004.05.27 |
| JP特开2004-277783A 2004.10.07 |
| JP特开平11-61495A 1999.03.05 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006316322A (ja) | 2006-11-24 |
| CN1865520A (zh) | 2006-11-22 |
| TW200639276A (en) | 2006-11-16 |
| TWI305804B (https=) | 2009-02-01 |
| JP4700406B2 (ja) | 2011-06-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100929 Termination date: 20150426 |
|
| EXPY | Termination of patent right or utility model |