JP2006510046A - ポジ画像形成性厚膜組成物 - Google Patents
ポジ画像形成性厚膜組成物 Download PDFInfo
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- JP2006510046A JP2006510046A JP2004559365A JP2004559365A JP2006510046A JP 2006510046 A JP2006510046 A JP 2006510046A JP 2004559365 A JP2004559365 A JP 2004559365A JP 2004559365 A JP2004559365 A JP 2004559365A JP 2006510046 A JP2006510046 A JP 2006510046A
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- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 230000002186 photoactivation Effects 0.000 description 1
- 238000006303 photolysis reaction Methods 0.000 description 1
- 230000015843 photosynthesis, light reaction Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 238000006862 quantum yield reaction Methods 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000011819 refractory material Substances 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 238000000807 solvent casting Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- BPCBXWVRESTYBG-UHFFFAOYSA-N tert-butyl 3-phenylprop-2-eneperoxoate Chemical compound CC(C)(C)OOC(=O)C=CC1=CC=CC=C1 BPCBXWVRESTYBG-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000005931 tert-butyloxycarbonyl group Chemical group [H]C([H])([H])C(OC(*)=O)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 125000001412 tetrahydropyranyl group Chemical group 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Electrodes For Cathode-Ray Tubes (AREA)
- Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
- Discharge Lamps And Accessories Thereof (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US43139202P | 2002-12-06 | 2002-12-06 | |
| PCT/US2003/038810 WO2004053593A2 (en) | 2002-12-06 | 2003-12-05 | Positive imageable thick film compositions |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006510046A true JP2006510046A (ja) | 2006-03-23 |
| JP2006510046A5 JP2006510046A5 (enExample) | 2007-02-01 |
Family
ID=32507722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004559365A Pending JP2006510046A (ja) | 2002-12-06 | 2003-12-05 | ポジ画像形成性厚膜組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US20040170925A1 (enExample) |
| EP (1) | EP1567917A2 (enExample) |
| JP (1) | JP2006510046A (enExample) |
| KR (1) | KR20050084150A (enExample) |
| CN (1) | CN1742233A (enExample) |
| AU (1) | AU2003293441A1 (enExample) |
| WO (1) | WO2004053593A2 (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007526936A (ja) * | 2004-02-05 | 2007-09-20 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 厚膜ペーストと適合性のｕｖ放射遮断保護層 |
| WO2014034768A1 (ja) * | 2012-08-31 | 2014-03-06 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化物及びその製造方法、樹脂パターン製造方法、硬化膜、液晶表示装置、有機ｅｌ表示装置、並びに、タッチパネル表示装置 |
| WO2014065351A1 (ja) * | 2012-10-26 | 2014-05-01 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化物及びその製造方法、樹脂パターン製造方法、硬化膜、有機ｅｌ表示装置、液晶表示装置、並びに、タッチパネル表示装置 |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2003287660A1 (en) * | 2002-11-15 | 2004-06-15 | E.I. Du Pont De Nemours And Company | Process for using protective layers in the fabrication of electronic devices |
| GB0227902D0 (en) * | 2002-11-29 | 2003-01-08 | Ingenia Holdings Ltd | Template |
| US8298754B2 (en) * | 2003-11-25 | 2012-10-30 | Murata Manufacturing Co., Ltd. | Method for forming thick film pattern, method for manufacturing electronic component, and photolithography photosensitive paste |
| KR101042667B1 (ko) * | 2004-07-05 | 2011-06-20 | 주식회사 동진쎄미켐 | 포토레지스트 조성물 |
| KR20060090520A (ko) * | 2005-02-07 | 2006-08-11 | 삼성전자주식회사 | 감광성 수지 및 상기 감광성 수지로 이루어진 패턴을포함하는 박막 표시판 및 그 제조 방법 |
| US7524606B2 (en) | 2005-04-11 | 2009-04-28 | Az Electronic Materials Usa Corp. | Nanocomposite photoresist composition for imaging thick films |
| US7247419B2 (en) | 2005-04-11 | 2007-07-24 | Az Electronic Materials Usa Corp. | Nanocomposite photosensitive composition and use thereof |
| JP4861767B2 (ja) | 2005-07-26 | 2012-01-25 | 富士フイルム株式会社 | ポジ型レジスト組成物およびそれを用いたパターン形成方法 |
| KR101166016B1 (ko) | 2006-04-26 | 2012-07-19 | 삼성에스디아이 주식회사 | 전자 방출원 형성용 조성물, 이로부터 제조된 전자 방출원및 상기 전자 방출원을 구비한 전자 방출 소자 |
| JP4751773B2 (ja) * | 2006-06-09 | 2011-08-17 | 太陽ホールディングス株式会社 | 光硬化性組成物及びそれを用いて形成した焼成物パターン |
| US8507180B2 (en) * | 2006-11-28 | 2013-08-13 | Tokyo Ohka Kogyo Co., Ltd. | Chemically amplified positive-type photoresist composition for thick film, chemically amplified dry film for thick film, and method for production of thick film resist pattern |
| KR101034346B1 (ko) * | 2006-12-22 | 2011-05-16 | 주식회사 엘지화학 | 탄소 나노 튜브를 통한 내열성 개선의 감광성 수지 조성물 |
| US8310069B2 (en) * | 2007-10-05 | 2012-11-13 | Texas Instruements Incorporated | Semiconductor package having marking layer |
| US20100288980A1 (en) * | 2007-11-15 | 2010-11-18 | E. I. Du Pont De Nemours And Company | Protection of carbon nanotubes |
| US20110012035A1 (en) * | 2009-07-15 | 2011-01-20 | Texas Instruments Incorporated | Method for Precision Symbolization Using Digital Micromirror Device Technology |
| US20140267107A1 (en) | 2013-03-15 | 2014-09-18 | Sinovia Technologies | Photoactive Transparent Conductive Films |
| US20130189524A1 (en) * | 2012-01-19 | 2013-07-25 | Brewer Science Inc. | Viscous fugitive polymer-based carbon nanotube coatings |
| JP6564196B2 (ja) * | 2014-03-20 | 2019-08-21 | 東京応化工業株式会社 | 厚膜用化学増幅型ポジ型感光性樹脂組成物 |
| WO2018213432A1 (en) | 2017-05-17 | 2018-11-22 | Formlabs, Inc. | Techniques for casting from additively fabricated molds and related systems and methods |
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-
2003
- 2003-12-04 US US10/728,210 patent/US20040170925A1/en not_active Abandoned
- 2003-12-05 JP JP2004559365A patent/JP2006510046A/ja active Pending
- 2003-12-05 WO PCT/US2003/038810 patent/WO2004053593A2/en not_active Ceased
- 2003-12-05 EP EP03790390A patent/EP1567917A2/en not_active Withdrawn
- 2003-12-05 AU AU2003293441A patent/AU2003293441A1/en not_active Abandoned
- 2003-12-05 CN CNA2003801092354A patent/CN1742233A/zh active Pending
- 2003-12-05 KR KR1020057010117A patent/KR20050084150A/ko not_active Ceased
-
2008
- 2008-03-05 US US12/042,772 patent/US20080166666A1/en not_active Abandoned
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007526936A (ja) * | 2004-02-05 | 2007-09-20 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 厚膜ペーストと適合性のｕｖ放射遮断保護層 |
| WO2014034768A1 (ja) * | 2012-08-31 | 2014-03-06 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化物及びその製造方法、樹脂パターン製造方法、硬化膜、液晶表示装置、有機ｅｌ表示装置、並びに、タッチパネル表示装置 |
| JPWO2014034768A1 (ja) * | 2012-08-31 | 2016-08-08 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化物及びその製造方法、樹脂パターン製造方法、硬化膜、液晶表示装置、有機ｅｌ表示装置、並びに、タッチパネル表示装置 |
| TWI585522B (zh) * | 2012-08-31 | 2017-06-01 | 富士軟片股份有限公司 | 感光性樹脂組成物、硬化物及其製造方法、樹脂圖案的製造方法、硬化膜、液晶顯示裝置、有機ｅｌ顯示裝置、以及觸控面板顯示裝置 |
| WO2014065351A1 (ja) * | 2012-10-26 | 2014-05-01 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化物及びその製造方法、樹脂パターン製造方法、硬化膜、有機ｅｌ表示装置、液晶表示装置、並びに、タッチパネル表示装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1567917A2 (en) | 2005-08-31 |
| WO2004053593A3 (en) | 2004-10-28 |
| AU2003293441A1 (en) | 2004-06-30 |
| US20040170925A1 (en) | 2004-09-02 |
| CN1742233A (zh) | 2006-03-01 |
| KR20050084150A (ko) | 2005-08-26 |
| WO2004053593A2 (en) | 2004-06-24 |
| AU2003293441A8 (en) | 2004-06-30 |
| US20080166666A1 (en) | 2008-07-10 |
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