CN1742233A - 能正性成像的厚膜组合物 - Google Patents

能正性成像的厚膜组合物 Download PDF

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Publication number
CN1742233A
CN1742233A CNA2003801092354A CN200380109235A CN1742233A CN 1742233 A CN1742233 A CN 1742233A CN A2003801092354 A CNA2003801092354 A CN A2003801092354A CN 200380109235 A CN200380109235 A CN 200380109235A CN 1742233 A CN1742233 A CN 1742233A
Authority
CN
China
Prior art keywords
composition
film
acrylate
patterned structure
methacrylate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2003801092354A
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English (en)
Chinese (zh)
Inventor
D·H·罗奇
Y·H·金
L·-T·A·程
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of CN1742233A publication Critical patent/CN1742233A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electrodes For Cathode-Ray Tubes (AREA)
  • Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
  • Discharge Lamps And Accessories Thereof (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
CNA2003801092354A 2002-12-06 2003-12-05 能正性成像的厚膜组合物 Pending CN1742233A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US43139202P 2002-12-06 2002-12-06
US60/431,392 2002-12-06

Publications (1)

Publication Number Publication Date
CN1742233A true CN1742233A (zh) 2006-03-01

Family

ID=32507722

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2003801092354A Pending CN1742233A (zh) 2002-12-06 2003-12-05 能正性成像的厚膜组合物

Country Status (7)

Country Link
US (2) US20040170925A1 (enExample)
EP (1) EP1567917A2 (enExample)
JP (1) JP2006510046A (enExample)
KR (1) KR20050084150A (enExample)
CN (1) CN1742233A (enExample)
AU (1) AU2003293441A1 (enExample)
WO (1) WO2004053593A2 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101125944B (zh) * 2006-04-26 2011-05-18 三星Sdi株式会社 组合物及由其形成的电子发射源和电子发射装置
CN101086617B (zh) * 2006-06-09 2012-07-04 太阳控股株式会社 光固化性组合物以及使用其得到的烧成物图案
CN104541202A (zh) * 2012-08-31 2015-04-22 富士胶片株式会社 感光性树脂组合物、硬化物及其制造方法、树脂图案的制造方法、硬化膜、液晶显示装置、有机el显示装置、以及触摸屏显示装置

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003287660A1 (en) * 2002-11-15 2004-06-15 E.I. Du Pont De Nemours And Company Process for using protective layers in the fabrication of electronic devices
GB0227902D0 (en) * 2002-11-29 2003-01-08 Ingenia Holdings Ltd Template
US8298754B2 (en) * 2003-11-25 2012-10-30 Murata Manufacturing Co., Ltd. Method for forming thick film pattern, method for manufacturing electronic component, and photolithography photosensitive paste
US7402373B2 (en) * 2004-02-05 2008-07-22 E.I. Du Pont De Nemours And Company UV radiation blocking protective layers compatible with thick film pastes
KR101042667B1 (ko) * 2004-07-05 2011-06-20 주식회사 동진쎄미켐 포토레지스트 조성물
KR20060090520A (ko) * 2005-02-07 2006-08-11 삼성전자주식회사 감광성 수지 및 상기 감광성 수지로 이루어진 패턴을포함하는 박막 표시판 및 그 제조 방법
US7524606B2 (en) 2005-04-11 2009-04-28 Az Electronic Materials Usa Corp. Nanocomposite photoresist composition for imaging thick films
US7247419B2 (en) 2005-04-11 2007-07-24 Az Electronic Materials Usa Corp. Nanocomposite photosensitive composition and use thereof
JP4861767B2 (ja) 2005-07-26 2012-01-25 富士フイルム株式会社 ポジ型レジスト組成物およびそれを用いたパターン形成方法
US8507180B2 (en) * 2006-11-28 2013-08-13 Tokyo Ohka Kogyo Co., Ltd. Chemically amplified positive-type photoresist composition for thick film, chemically amplified dry film for thick film, and method for production of thick film resist pattern
KR101034346B1 (ko) * 2006-12-22 2011-05-16 주식회사 엘지화학 탄소 나노 튜브를 통한 내열성 개선의 감광성 수지 조성물
US8310069B2 (en) * 2007-10-05 2012-11-13 Texas Instruements Incorporated Semiconductor package having marking layer
US20100288980A1 (en) * 2007-11-15 2010-11-18 E. I. Du Pont De Nemours And Company Protection of carbon nanotubes
US20110012035A1 (en) * 2009-07-15 2011-01-20 Texas Instruments Incorporated Method for Precision Symbolization Using Digital Micromirror Device Technology
US20140267107A1 (en) 2013-03-15 2014-09-18 Sinovia Technologies Photoactive Transparent Conductive Films
US20130189524A1 (en) * 2012-01-19 2013-07-25 Brewer Science Inc. Viscous fugitive polymer-based carbon nanotube coatings
TW201421154A (zh) * 2012-10-26 2014-06-01 Fujifilm Corp 感光性樹脂組成物、硬化物及其製造方法、樹脂圖案製造方法、硬化膜、有機ｅｌ顯示裝置、液晶顯示裝置以及觸控面板顯示裝置
JP6564196B2 (ja) * 2014-03-20 2019-08-21 東京応化工業株式会社 厚膜用化学増幅型ポジ型感光性樹脂組成物
WO2018213432A1 (en) 2017-05-17 2018-11-22 Formlabs, Inc. Techniques for casting from additively fabricated molds and related systems and methods

Family Cites Families (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5915394B2 (ja) * 1978-08-31 1984-04-09 富士通株式会社 厚膜微細パタ−ン生成方法
DD234196A3 (de) * 1983-02-09 1986-03-26 Ptnjj Npo Elektronpribor Fotoempfindliche dielektrische mischung
JPS6232453A (ja) * 1985-08-06 1987-02-12 Tokyo Ohka Kogyo Co Ltd ポジ型ホトレジスト用現像液
US4939070A (en) * 1986-07-28 1990-07-03 Brunsvold William R Thermally stable photoresists with high sensitivity
US5256836A (en) * 1989-06-09 1993-10-26 Toshiba Lighting & Technology Corporation Thick film hybrid circuit board device and method of manufacturing the same
US4985332A (en) * 1990-04-10 1991-01-15 E. I. Du Pont De Nemours And Company Resist material with carbazole diazonium salt acid generator and process for use
JP2670711B2 (ja) * 1990-05-29 1997-10-29 富士写真フイルム株式会社 ネガ型感光性樹脂組成物用現像液
DE69130701T2 (de) * 1990-10-29 1999-08-26 Toyo Gosei Kogyo Co. Ltd. Lichtempfindliches gefärbtes Harz, farbiges Bild, Verfahren zur Herstellung von Farbfiltern und Verfahren zur Herstellung einer Schwarzmatrix
US5164286A (en) * 1991-02-01 1992-11-17 Ocg Microelectronic Materials, Inc. Photoresist developer containing fluorinated amphoteric surfactant
US6074893A (en) * 1993-09-27 2000-06-13 Sumitomo Metal Industries, Ltd. Process for forming fine thick-film conductor patterns
NL9301908A (nl) * 1993-11-04 1995-06-01 Spiro Research Bv Werkwijze en inrichting voor het ontluchten van een vloeistof in een in hoofdzaak gesloten vloeistofcirculatiesysteem.
US6060207A (en) * 1994-07-11 2000-05-09 Kabushiki Kaisha Toshiba Photosensitive material
US5506090A (en) * 1994-09-23 1996-04-09 Minnesota Mining And Manufacturing Company Process for making shoot and run printing plates
JPH08148787A (ja) * 1994-11-21 1996-06-07 Sumitomo Kinzoku Ceramics:Kk 厚膜ペースト
DE69614502D1 (de) * 1995-09-29 2001-09-20 Nippon Kayaku Kk Aktinische strahlungshärtbare und wärmestrahlungsabweisende harzzusammensetzung und damit beschichteter film
US5879856A (en) * 1995-12-05 1999-03-09 Shipley Company, L.L.C. Chemically amplified positive photoresists
US5942367A (en) * 1996-04-24 1999-08-24 Shin-Etsu Chemical Co., Ltd. Chemically amplified positive resist composition, pattern forming method, and method for preparing polymer having a crosslinking group
JP3297324B2 (ja) * 1996-10-30 2002-07-02 富士通株式会社 レジスト組成物、レジストパターンの形成方法及び半導体装置の製造方法
US6323361B1 (en) * 1997-04-17 2001-11-27 Corning Inc. Photocurable halofluorinated acrylates
JPH10340666A (ja) * 1997-06-09 1998-12-22 Futaba Corp 電界電子放出素子
US6291129B1 (en) * 1997-08-29 2001-09-18 Kabushiki Kaisha Toshiba Monomer, high molecular compound and photosensitive composition
US6399279B1 (en) * 1998-01-16 2002-06-04 Mitsubishi Chemical Corporation Method for forming a positive image
KR100594768B1 (ko) * 1998-03-12 2006-07-03 후지 샤신 필름 가부시기가이샤 포지티브 감광성 조성물
KR100571313B1 (ko) * 1998-03-17 2006-04-17 후지 샤신 필름 가부시기가이샤 포지티브 감광성 조성물
WO1999048945A1 (en) * 1998-03-20 1999-09-30 Nippon Soda Co., Ltd. Photocurable composition containing iodonium salt compound
US6294270B1 (en) * 1998-12-23 2001-09-25 3M Innovative Properties Company Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer
US6455234B1 (en) * 1999-05-04 2002-09-24 Air Products And Chemicals, Inc. Acetylenic diol ethylene oxide/propylene oxide adducts and their use in photoresist developers
KR20010051350A (ko) * 1999-11-01 2001-06-25 이시마루 기미오, 다께우찌 마사아끼 활성 입자, 감광성 수지 조성물 및 패턴 형성 방법
US7449081B2 (en) * 2000-06-21 2008-11-11 E. I. Du Pont De Nemours And Company Process for improving the emission of electron field emitters
US6534235B1 (en) * 2000-10-31 2003-03-18 Kansai Research Institute, Inc. Photosensitive resin composition and process for forming pattern
TW583503B (en) * 2000-12-01 2004-04-11 Kansai Paint Co Ltd Method of forming conductive pattern
JP3914386B2 (ja) * 2000-12-28 2007-05-16 株式会社ルネサステクノロジ フォトマスク、その製造方法、パターン形成方法および半導体装置の製造方法
JP4317330B2 (ja) * 2001-02-07 2009-08-19 富士フイルム株式会社 感光性平版印刷版の製版方法
US6656667B2 (en) * 2001-03-14 2003-12-02 United Microelectronics Corp. Multiple resist layer photolithographic process
US20020187438A1 (en) * 2001-06-12 2002-12-12 Ching-Yu Chang Development method for manufacturing semiconductors
US7008754B2 (en) * 2001-09-11 2006-03-07 Daiken Chemical Co., Ltd. Method for forming image on object surface including circuit substrate
US20030070559A1 (en) * 2001-10-15 2003-04-17 Victor Robert J. Vegetable and related food products steamer cooker
US20030073042A1 (en) * 2001-10-17 2003-04-17 Cernigliaro George J. Process and materials for formation of patterned films of functional materials
KR100646793B1 (ko) * 2001-11-13 2006-11-17 삼성전자주식회사 씬너 조성물
JP2003195518A (ja) * 2001-12-14 2003-07-09 Shipley Co Llc フォトレジスト用現像液
JP2003195517A (ja) * 2001-12-14 2003-07-09 Shipley Co Llc フォトレジスト用現像液
US6900003B2 (en) * 2002-04-12 2005-05-31 Shipley Company, L.L.C. Photoresist processing aid and method
US6769945B2 (en) * 2002-08-24 2004-08-03 Industrial Technology Research Institute Method of growing isomeric carbon emitters onto triode structure of field emission display
US6798127B2 (en) * 2002-10-09 2004-09-28 Nano-Proprietary, Inc. Enhanced field emission from carbon nanotubes mixed with particles
US20040140861A1 (en) * 2002-11-15 2004-07-22 Alvarez Robby L. High temperature superconducting mini-filter resonator configuration with low sensitivity to variations in substrate thickness and resonator patterning
AU2003287660A1 (en) * 2002-11-15 2004-06-15 E.I. Du Pont De Nemours And Company Process for using protective layers in the fabrication of electronic devices
KR101012586B1 (ko) * 2003-01-22 2011-02-07 이 아이 듀폰 디 네모아 앤드 캄파니 후막 페이스트 층의 결합제 확산 패턴화
JP4040544B2 (ja) * 2003-06-27 2008-01-30 東京応化工業株式会社 レジスト用現像液組成物およびレジストパターンの形成方法
US7186498B2 (en) * 2003-10-02 2007-03-06 Willi-Kurt Gries Alkaline developer for radiation sensitive compositions
US7125648B2 (en) * 2003-12-19 2006-10-24 Fuji Photo Film Co., Ltd. Method for forming images
US7402373B2 (en) * 2004-02-05 2008-07-22 E.I. Du Pont De Nemours And Company UV radiation blocking protective layers compatible with thick film pastes
JP2008500588A (ja) * 2004-05-27 2008-01-10 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー フォトポリマー保護層用現像剤

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101125944B (zh) * 2006-04-26 2011-05-18 三星Sdi株式会社 组合物及由其形成的电子发射源和电子发射装置
CN101086617B (zh) * 2006-06-09 2012-07-04 太阳控股株式会社 光固化性组合物以及使用其得到的烧成物图案
CN104541202A (zh) * 2012-08-31 2015-04-22 富士胶片株式会社 感光性树脂组合物、硬化物及其制造方法、树脂图案的制造方法、硬化膜、液晶显示装置、有机el显示装置、以及触摸屏显示装置
CN104541202B (zh) * 2012-08-31 2019-03-01 富士胶片株式会社 树脂组合物、硬化膜、物及其与图案的制法、及显示装置

Also Published As

Publication number Publication date
EP1567917A2 (en) 2005-08-31
WO2004053593A3 (en) 2004-10-28
AU2003293441A1 (en) 2004-06-30
US20040170925A1 (en) 2004-09-02
KR20050084150A (ko) 2005-08-26
WO2004053593A2 (en) 2004-06-24
JP2006510046A (ja) 2006-03-23
AU2003293441A8 (en) 2004-06-30
US20080166666A1 (en) 2008-07-10

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