CN1784124A - 图案形成系统、图案形成方法以及电子设备 - Google Patents
图案形成系统、图案形成方法以及电子设备 Download PDFInfo
- Publication number
- CN1784124A CN1784124A CNA2005101187321A CN200510118732A CN1784124A CN 1784124 A CN1784124 A CN 1784124A CN A2005101187321 A CNA2005101187321 A CN A2005101187321A CN 200510118732 A CN200510118732 A CN 200510118732A CN 1784124 A CN1784124 A CN 1784124A
- Authority
- CN
- China
- Prior art keywords
- base plate
- belt base
- pattern
- workbench
- described belt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J11/00—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
- B41J11/0085—Using suction for maintaining printing material flat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J11/00—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
- B41J11/36—Blanking or long feeds; Feeding to a particular line, e.g. by rotation of platen or feed roller
- B41J11/42—Controlling printing material conveyance for accurate alignment of the printing material with the printhead; Print registering
- B41J11/44—Controlling printing material conveyance for accurate alignment of the printing material with the printhead; Print registering by devices, e.g. programme tape or contact wheel, moved in correspondence with movement of paper-feeding devices, e.g. platen rotation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J15/00—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, specially adapted for supporting or handling copy material in continuous form, e.g. webs
- B41J15/005—Forming loops or sags in webs, e.g. for slackening a web or for compensating variations of the amount of conveyed web material (by arranging a "dancing roller" in a sag of the web material)
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (9)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004312233A JP4042737B2 (ja) | 2004-10-27 | 2004-10-27 | パターン形成システム |
JP2004312233 | 2004-10-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1784124A true CN1784124A (zh) | 2006-06-07 |
CN100496194C CN100496194C (zh) | 2009-06-03 |
Family
ID=36205794
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005101187321A Active CN100496194C (zh) | 2004-10-27 | 2005-10-27 | 图案形成系统、图案形成方法以及电子设备 |
Country Status (5)
Country | Link |
---|---|
US (3) | US7462241B2 (zh) |
JP (1) | JP4042737B2 (zh) |
KR (1) | KR100721843B1 (zh) |
CN (1) | CN100496194C (zh) |
TW (1) | TWI283548B (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102161261A (zh) * | 2010-12-18 | 2011-08-24 | 江苏锐毕利实业有限公司 | 挠性印刷电路板多工位喷印系统 |
CN102328504A (zh) * | 2011-06-03 | 2012-01-25 | 珠海紫翔电子科技有限公司 | 一种用于挠性线路板油墨固化的装置和方法 |
CN102333418A (zh) * | 2011-06-03 | 2012-01-25 | 珠海紫翔电子科技有限公司 | 挠性线路板油墨固化的装置和方法 |
CN102529439A (zh) * | 2011-12-13 | 2012-07-04 | 苏州工业园区高登威科技有限公司 | 一种喷墨打标机 |
CN114902316A (zh) * | 2020-06-30 | 2022-08-12 | 昆山国显光电有限公司 | 一种柔性显示设备以及显示系统 |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4042737B2 (ja) * | 2004-10-27 | 2008-02-06 | セイコーエプソン株式会社 | パターン形成システム |
TWI277373B (en) * | 2005-09-16 | 2007-03-21 | Foxconn Advanced Tech Inc | Method of continuous producing flexible printed circuit board |
JP4967506B2 (ja) * | 2006-07-28 | 2012-07-04 | セイコーエプソン株式会社 | 描画方法及び描画装置 |
TWI401205B (zh) * | 2008-01-31 | 2013-07-11 | Ind Tech Res Inst | 利用光熱效應製作應用基板的方法 |
WO2010038894A1 (ja) * | 2008-10-03 | 2010-04-08 | 国立大学法人東京工業大学 | プラズマを用いた処理方法 |
JP5548426B2 (ja) * | 2009-10-29 | 2014-07-16 | 株式会社日立製作所 | インクジェット塗布装置及び方法 |
JP5606258B2 (ja) * | 2010-10-06 | 2014-10-15 | 東レエンジニアリング株式会社 | 塗布方法および塗布装置 |
JP5697967B2 (ja) * | 2010-12-20 | 2015-04-08 | 東レエンジニアリング株式会社 | 塗布方法および塗布装置 |
JP5663342B2 (ja) * | 2011-02-21 | 2015-02-04 | 東レエンジニアリング株式会社 | 塗布方法および塗布装置 |
JP5529835B2 (ja) * | 2011-11-22 | 2014-06-25 | 富士フイルム株式会社 | 導電性パターン形成方法及び導電性パターン形成システム |
CN102806768B (zh) * | 2012-08-30 | 2014-09-03 | 青岛友结意电子有限公司 | 电子产品原资材自动纳印设备 |
JP6073603B2 (ja) * | 2012-08-31 | 2017-02-01 | 古河機械金属株式会社 | 基板の製造方法 |
US10470301B2 (en) * | 2013-04-26 | 2019-11-05 | Showa Denko K.K. | Method for manufacturing conductive pattern and conductive pattern formed substrate |
JP6173795B2 (ja) * | 2013-06-28 | 2017-08-02 | 東レエンジニアリング株式会社 | 基板把持装置 |
KR101487834B1 (ko) | 2013-11-08 | 2015-02-03 | 주식회사 서남 | 세라믹 선재의 제조설비 |
FR3029445B1 (fr) * | 2014-12-09 | 2017-09-29 | Fibroline France | Installation d'impregnation d'un support poreux comprenant des electrodes revetues optimisees |
KR102410347B1 (ko) * | 2017-09-04 | 2022-06-17 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
US20230282792A1 (en) * | 2020-08-18 | 2023-09-07 | Lg Electronics Inc. | Thermocompression device and method of manufacturing display device using same |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5132248A (en) | 1988-05-31 | 1992-07-21 | The United States Of America As Represented By The United States Department Of Energy | Direct write with microelectronic circuit fabrication |
JP3379361B2 (ja) | 1996-12-12 | 2003-02-24 | ウシオ電機株式会社 | シート状ワークのプロキシミティ露光装置 |
US6312123B1 (en) * | 1998-05-01 | 2001-11-06 | L&P Property Management Company | Method and apparatus for UV ink jet printing on fabric and combination printing and quilting thereby |
KR20010030575A (ko) * | 1998-07-28 | 2001-04-16 | 이마이 기요스케 | 가요성 소재의 연속 기판시트 상에 형성된 개별배선패턴을 검사하는 검사시스템 |
JP3675267B2 (ja) | 1999-12-22 | 2005-07-27 | 松下電工株式会社 | 積層体製造用積層ブロックの作製方法および作製装置 |
JP3418736B2 (ja) * | 2000-05-08 | 2003-06-23 | ニュー・クリエイト株式会社 | 巻出し式スクリーン印刷方法および印刷装置 |
JP3896790B2 (ja) * | 2001-01-11 | 2007-03-22 | セイコーエプソン株式会社 | カード用の画像形成方法および画像形成装置 |
US6682171B2 (en) * | 2001-02-13 | 2004-01-27 | Seiko Epson Corporation | Ink jet head unit and ink jet printing apparatus incorporating the same |
JP2003094626A (ja) | 2001-09-26 | 2003-04-03 | Seiko Epson Corp | 画像形成方法および画像形成装置 |
US7524528B2 (en) * | 2001-10-05 | 2009-04-28 | Cabot Corporation | Precursor compositions and methods for the deposition of passive electrical components on a substrate |
JP4066661B2 (ja) * | 2002-01-23 | 2008-03-26 | セイコーエプソン株式会社 | 有機el装置の製造装置および液滴吐出装置 |
JP3985559B2 (ja) * | 2002-03-19 | 2007-10-03 | セイコーエプソン株式会社 | 吐出装置、並びに液晶表示装置の製造方法、有機el装置の製造方法、電子放出装置の製造方法、pdp装置の製造方法、電気泳動表示装置の製造方法、カラーフィルタの製造方法、有機elの製造方法、スペーサ形成方法、金属配線形成方法、レンズ形成方法、レジスト形成方法および光拡散体形成方法 |
JP2003266738A (ja) * | 2002-03-19 | 2003-09-24 | Seiko Epson Corp | 吐出装置用ヘッドユニットおよびこれを備えた吐出装置、並びに液晶表示装置の製造方法、有機el装置の製造方法、電子放出装置の製造方法、pdp装置の製造方法、電気泳動表示装置の製造方法、カラーフィルタの製造方法、有機elの製造方法、スペーサ形成方法、金属配線形成方法、レンズ形成方法、レジスト形成方法および光拡散体形成方法 |
JP2003280535A (ja) | 2002-03-26 | 2003-10-02 | Seiko Epson Corp | 表示装置製造方法、表示装置製造装置、表示装置、及びデバイス |
JP2004074642A (ja) * | 2002-08-20 | 2004-03-11 | Komori Corp | 輪転印刷機 |
JP4389443B2 (ja) * | 2002-12-20 | 2009-12-24 | セイコーエプソン株式会社 | インクジェットヘッドのワイピングユニット、これを備えた液滴吐出装置および電気光学装置の製造方法 |
JP4207860B2 (ja) * | 2004-07-14 | 2009-01-14 | セイコーエプソン株式会社 | 層形成方法、配線基板、電気光学装置、および電子機器 |
JP4371037B2 (ja) * | 2004-10-21 | 2009-11-25 | セイコーエプソン株式会社 | 液滴吐出装置および電気光学装置の製造方法 |
JP4042737B2 (ja) * | 2004-10-27 | 2008-02-06 | セイコーエプソン株式会社 | パターン形成システム |
-
2004
- 2004-10-27 JP JP2004312233A patent/JP4042737B2/ja active Active
-
2005
- 2005-09-06 US US11/218,545 patent/US7462241B2/en not_active Expired - Fee Related
- 2005-10-11 KR KR1020050095547A patent/KR100721843B1/ko active IP Right Grant
- 2005-10-11 TW TW094135406A patent/TWI283548B/zh not_active IP Right Cessation
- 2005-10-27 CN CNB2005101187321A patent/CN100496194C/zh active Active
-
2008
- 2008-09-23 US US12/232,715 patent/US7871666B2/en active Active
-
2010
- 2010-12-08 US US12/963,013 patent/US20110097515A1/en not_active Abandoned
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102161261A (zh) * | 2010-12-18 | 2011-08-24 | 江苏锐毕利实业有限公司 | 挠性印刷电路板多工位喷印系统 |
CN102328504A (zh) * | 2011-06-03 | 2012-01-25 | 珠海紫翔电子科技有限公司 | 一种用于挠性线路板油墨固化的装置和方法 |
CN102333418A (zh) * | 2011-06-03 | 2012-01-25 | 珠海紫翔电子科技有限公司 | 挠性线路板油墨固化的装置和方法 |
CN102333418B (zh) * | 2011-06-03 | 2013-04-24 | 珠海紫翔电子科技有限公司 | 挠性线路板油墨固化的装置和方法 |
CN102529439A (zh) * | 2011-12-13 | 2012-07-04 | 苏州工业园区高登威科技有限公司 | 一种喷墨打标机 |
CN114902316A (zh) * | 2020-06-30 | 2022-08-12 | 昆山国显光电有限公司 | 一种柔性显示设备以及显示系统 |
CN114902316B (zh) * | 2020-06-30 | 2023-10-27 | 昆山国显光电有限公司 | 一种柔性显示设备以及显示系统 |
US12085989B2 (en) | 2020-06-30 | 2024-09-10 | Kunshan Go-Visionox Opto-Electronics Co., Ltd | Flexible display device and display system |
Also Published As
Publication number | Publication date |
---|---|
TWI283548B (en) | 2007-07-01 |
KR100721843B1 (ko) | 2007-05-28 |
JP4042737B2 (ja) | 2008-02-06 |
US7462241B2 (en) | 2008-12-09 |
US20090035453A1 (en) | 2009-02-05 |
JP2006128273A (ja) | 2006-05-18 |
TW200625998A (en) | 2006-07-16 |
KR20060052180A (ko) | 2006-05-19 |
US20110097515A1 (en) | 2011-04-28 |
US7871666B2 (en) | 2011-01-18 |
US20060087545A1 (en) | 2006-04-27 |
CN100496194C (zh) | 2009-06-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1784124A (zh) | 图案形成系统、图案形成方法以及电子设备 | |
JP3966292B2 (ja) | パターンの形成方法及びパターン形成装置、デバイスの製造方法、導電膜配線、電気光学装置、並びに電子機器 | |
JP4123172B2 (ja) | 薄膜パターンの形成方法及びデバイスの製造方法、電気光学装置及び電子機器 | |
JP4720069B2 (ja) | 電気光学装置及び電子機器 | |
JP4161964B2 (ja) | パターン形成方法、パターン形成システムおよび電子機器 | |
CN1674767A (zh) | 图案形成方法、电路基板以及电子器件 | |
JP3966294B2 (ja) | パターンの形成方法及びデバイスの製造方法 | |
JP3966293B2 (ja) | パターンの形成方法及びデバイスの製造方法 | |
CN1756458A (zh) | 配线基板的制造方法及电子设备 | |
US7629019B2 (en) | Method for forming wiring pattern, wiring pattern, and electronic apparatus | |
CN100512598C (zh) | 配线图案的形成方法、多层配线基板的制法和电子设备 | |
JP2004295092A (ja) | 電気光学パネルの製造方法及び電子機器の製造方法、電気光学パネルのカラーフィルタ保護膜材料、並びに電気光学パネル、電気光学装置及び電子機器 | |
JP2009255082A (ja) | パターン形成方法、パターン形成システム、並びに電子機器 | |
JP5344078B2 (ja) | 電気光学装置及び電子機器 | |
CN1822748A (zh) | 膜图案的形成方法及器件的制造方法、电光学装置及电子机器 | |
CN1755905A (zh) | 薄膜晶体管的制造方法 | |
JP4462007B2 (ja) | パターン形成方法及びパターン形成システム | |
JP4524608B2 (ja) | 配線パターン形成方法及び配線パターン形成システム | |
CN1762706A (zh) | 配线图案的形成方法、配线图案和电子仪器 | |
JP2006100397A (ja) | 多層配線基板の製造方法、電子機器 | |
JP2010075925A (ja) | パターン形成方法 | |
JP2006095381A (ja) | 膜形成方法、配線パターン形成方法、配線パターン、電子機器 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180702 Address after: California, USA Patentee after: KATEEVA, Inc. Address before: Tokyo, Japan Patentee before: Seiko Epson Corp. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20201103 Address after: 326 Yinqiao Road, Yuecheng District, Shaoxing City, Zhejiang Province Patentee after: Kedihua display technology (Shaoxing) Co.,Ltd. Address before: California, USA Patentee before: KATEEVA, Inc. |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Pattern formation system, pattern formation method, and electronic device Effective date of registration: 20230625 Granted publication date: 20090603 Pledgee: Xinji Co.,Ltd. Pledgor: Kedihua display technology (Shaoxing) Co.,Ltd. Registration number: Y2023990000312 |