CN1717627A - 含有无卤素着色剂的感光树脂组合物 - Google Patents
含有无卤素着色剂的感光树脂组合物 Download PDFInfo
- Publication number
- CN1717627A CN1717627A CNA2003801043254A CN200380104325A CN1717627A CN 1717627 A CN1717627 A CN 1717627A CN A2003801043254 A CNA2003801043254 A CN A2003801043254A CN 200380104325 A CN200380104325 A CN 200380104325A CN 1717627 A CN1717627 A CN 1717627A
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- CN
- China
- Prior art keywords
- component
- alkyl
- phenyl
- photosensitive resin
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000011342 resin composition Substances 0.000 title claims abstract description 16
- 239000003086 colorant Substances 0.000 title claims description 27
- 150000001875 compounds Chemical class 0.000 claims abstract description 21
- 239000004593 Epoxy Substances 0.000 claims abstract description 12
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 11
- 239000001257 hydrogen Substances 0.000 claims abstract description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 8
- 239000000040 green colorant Substances 0.000 claims abstract description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 6
- 239000000178 monomer Substances 0.000 claims abstract description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000003513 alkali Substances 0.000 claims abstract description 5
- 239000000203 mixture Substances 0.000 claims description 21
- 239000000126 substance Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 12
- 239000002585 base Substances 0.000 claims description 9
- 238000013007 heat curing Methods 0.000 claims description 7
- 239000002671 adjuvant Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 4
- 239000003973 paint Substances 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 239000007864 aqueous solution Substances 0.000 claims description 2
- 238000001704 evaporation Methods 0.000 claims description 2
- 238000003384 imaging method Methods 0.000 claims description 2
- 230000009257 reactivity Effects 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- 238000005406 washing Methods 0.000 claims description 2
- 239000004615 ingredient Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 abstract description 27
- 238000004519 manufacturing process Methods 0.000 abstract description 15
- 238000007747 plating Methods 0.000 abstract description 4
- 239000000654 additive Substances 0.000 abstract description 2
- 229920000642 polymer Polymers 0.000 abstract description 2
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 abstract 1
- -1 normal-butyl Chemical group 0.000 description 38
- 229920000647 polyepoxide Polymers 0.000 description 19
- 239000003822 epoxy resin Substances 0.000 description 17
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 15
- CERQOIWHTDAKMF-UHFFFAOYSA-N alpha-methacrylic acid Natural products CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 13
- 239000000049 pigment Substances 0.000 description 10
- 229920002554 vinyl polymer Polymers 0.000 description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 9
- 238000002360 preparation method Methods 0.000 description 9
- 229910052736 halogen Inorganic materials 0.000 description 8
- 150000002367 halogens Chemical class 0.000 description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 238000004898 kneading Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 241001597008 Nomeidae Species 0.000 description 5
- 150000001412 amines Chemical class 0.000 description 5
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 4
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 4
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 4
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000012965 benzophenone Substances 0.000 description 3
- DZBUGLKDJFMEHC-UHFFFAOYSA-N benzoquinolinylidene Natural products C1=CC=CC2=CC3=CC=CC=C3N=C21 DZBUGLKDJFMEHC-UHFFFAOYSA-N 0.000 description 3
- 229940106691 bisphenol a Drugs 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
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- 230000004907 flux Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000007669 thermal treatment Methods 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 description 2
- WNJSKZBEWNVKGU-UHFFFAOYSA-N 2,2-dimethoxyethylbenzene Chemical compound COC(OC)CC1=CC=CC=C1 WNJSKZBEWNVKGU-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- KJSGODDTWRXQRH-UHFFFAOYSA-N 2-(dimethylamino)ethyl benzoate Chemical compound CN(C)CCOC(=O)C1=CC=CC=C1 KJSGODDTWRXQRH-UHFFFAOYSA-N 0.000 description 2
- CCJAYIGMMRQRAO-UHFFFAOYSA-N 2-[4-[(2-hydroxyphenyl)methylideneamino]butyliminomethyl]phenol Chemical compound OC1=CC=CC=C1C=NCCCCN=CC1=CC=CC=C1O CCJAYIGMMRQRAO-UHFFFAOYSA-N 0.000 description 2
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 2
- XLLXMBCBJGATSP-UHFFFAOYSA-N 2-phenylethenol Chemical class OC=CC1=CC=CC=C1 XLLXMBCBJGATSP-UHFFFAOYSA-N 0.000 description 2
- KTALPKYXQZGAEG-UHFFFAOYSA-N 2-propan-2-ylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3SC2=C1 KTALPKYXQZGAEG-UHFFFAOYSA-N 0.000 description 2
- FXKQPQOOZSXQAG-UHFFFAOYSA-N 4-methyltriazine Chemical class CC1=CC=NN=N1 FXKQPQOOZSXQAG-UHFFFAOYSA-N 0.000 description 2
- IKVYHNPVKUNCJM-UHFFFAOYSA-N 4-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C(C(C)C)=CC=C2 IKVYHNPVKUNCJM-UHFFFAOYSA-N 0.000 description 2
- VDFBLPCZEFJPOB-UHFFFAOYSA-N 9-heptylacridine Chemical compound C1=CC=C2C(CCCCCCC)=C(C=CC=C3)C3=NC2=C1 VDFBLPCZEFJPOB-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical compound N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
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- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical compound C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 2
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- 238000000227 grinding Methods 0.000 description 2
- 150000001261 hydroxy acids Chemical group 0.000 description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Substances C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
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- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
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- 125000001424 substituent group Chemical group 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- MDDUHVRJJAFRAU-YZNNVMRBSA-N tert-butyl-[(1r,3s,5z)-3-[tert-butyl(dimethyl)silyl]oxy-5-(2-diphenylphosphorylethylidene)-4-methylidenecyclohexyl]oxy-dimethylsilane Chemical compound C1[C@@H](O[Si](C)(C)C(C)(C)C)C[C@H](O[Si](C)(C)C(C)(C)C)C(=C)\C1=C/CP(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 MDDUHVRJJAFRAU-YZNNVMRBSA-N 0.000 description 2
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- KJMGIINCIYPCFQ-UHFFFAOYSA-N 2-methylhex-2-enedioic acid Chemical compound OC(=O)C(C)=CCCC(O)=O KJMGIINCIYPCFQ-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
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- H—ELECTRICITY
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Abstract
本发明涉及一种感光树脂组合物，其含有a)作为组分(A)的通式(I)的绿着色剂，其中环A、B、C和D被羟基或（a）取代，其中R1是氢或C1～C4－烷基，R2是氢或C1～C4－烷基，n是0、1、2或3并且环E是未取代的或被C1～C6烷基、C1～C6烷氧基、羟基、NHCOR3、NHSO2R4或SO2NHR5取代，其中R3是C1～C4－烷基或苯基，R4是C1～C4－烷基或苯基并且R5是C1～C4－烷基或苯基，b)作为组分(B)的碱溶性低聚物或聚合物(有或没有反应性)，c)作为组分(C)的可聚合单体，d)作为组分(D)的光敏引发剂，e)作为组分(E)的环氧化合物，以及如果需要的话，f)作为组分(F)的其它添加剂，该组合物在印刷电路板的制造中被用作阻焊剂、抗蚀剂或抗镀剂。
Description
本发明涉及含有无卤素着色剂(colorant)的感光树脂组合物。
更具体地说，本发明涉及含有无卤素着色剂的感光树脂组合物，该组合物在印刷电路板制造中用作阻焊剂、抗蚀剂或抗镀剂(platingresist)时具有高感光性，并且能表现出优异耐热性和对基材表面的附着力。
应用抗蚀涂层的一般概念是众所周知的，尤其是在电子工业中。
US-A-5,009,982公开了采用酞菁绿(卤化酞菁)、颜料绿7和颜料绿36作为绿着色剂的阻焊剂。但是最近，鉴于环境生态运动的压力阻焊剂的制造商们正努力降低阻焊剂配方中卤素的含量。因此，对着色剂也提出低卤素含量的要求。
一种解决办法是采用US-A-5,009,982中提到的酞菁蓝。没有卤素取代的酞菁表现出蓝色，因此，尝试采用此种蓝色颜料来制造阻焊剂。但是，蓝颜色未能得到阻焊剂使用者的普遍接受。
另一种解决办法是通过非卤素蓝色和非卤素黄色之间的混合来产生绿色。这一想法公开在JP-A-2000-7974和JP-A-2001-64534中。
JP-A-2000-7974公开了一种包含非卤素蓝和非卤素黄的阻焊剂组合物。所用组合物采用的除颜料以外的成分都是阻焊剂使用的非常典型的成分。
JP-A-2001-64534是一种关于绿色颜料的组合物专利。主要论证如何用蓝色和黄色制备绿色。一种方法是共-捏合方法，而另一个方法是将蓝色颜料和黄色颜料溶解在强酸中，然后将它倒入到水中以便沉淀。此种绿色颜料组合物的应用领域被广泛提及。
一种含有单一绿色颜料的阻焊剂，能保持作为绿着色剂材料所要求的品质，例如，透明色调、良好的耐候性和耐热性，与此同时从环境污染的角度又令人满意，目前在技术上尚未发现。
因此，需要此种含单一无卤素着色剂的感光树脂组合物。
现已令人惊奇地发现，本发明感光树脂组合物在很大程度上满足了上面提出的标准。
因此，本发明涉及一种感光树脂组合物，含有a)作为组分(A)的下列通式的绿着色剂，
其中环A、B、C和D被羟基或
取代，其中R1是氢或C1～C4-烷基，R2是氢或C1～C4-烷基，n是0、1、2或3并且环E是未取代的或被C1～C6烷基、C1～C6烷氧基、羟基、NHCOR3、NHSO2R4或SO2NHR5取代，其中R3是C1～C4-烷基或苯基，R4是C1～C4-烷基或苯基，并且R5是C1～C4-烷基或苯基，
b)作为组分(B)的碱溶性低聚物或聚合物(有或没有反应性)，
c)作为组分(C)的可聚合单体，
d)作为组分(D)的光敏引发剂，
e)作为组分(E)的环氧化合物，
如果需要的话，还含有
f)作为组分(F)的其它添加剂。
R1、R2、R3、R4和R5中的C1～C4烷基彼此独立地是甲基、乙基、丙基、异丙基、正丁基、异丁基、仲丁基或叔丁基。
R1优选是氢。
R2优选是氢。
R3优选是甲基和乙基。
R4优选是甲基和乙基。
R5优选是甲基和乙基。
作为环E的取代基的C1～C6烷基，例如是甲基、乙基、丙基、异丙基、正丁基、异丁基、仲丁基、叔丁基、戊基、叔戊基(1，1-二甲基丙基)、1，1，3，3-四甲基丁基、己基、1-甲基戊基、新戊基、环戊基、环己基和相关的异构体。
作为环E的取代基的C1～C6烷氧基例如是甲氧基、乙氧基、丙氧基、异丙氧基、丁氧基、仲丁氧基、异丁氧基、叔丁氧基、戊氧基或己氧基。
n优选是1。
优选用于本发明感光树脂组合物中的着色剂是下式的着色剂
和
特别优选用于本发明感光树脂组合物中的着色剂是下式的着色剂
和
式(1)～(7)的着色剂是公知的或者可按照众所周知的方法制备。
如果要求非卤素绿着色剂的话，式(1)～(7)的着色剂也可用于其它抗蚀剂用途。
例如，用于形成印刷电路板的铜电路图案的干膜抗蚀剂，像抗蚀剂和抗镀剂，以及用于形成各种平板显示屏用途中的电池(cell)或电极图案(electrode pattern)，例如，通过喷砂法形成等离子显示屏中使用的隔墙(barrier lib)。
另外，本发明涉及采用本发明感光树脂组合物的阻焊剂方法，该方法包括下列步骤：
(1)混合本发明组合物的上述组分(A)～(E)以及如果需要的话(F)；
(2)将获得的组合物施涂到基材上(“基材的涂布”)；
(3)若存在的话，蒸发溶剂例如，在80～90℃的温度(或者如果采用干膜型阻焊剂，则步骤(1)～(3)可跳过)；
(4)透过负性掩模或者通过直接激光成象对涂布的基材实施辐照(从而引发丙烯酸酯的反应)；
(5)通过用碱性水溶液洗涤样品并借此除掉未固化区域从而使辐照过的样品显影；
以及
(6)热固化样品，例如，在约150℃的温度，从而引发羧酸与环氧组分之间的交联。
如此制备的阻焊剂层是印刷电路板顶面永久涂层，并且必须在整个板的使用期限内保护内铜电路。最棘手的是一种要求阻焊剂必须耐受熔融焊料温度(260℃)的钎焊方法。
组分(B)是碱溶性粘结剂聚合物。合适的粘结剂是分子量介于约2,000～2,000,000，优选10,000～500,000并且酸值介于50～600mgOH/g，优选100～300mgKOH/g的聚合物。碱可显影的粘结剂的例子是具有羧酸官能团作为侧基的丙烯酸类聚合物，例如，通过烯属不饱和羧酸如(甲基)丙烯酸、2-羧乙基(甲基)丙烯酸、2-羧丙基(甲基)丙烯酸、衣康酸、巴豆酸、马来酸，马来酸和富马酸的半酯，与一种或多种选自下列化合物的单体共聚获得的传统上已知共聚物：(甲基)丙烯酸酯的单体如(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸苄酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸羟乙酯、(甲基)丙烯酸羟丙酯；乙烯基芳族化合物，例如，苯乙烯、-甲基苯乙烯、乙烯基甲苯、对氯苯乙烯；酰胺型不饱和化合物、(甲基)丙烯酰胺双丙酮丙烯酰胺、N-羟甲基丙烯酰胺、N-丁氧基甲基丙烯酰胺；和聚烯烃型化合物，例如，丁二烯、异戊二烯、氯丁二烯等；甲基丙烯腈、甲基异丙烯基甲酮、醋酸乙烯、丙酸乙烯酯或新戊酸乙烯酯。共聚物的例子是丙烯酸酯和甲基丙烯酸酯与丙烯酸或甲基丙烯酸的共聚物以及与苯乙烯或取代的苯乙烯的共聚物、酚醛树脂，例如，线型酚醛清漆，(聚)羟基苯乙烯，以及羟基苯乙烯与丙烯酸烷基酯、丙烯酸和/或甲基丙烯酸的共聚物。优选的共聚物的例子是甲基丙烯酸甲酯/甲基丙烯酸的共聚物、甲基丙烯酸苄酯/甲基丙烯酸的共聚物、甲基丙烯酸甲酯/丙烯酸乙酯/甲基丙烯酸的共聚物、甲基丙烯酸苄酯/甲基丙烯酸/苯乙烯的共聚物、甲基丙烯酸苄酯/甲基丙烯酸/甲基丙烯酸羟乙酯的共聚物、甲基丙烯酸甲酯/甲基丙烯酸丁酯/甲基丙烯酸/苯乙烯的共聚物、甲基丙烯酸甲酯/甲基丙烯酸苄酯/甲基丙烯酸/甲基丙烯酸羟基苯酯的共聚物。本发明中的聚酰亚胺粘结剂树脂可以是聚酰亚胺前体，例如，聚(酰胺酸)。
组分(B)的其它例子是在分子结构中具有至少两个烯属不饱和基团和至少一个羧基官能团的聚合物或低聚物，例如，通过饱和/或不饱和多元酸酐和环氧化物与不饱和单羧酸的反应产物之间的反应制取的树脂(例如，由UCB化学公司供应的EB9696；由Nippon Kayaku公司供应的KAYARAD TCR1025；由Shin-Nakamura化学公司供应的NK OLIGOEA-6340、EA-7440)，或者含羧基基团树脂与具有α，β-不饱和双键和环氧基团的不饱和化合物之间生成的加成产物(例如，ACA200、ACA200M、ACA210P、ACA230AA、ACA250、ACA300、ACA300、ACA320，由Daicel化学工业公司供应)。
适合于本发明组合物的组分(C)的例子是可光聚合乙烯基型单体。代表性例子是丙烯酸羟烷基酯，例如，丙烯酸2-羟乙酯、丙烯酸2-羟丁酯等；二醇如乙二醇、甲氧基四甘醇、聚乙二醇、丙二醇等的单-或二丙烯酸酯；丙烯酰胺，例如，N，N-二甲基丙烯酰胺、N-羟甲基丙烯酰胺等；丙烯酸氨烷基酯，例如，N，N-二甲氨基乙基的丙烯酸酯等；多元醇或环氧乙烷或环氧丙烷或其加成物如己二醇、三羟甲基丙烷、季戊四醇、二季戊四醇、异氰尿酸三-羟乙酯等的多价丙烯酸酯；苯氧基的丙烯酸酯、双酚A的二丙烯酸酯和这些酚类的环氧乙烷或环氧丙烷加成产物的丙烯酸酯等；缩水甘油基醚如甘油二缩水甘油基醚、三羟甲基丙烷三缩水甘油基醚、三缩水甘油基的异氰尿酸酯等的丙烯酸酯；以及的三聚氰胺丙烯酸酯和/或对应于上面丙烯酸酯的甲基丙烯酸酯，等等。
单-或多-官能烯属不饱和化合物，或几种所述化合物的混合物，以组合物固体部分重量为基准计，可在最高60wt％的用量范围内加入到上述组合物中。
不饱和化合物(C)也可以与非可光聚合、成膜组分的混合物形式使用。这些，例如，可以是物理干燥的聚合物或其在有机溶剂，如硝基纤维素或纤维素乙酰丁酸酯中的溶液。然而，它们也可以是可化学和/或热固化(可热固化)的树脂，例如是聚异氰酸酯、聚环氧化物和三聚氰胺树脂，以及聚酰亚胺前体。可热固化树脂的同时使用对于所谓混杂体系中的用途是重要的，此时，在第一阶段，体系进行光聚合，而在第二阶段，借助热后处理进行交联。
任何迄今已知作为光敏引发剂的化合物都可用作组分(D)。组分(C)的例子是樟脑醌、二苯酮、二苯酮衍生物、乙酰苯、乙酰苯衍生物，例如，α-羟基环烷基苯基甲酮或2-羟基-2-甲基-1-苯基-丙酮、二烷氧基乙酰苯、α-羟基-或α-氨基乙酰苯，例如，(4-甲基硫代苯甲酰基)-1-甲基-1-吗啉基乙烷、(4-吗啉基苯甲酰基)-1-苄基-1-二甲氨基丙烷、4-芳酰基-1，3-二氧戊环、苯偶姻烷基醚和苯偶酰缩酮，例如，二甲基苯偶酰缩酮、苯基乙醛酸酯及其衍生物，二聚苯基乙醛酸酯、丁二酮，过酸酯，例如，在E-A-126 541中公开二苯酮四甲酸过酸酯，单酰基氧化膦，例如，(2，4，6-三甲基苯甲酰基)二苯基氧化膦、双酰基氧化膦、双(2，6-二甲氧基-苯甲酰基)-(2，4，4-三甲基-戊基)氧化膦、双(2，4，6-三甲基苯甲酰基)-苯基氧化膦、双(2，4，6-三甲基苯甲酰基)-2，4-二戊氧基苯基氧化膦、三酰基氧化膦，肟酯，例如，1-苯基-1，2-丙二酮-2-(邻-苯甲酰基)肟、1-苯基-1，2-丙二酮-2-(邻-乙氧基羰基)肟或其它公开在GB-A-233 9571和US-A-2,001,2596中的肟酯，卤代甲基三嗪，例如，2-[2-(4-甲氧基-苯基)-乙烯基]-4，6-双-三氯甲基-[1，3，5]-三嗪、2-(4-甲氧基-苯基)-4，6-双-三氯甲基-[1，3，5]-三嗪、2-(3，4-二甲氧基苯基)-4，6-双-三氯甲基-[1，3，5]三嗪、2-甲基-4，6-双-三氯甲基-[1，3，5]三嗪、2-(4-N，N-二(乙氧基羰基甲基)氨苯基)-4，6-双(三氯甲基)-[1，3，5]三嗪、2-(4-甲氧基-萘基)-4，6-双-三氯甲基-[1，3，5]三嗪、2-(1，3-苯并间二氧杂环戊烯(benzodioxol)-5-基)-4，6-双-三氯甲基-[1，3，5]三嗪、2-[2-[4-(戊氧基)苯基]乙烯基]-4，6-双-三氯甲基-[1，3，5]三嗪、2-[2-(3-甲基-2-呋喃基)-乙烯基]-4，6-双-三氯甲基-[1，3，5]三嗪、2-[2-(5-甲基-2-呋喃基)-乙烯基]-4，6-双-三氯甲基-[1，3，5]三嗪、2-[2-(2，4-二甲氧基-苯基)-乙烯基]-4，6-双-三氯甲基-[1，3，5]三嗪、2-[2-(2-甲氧基-苯基)乙烯基]-4，6-双-三氯甲基-[1，3，5]三嗪、2-[2-[4-异丙基氧基-苯基]乙烯基]-4，6-双-三氯甲基-[1，3，5]三嗪、2-[2-(3-氯-4-甲氧基苯基)乙烯基]-4，6-双三氯甲基-[1，3，5]三嗪、2-[2-溴-4-N，N-二(乙氧基羰基甲基)氨基-苯基]-4，6-双-三氯甲基-[1，3，5]三嗪、2-[2-氯-4-N，N-二(乙氧基羰基甲基)氨基-苯基]-4，6-双-三氯甲基-[1，3，5]三嗪、2-[3-溴-4-N，N-二(乙氧基羰基甲基)氨基-苯基]-4，6-双-三氯甲基-[1，3，5]三嗪、2-[3-氯-4-N，N-二(乙氧基羰基甲基)氨基-苯基]-4，6-双-三氯甲基-[1，3，5]三嗪，或者其它公开在例如G.Buhr，R.Dammel和C.Lindley Polym.Mater.Sci.Eng.61，269(1989)和EP-A-262 788中的卤代甲基-三嗪；卤代甲基噁唑光敏引发剂，例如，公开在US-A-4,371,606和US-A-4,371,607中；1，2-二砜，例如，公开在E.A.Bartmann，Synthesis 5，390(1993)中；六芳基双咪唑，和六芳基双咪唑/共引发剂体系，例如，邻氯六苯基-双咪唑与2-巯基-苯并噻唑、二茂铁(ferrocenium)化合物或二茂钛，例如，双(环戊二烯基)-双(2，6-二氟-3-吡咯基-苯基)钛或双吖啶衍生物例如1，7-双(9-吖啶基)庚烷。
所提到的光敏引发剂之一，或者几种所述化合物的混合物，以组合物固体部分重量为基准计，可按照最高20wt％的用量加入到上述组合物中。
为赋予标的组合物热固性性质，加入具有环氧基的化合物作为组分(E)。可使用固体或液体公知的环氧化合物，并且所述环氧化合物根据所要求的特性来使用。例如，当要改善抗镀能力时，采用液体环氧树脂，而当要求防水时，则采用具有大量在苯环或在环烷环上的甲基基团的环氧树脂。优选的环氧树脂是双酚S型环氧树脂，例如，由Nippon Kayaku公司供应的BPS-200，由ACR公司生产的EPX-30，由Dainippon油墨化学公司生产的Epiculon EXA-1514等；双酚A型环氧树脂，例如，由Dainippon油墨化学公司生产的Epiculon N-3050、N-7050、N-9050，由Vantico公司生产的XAC-5005、GT-7004、6484T、6099；由Tohto Kasei公司生产的双酚F型环氧树脂，例如，YDF-2004、YDF2007；二缩水甘油基的苯二甲酸酯树脂，例如，由Nippon Oil andFats公司生产的Blemmer DGT等；杂环环氧树脂，例如由Nissan化学工业公司生产的TEPIC，由Vantico生产的Araldite PT810等；由YukaShell公司生产的双二甲苯酚型环氧树脂如YX-4000；由Yuka Shell公司生产的双酚型环氧树脂如YL-6056；由Tohto Kasei公司生产的四缩水甘油基二甲苯酚(xylenoylethane)树脂，例如，ZX-1063；线型酚醛清漆型环氧树脂，例如，由Nippon Kayaku公司生产的EPPN-201、EOCN-103、EOCN-1020、EOCN-1035和BRRN，由Asahi化学工业公司生产的ECN-278、ECN-292和ECN-299，由Vantico生产的GY-1180、ECN-1273和ECN-1299，由Tohto Kasei公司生产的YDCN-220L、YDCN-220HH、YDCN-702、YDCN-702、YDCN-704、YDPN-601和YDPN-602，由Dainippon油墨化学公司生产的Epiculon-673、N-680、N-695、N-770和N-775；线型酚醛清漆型双酚A环氧树脂，例如，由Asahi化学工业公司生产的EPX-8001、EPX-8002、EPPX-8060和EPPX-8061，由Dainippon油墨化学公司生产的Epiculon N-880等；螯合物型环氧树脂，例如，由Asahi Denka Kogyo K.K.生产的EPX-49-69和EPX-49-30等；乙二醛型环氧树脂如由Tohto Kasei公司生产的YDG-414；含氨基基团型环氧树脂如由Tohto Kasei公司生产的YH-1402和ST-110，由Yuka Shell公司生产的YL-931和YL-933等；橡胶改性的环氧树脂，例如由Dainippon油墨化学公司生产的EpiculonTSR-601，由Asahi Denka Kogyo K.K.生产的EPX-4016；二环戊二烯苯酚型环氧树脂如由Sanyo-Kokusaku Pulp公司生产的DCE-400等；硅酮-改性的环氧树脂，例如，由Asahi Denka Kogyo K.K.生产的X-1359，己内酯-改性的环氧树脂，例如，由Dicel化学工业公司生产的Plaque G-402和G-710等。进一步地，可以并用这些环氧化合物的部分酯化化合物(例如，由(甲基)丙烯酸酯化的)。
作为组分(F)的例子，可加入光敏化剂或共引发剂以加速光固化速度，这能改变或拓宽光谱感光性。这些，特别是芳族化合物，例如，二苯酮及其衍生物、噻吨酮及其衍生物，蒽醌及其衍生物、香豆素和吩噻嗪及其衍生物，还有3-(芳酰基亚甲基)噻唑啉、绕丹宁、樟脑醌，但也包括曙红、若丹明、四碘荧光素、呫吨、噻吨、吖啶，例如，9-苯基吖啶、1，7-双(9-吖啶基)庚烷、1，5-双(9-吖啶基)戊烷、花青和部花青染料。
为加速光聚合反应，可以加入胺类，例如，三乙醇胺、N-甲基二乙醇胺、对二甲氨基苯甲酸乙酯、苯甲酸2-(二甲氨基)乙酯、对二甲氨基苯甲酸2-乙基己酯、对-N，N-二甲氨基苯甲酸辛酯、N-(2-羟乙基)-N-甲基-对-甲苯胺或米蚩酮。胺的作用可通过加入二苯酮型的芳族酮来加强。可作为除氧剂使用的胺的例子是取代的N，N-二烷基苯胺，正如在EP-A-339 841中公开的。其它加速剂、共引发剂和自氧化剂是硫醇、硫醚、二硫化物、鏻盐、氧化膦或膦，正如，例如，在EP-A-438123、在GB-A-2 180 358和在JP特开平6-68309中公开的。
还可在本发明组合物中加入本领域常用的链转移剂作为组分(E)。例子是硫醇、胺和苯并噻唑。
本领域公知的其它添加剂可作为组分(F)加入，例如，流动促进剂(flow improver)、增粘剂(adhesion promoter)，例如，乙烯基三甲氧基硅烷、乙烯基三乙氧基硅烷、乙烯基三(2-甲氧基乙氧基)硅烷、N-(2-氨乙基)-3-氨丙基甲基二甲氧基硅烷、N-(2-氨乙基)-3-氨丙基三甲氧基硅烷、3-氨丙基三乙氧基硅烷、3-缩水甘油氧基丙基三甲氧基硅烷、3-缩水甘油氧基丙基甲基二甲氧基硅烷、2-(3，4-环氧环己基)乙基三甲氧基硅烷、3-氯丙基甲基二甲氧基硅烷、3-氯丙基三甲氧基硅烷、3-甲基丙烯酰氧基丙基三甲氧基硅烷和3-巯基丙基三甲氧基硅烷。
表面活性剂、荧光增白剂、润湿剂、消泡剂、流平助剂、分散剂、防聚剂、抗氧化剂或无机填料是添加剂(F)的进一步的例子。
为了固化厚的和含颜料的(pigmented)涂层，适宜加入玻璃微球或粉碎的玻璃纤维，正如，例如，US-A-5,013,768中描述的。
该组合物任选地另外含有环氧固化促进剂作为组分(F)，例如，胺化合物、咪唑化合物、羧酸、苯酚、季铵盐或含羟甲基基团的化合物。
添加剂(F)的选择根据应用领域和该领域所要求的性质来确定。上面描述的添加剂乃是本领域惯用的，因此其加入量也就是相应应用领域的常用量。
可以对通式(1)～(7)的着色剂粗产物实施微粉化(盐-捏合(salt-kneading)或含水研磨(aqueous milling))，以达到更高的色饱和度(色度)和优异的色强度。
该盐-捏合的基本原理乃是本领域熟知的。
WO-A-00/56819公开了二酮基吡咯并吡咯与喹吖啶酮颜料的盐-捏合，而不形成固体溶液。优点是因为喹吖啶酮用量较少，因此研磨效率改进，得到高色强度和较高色度。
WO-A-01/04215公开一种二步法，其中颜料或颜料混合物首先被转化为基本无定形细颗粒形式，然后与有机液体一起捏合，获得色彩性能改善的颜料紫23和颜料红254。
WO-A-01/09252公开无铜酞菁颜料在分子中具有至少一个氧基或氧代基团的中性水溶性液体的存在下进行盐-捏合。
为改善流变特性、分散性和分散稳定性，也可在它们中加入公知的分散剂或流变学改进剂，例如，磺化的或Mannich-取代的颜料，特别是酞菁型或无色型的。
本发明将通过以下实施例来说明。除非另行指出，份数和百分数皆指重量而言，温度为摄氏度，并且重量份数和体积份数之间的关系与克数和立方厘米之间的关系相同。
实施例1：
一种抗蚀剂混合物，含有
6g EA-6340(具有羧酸基团的线型酚醛清漆环氧丙烯酸酯，由Shin-Nakamura化学公司供应)，
0.9g DPHA(二季戊四醇的六丙烯酸酯，由Aldrich供应)，
1.5g GY1180(线型酚醛清漆环氧，由Vantico供应)，
0.3g IRGACURE907[(4-甲基硫代苯甲酰基)-1-甲基-1-吗啉基乙烷，由Ciba Specialty Chemicals供应]，
0.03g QUANTACURE ITX(4-异丙基噻吨酮，由InternationalBiosynthetics供应)，
0.12g下式的着色剂
以及
1.6g丙酮
利用SKANDEX DISPERSER(BA-S20)与20g 3mm的玻璃珠一起分散2h。将分散液施涂到铝基材上并在80℃干燥15min。干燥后阻焊剂的厚度是20μm。让阻焊剂接受300mJ/cm2金属卤化物灯(SMX-3000，来自ORC制造公司)透过乙酸酯薄膜、光掩模和真空箔的辐照。在通过喷洒1％碳酸钠水溶液(30℃)而显影100s之后，阻焊剂在150℃下进行1h热固化。为模仿钎焊过程，热固化的阻焊剂被涂以助熔剂(H-10F)并在干燥烘箱中在260℃加热5min。就热处理(260℃，5min)前后阻焊剂的外观进行了比较。
实施例2：
样品制备和评估按照与实施例1相同方式实施，不同的是，式(2)的着色剂换成同样重量的下式的着色剂
实施例3：
样品制备和评估按照与实施例1相同方式实施，不同的是，式(2)的着色剂换成同样重量的下式的着色剂
实施例4：
一种阻焊剂混合物，含有
6g EA-6340(具有羧酸基团的线型酚醛清漆环氧丙烯酸酯，由Shin-Nakamura化学公司供应)，
0.9g DPHA(二季戊四醇的六丙烯酸酯，由Aldrich供应)，
1.5g GY1180(线型酚醛清漆环氧，由Vantico供应)，
0.3g IRGACURE907[(4-甲基硫代苯甲酰基)-1-甲基-1-吗啉基乙烷，由Ciba Specialty Chemicals供应]，
0.03g QUANTACURE ITX(4-异丙基噻吨酮，由InternationalBiosynthetics供应)，
0.12g下式的着色剂
以及
1.6g丙酮
利用SKANDEX DISPERSER(BA-S20)与20g 3mm的玻璃珠一起分散2h。将分散液施涂到铝基材上并在80℃干燥15min。干燥后阻焊剂的厚度是20μm。让阻焊剂接受300mJ/cm2金属卤化物灯(SMX-3000，来自ORC制造公司)透过乙酸酯薄膜、光掩模和真空箔的辐照。在通过喷洒1％碳酸钠水溶液(30℃)而显影100s之后，阻焊剂在150℃下进行1h热固化。为模仿钎焊过程，热固化的阻焊剂被涂以助熔剂(H-10F)并在干燥烘箱中在260℃加热5min。就热处理(260℃，5min)前后阻焊剂的外观进行了比较。
实施例5：
样品制备和评估按照与实施例4相同方式实施，不同的是，式(3)的着色剂换成同样重量的下式的着色剂
实施例6：
样品制备和评估按照与实施例4相同方式实施，不同的是，式(3)的着色剂换成同样重量的下式的着色剂
参照例：
样品制备和评估按照与实施例1相同方式实施，不同的是，式(2)的着色剂换成同样重量的颜料绿7(IRGALITE Green GFNP，由CibaSpecialty Chemicals供应)。
结果
| 热处理(260℃，5min)后涂层的外观 | 配制的阻焊剂中的卤素含量#1 | |
| 实施例1 | 不变 | 无 |
| 实施例2 | 不变 | 无 |
| 实施例3 | 不变 | 无 |
| 实施例4 | 不变 | 无 |
| 实施例5 | 不变 | 无 |
| 实施例6 | 不变 | 无 |
| 参照例 | 不变 | 有 |
#1根据每种阻焊剂成分的化学结构评价
Claims (6)
1.一种感光树脂组合物，其含有
a)下列通式的绿着色剂作为组分(A)
其中环A、B、C和D被羟基或
取代，其中R1是氢或C1～C4-烷基，R2是氢或C1～C4-烷基，n是0、1、2或3，并且环E未被取代或被C1～C6烷基、C1～C6烷氧基、羟基、NHCOR3、NHSO2R4或SO2NHR5取代，其中R3是C1～C4-烷基或苯基，R4是C1～C4-烷基或苯基，并且R5是C1～C4-烷基或苯基，
b)碱溶性低聚物或聚合物(有或没有反应性)作为组分(B)，
c)可聚合单体作为组分(C)，
d)光敏引发剂作为组分(D)，
e)环氧化合物作为组分(E)，如果需要，还含有
f)其它添加剂作为组分(F)。
2.权利要求1的感光树脂组合物，其中组分(A)是下式的着色剂
。
3.权利要求1的感光树脂组合物，其中组分(A)是下式的着色剂
4.采用权利要求1～3中任何一项的感光树脂组合物的阻焊方法，该方法包括下列步骤：
(1)混合组分(A)～(E)以及如果需要的话(F)，
(2)将获得的组合物施涂到基材上(“基材的涂布”)，
(3)若存在的话，在80～90℃的温度蒸发溶剂，
(4)透过负性掩模或者通过直接激光成象对涂布的基材实施辐照，
(5)通过用碱性水溶液洗涤样品并借此除掉未固化区域从而使辐照过的样品显影，
以及
(6)在约150℃的温度热固化样品，从而引发羧酸与环氧组分之间的交联。
5.按照权利要求4的方法获得的涂布基材。
6.以权利要求1～3中任何一项的感光树脂组合物涂布的基材。
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP02406035 | 2002-11-28 | ||
| EP02406035.2 | 2002-11-28 |
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|---|---|
| CN1717627A true CN1717627A (zh) | 2006-01-04 |
| CN100549825C CN100549825C (zh) | 2009-10-14 |
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Country Status (13)
| Country | Link |
|---|---|
| US (1) | US8034531B2 (zh) |
| EP (1) | EP1565789B1 (zh) |
| JP (1) | JP4390707B2 (zh) |
| KR (1) | KR101081756B1 (zh) |
| CN (1) | CN100549825C (zh) |
| AT (1) | ATE453877T1 (zh) |
| AU (1) | AU2003298293A1 (zh) |
| BR (1) | BR0316657A (zh) |
| CA (1) | CA2507471A1 (zh) |
| DE (1) | DE60330802D1 (zh) |
| MX (1) | MXPA05005682A (zh) |
| TW (1) | TW200421022A (zh) |
| WO (1) | WO2004049070A2 (zh) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101303528B (zh) * | 2007-05-08 | 2013-03-27 | 太阳控股株式会社 | 光固化性树脂组合物及其固化物、干膜、印刷电路板 |
| CN104076603A (zh) * | 2013-03-26 | 2014-10-01 | 株式会社田村制作所 | 感光性树脂组合物 |
| CN108003172A (zh) * | 2017-12-12 | 2018-05-08 | 深圳市华星光电技术有限公司 | 一种绿色光阻材料及其制备方法和应用 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103885290B (zh) | 2005-10-25 | 2017-11-03 | 日立化成株式会社 | 感光性树脂组合物、使用其的感光性元件、抗蚀剂图案的形成方法及印刷电路板的制造方法 |
| US7713342B2 (en) * | 2006-12-19 | 2010-05-11 | Xerox Corporation | Phase change inks |
| CN103109234A (zh) * | 2010-09-16 | 2013-05-15 | 株式会社Lg化学 | 光敏树脂组合物、干膜阻焊膜以及电路板 |
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| US4039585A (en) * | 1975-09-08 | 1977-08-02 | Uop Inc. | Hydroformylation process |
| JPS61243869A (ja) * | 1985-04-19 | 1986-10-30 | Taiyo Ink Seizo Kk | レジストインキ組成物 |
| US4789620A (en) * | 1986-03-03 | 1988-12-06 | Mitsubishi Rayon Co. Ltd. | Liquid photosensitive resin composition containing carboxylated epoxy acrylates or methacrylates |
| US5578419A (en) * | 1991-12-12 | 1996-11-26 | Mitsui Toatsu Chemicals, Incorporated | Dyes for color filters, and photosensitive resist resin composition containing the same |
| DE69421122T2 (de) * | 1993-07-09 | 2000-01-20 | Mitsui Chemicals, Inc. | Neue Farbstoffe und ihre Verwendung |
| US5691101A (en) * | 1994-03-15 | 1997-11-25 | Kabushiki Kaisha Toshiba | Photosensitive composition |
| EP0703281B1 (de) * | 1994-09-23 | 2000-03-01 | Ciba SC Holding AG | Verfahren zur Herstellung von bromierten, Alkoxy-substituierten Metall-Phthalocyaninen |
| US5798137A (en) * | 1995-06-07 | 1998-08-25 | Advanced Silicon Materials, Inc. | Method for silicon deposition |
| EP0763580B1 (en) * | 1995-09-11 | 2003-08-13 | Toyo Ink Manufacturing Co., Ltd. | Aqueous type pigment dispersing agent, composition containing the same and aqueous pigment dispersion |
| JP3653855B2 (ja) | 1996-04-15 | 2005-06-02 | 三菱化学株式会社 | フタロシアニン化合物及びそれを用いた光学記録媒体 |
| US6087492A (en) * | 1996-10-03 | 2000-07-11 | Ciba Specialty Chemicals Corporation | Substituted phthalocyanines and their use |
| JP3286905B2 (ja) | 1997-08-04 | 2002-05-27 | 株式会社リコー | フタロシアニン化合物 |
| JP4523679B2 (ja) | 1998-06-22 | 2010-08-11 | 太陽インキ製造株式会社 | ハロゲンフリーの着色顔料を用いたプリント配線板用緑色レジストインキ組成物 |
| DE59903992D1 (de) * | 1998-09-21 | 2003-02-13 | Ciba Sc Holding Ag | Substituierte phthalocyanine |
| DE19915717A1 (de) * | 1999-04-08 | 2000-10-12 | Agfa Gevaert Ag | Aufzeichnungsmaterial mit pigmentgefärbter strahlungsempfindlicher Schicht |
| JP4075286B2 (ja) * | 1999-06-21 | 2008-04-16 | 東洋インキ製造株式会社 | ハロゲンを含有しない緑色顔料組成物 |
| US6214433B1 (en) * | 1999-10-04 | 2001-04-10 | Dsm N.V. | Radiation-curable coatings for optical discs and optical discs incorporating such coatings |
| US6713230B2 (en) * | 1999-10-25 | 2004-03-30 | Nan Ya Plastics Corporation | Photosensitive ink composition |
| JP2002030237A (ja) * | 2000-05-10 | 2002-01-31 | Seiko Epson Corp | 樹脂で被覆した顔料を含んだインクジェット記録用インク組成物 |
| TWI237531B (en) | 2000-12-13 | 2005-08-01 | Goo Chemical Co Ltd | Solder resist ink |
| US7144677B2 (en) * | 2001-03-21 | 2006-12-05 | Ricoh Company, Ltd. | Optical recording method and optical recording medium |
| JP4472205B2 (ja) * | 2001-04-17 | 2010-06-02 | 株式会社リコー | フタロシアニン化合物 |
| TWI227478B (en) * | 2001-04-26 | 2005-02-01 | Fuji Photo Film Co Ltd | Optical information recording medium |
| US6726755B2 (en) * | 2002-02-08 | 2004-04-27 | Xerox Corporation | Ink compositions containing phthalocyanines |
-
2003
- 2003-11-19 AT AT03796025T patent/ATE453877T1/de not_active IP Right Cessation
- 2003-11-19 BR BR0316657-0A patent/BR0316657A/pt not_active Application Discontinuation
- 2003-11-19 CN CNB2003801043254A patent/CN100549825C/zh not_active Expired - Fee Related
- 2003-11-19 US US10/535,373 patent/US8034531B2/en not_active Expired - Fee Related
- 2003-11-19 CA CA002507471A patent/CA2507471A1/en not_active Abandoned
- 2003-11-19 EP EP03796025A patent/EP1565789B1/en not_active Expired - Lifetime
- 2003-11-19 AU AU2003298293A patent/AU2003298293A1/en not_active Abandoned
- 2003-11-19 MX MXPA05005682A patent/MXPA05005682A/es not_active Application Discontinuation
- 2003-11-19 WO PCT/EP2003/050849 patent/WO2004049070A2/en active Application Filing
- 2003-11-19 JP JP2004554539A patent/JP4390707B2/ja not_active Expired - Fee Related
- 2003-11-19 DE DE60330802T patent/DE60330802D1/de not_active Expired - Lifetime
- 2003-11-19 KR KR1020057009694A patent/KR101081756B1/ko not_active IP Right Cessation
- 2003-11-27 TW TW092133372A patent/TW200421022A/zh unknown
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101303528B (zh) * | 2007-05-08 | 2013-03-27 | 太阳控股株式会社 | 光固化性树脂组合物及其固化物、干膜、印刷电路板 |
| CN104076603A (zh) * | 2013-03-26 | 2014-10-01 | 株式会社田村制作所 | 感光性树脂组合物 |
| CN108003172A (zh) * | 2017-12-12 | 2018-05-08 | 深圳市华星光电技术有限公司 | 一种绿色光阻材料及其制备方法和应用 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200421022A (en) | 2004-10-16 |
| KR20050084033A (ko) | 2005-08-26 |
| JP2006508381A (ja) | 2006-03-09 |
| WO2004049070A2 (en) | 2004-06-10 |
| ATE453877T1 (de) | 2010-01-15 |
| CA2507471A1 (en) | 2004-06-10 |
| US8034531B2 (en) | 2011-10-11 |
| EP1565789B1 (en) | 2009-12-30 |
| WO2004049070A3 (en) | 2004-07-22 |
| AU2003298293A1 (en) | 2004-06-18 |
| CN100549825C (zh) | 2009-10-14 |
| KR101081756B1 (ko) | 2011-11-10 |
| DE60330802D1 (de) | 2010-02-11 |
| BR0316657A (pt) | 2005-10-18 |
| MXPA05005682A (es) | 2005-07-26 |
| JP4390707B2 (ja) | 2009-12-24 |
| US20050282923A1 (en) | 2005-12-22 |
| EP1565789A2 (en) | 2005-08-24 |
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