CN1694604A - 布线电路板及其制造方法 - Google Patents

布线电路板及其制造方法 Download PDF

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Publication number
CN1694604A
CN1694604A CNA2005100701089A CN200510070108A CN1694604A CN 1694604 A CN1694604 A CN 1694604A CN A2005100701089 A CNA2005100701089 A CN A2005100701089A CN 200510070108 A CN200510070108 A CN 200510070108A CN 1694604 A CN1694604 A CN 1694604A
Authority
CN
China
Prior art keywords
wiring circuit
circuit pattern
thin film
wiring
metal thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2005100701089A
Other languages
English (en)
Chinese (zh)
Inventor
恒川誠
中村圭
豊澤圭子
大和岳史
馬埸俊和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of CN1694604A publication Critical patent/CN1694604A/zh
Pending legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F22—STEAM GENERATION
    • F22B—METHODS OF STEAM GENERATION; STEAM BOILERS
    • F22B37/00—Component parts or details of steam boilers
    • F22B37/02—Component parts or details of steam boilers applicable to more than one kind or type of steam boiler
    • F22B37/48—Devices or arrangements for removing water, minerals or sludge from boilers ; Arrangement of cleaning apparatus in boilers; Combinations thereof with boilers
    • F22B37/483—Devices or arrangements for removing water, minerals or sludge from boilers ; Arrangement of cleaning apparatus in boilers; Combinations thereof with boilers specially adapted for nuclear steam generators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • G—PHYSICS
    • G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21C—NUCLEAR REACTORS
    • G21C17/00—Monitoring; Testing ; Maintaining
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E30/00—Energy generation of nuclear origin
    • Y02E30/30—Nuclear fission reactors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12715—Next to Group IB metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • High Energy & Nuclear Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CNA2005100701089A 2004-04-30 2005-04-28 布线电路板及其制造方法 Pending CN1694604A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004135465A JP2005317836A (ja) 2004-04-30 2004-04-30 配線回路基板およびその製造方法
JP2004135465 2004-04-30

Publications (1)

Publication Number Publication Date
CN1694604A true CN1694604A (zh) 2005-11-09

Family

ID=34934782

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2005100701089A Pending CN1694604A (zh) 2004-04-30 2005-04-28 布线电路板及其制造方法

Country Status (6)

Country Link
US (1) US20050244620A1 (enExample)
EP (1) EP1592290A1 (enExample)
JP (1) JP2005317836A (enExample)
KR (1) KR20060047598A (enExample)
CN (1) CN1694604A (enExample)
TW (1) TW200601920A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101784165A (zh) * 2010-03-19 2010-07-21 中兴通讯股份有限公司 一种印制电路板耐腐蚀可焊涂层处理方法
CN101840988A (zh) * 2010-04-22 2010-09-22 傲迪特半导体(南京)有限公司 汽车前大灯发热pcb基台及其制作方法
CN106413240A (zh) * 2015-07-31 2017-02-15 日东电工株式会社 布线电路基板及其制造方法
CN109287072A (zh) * 2017-07-19 2019-01-29 安伦股份有限公司 电路迹线的封装
CN111182737A (zh) * 2018-11-13 2020-05-19 上海和辉光电有限公司 柔性线路板及其制造方法

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4640802B2 (ja) 2005-07-07 2011-03-02 日東電工株式会社 回路付サスペンション基板
JP2007103586A (ja) * 2005-10-03 2007-04-19 Nitto Denko Corp 配線回路基板の製造方法
JP4615427B2 (ja) 2005-12-01 2011-01-19 日東電工株式会社 配線回路基板
KR20070087929A (ko) * 2006-02-10 2007-08-29 삼성전자주식회사 인쇄회로와 이의 제조방법 및, 인쇄회로-전자소자 결합체와이의 제조방법
JP2007258281A (ja) * 2006-03-20 2007-10-04 Sharp Corp フレキシブル配線基板およびその接続構造
JP2008034639A (ja) * 2006-07-28 2008-02-14 Nitto Denko Corp 配線回路基板
JP4865453B2 (ja) 2006-08-30 2012-02-01 日東電工株式会社 配線回路基板およびその製造方法
JP2008282995A (ja) 2007-05-10 2008-11-20 Nitto Denko Corp 配線回路基板
WO2008141481A1 (en) * 2007-05-24 2008-11-27 Princo Corp. A structure and manufacturing method of metal wiring on multilayered board
US8815333B2 (en) 2007-12-05 2014-08-26 Princo Middle East Fze Manufacturing method of metal structure in multi-layer substrate
US9883583B2 (en) * 2015-09-02 2018-01-30 Apple Inc. Fabric signal path structures for flexible devices
KR101816983B1 (ko) * 2016-01-11 2018-01-09 주식회사 케이씨씨 세라믹 회로기판 및 이의 제조방법
KR101877931B1 (ko) * 2016-12-06 2018-07-12 주식회사 테토스 솔더 입자의 제조 방법
JP7161866B2 (ja) * 2018-05-31 2022-10-27 日東電工株式会社 配線回路基板
JP7717486B2 (ja) * 2021-04-26 2025-08-04 日東電工株式会社 集合体シート、および、集合体シートの製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3781596A (en) * 1972-07-07 1973-12-25 R Galli Semiconductor chip carriers and strips thereof
US3981691A (en) * 1974-07-01 1976-09-21 Minnesota Mining And Manufacturing Company Metal-clad dielectric sheeting having an improved bond between the metal and dielectric layers
US3984907A (en) * 1975-07-25 1976-10-12 Rca Corporation Adherence of metal films to polymeric materials
US4568413A (en) * 1983-07-25 1986-02-04 James J. Toth Metallized and plated laminates
US4863808A (en) * 1985-09-13 1989-09-05 Gould Inc. Copper-chromium-polyimide composite
DE3639604A1 (de) * 1986-11-20 1988-05-26 Bbc Brown Boveri & Cie Verfahren zur herstellung lotverstaerkter leiterbahnen
JPH0418789A (ja) * 1990-05-14 1992-01-22 Furukawa Electric Co Ltd:The プリント配線板の製造方法
US5017271A (en) * 1990-08-24 1991-05-21 Gould Inc. Method for printed circuit board pattern making using selectively etchable metal layers
JP2717911B2 (ja) * 1992-11-19 1998-02-25 日鉱グールド・フォイル株式会社 印刷回路用銅箔及びその製造方法
JPH08330728A (ja) * 1995-05-26 1996-12-13 Toyo Metaraijingu Kk フレキシブルプリント配線用基板
JP2000340911A (ja) * 1999-05-25 2000-12-08 Mitsui Mining & Smelting Co Ltd プリント配線板用銅箔
US6296949B1 (en) * 1999-09-16 2001-10-02 Ga-Tek Inc. Copper coated polyimide with metallic protective layer
EP2034039B1 (de) * 2000-10-09 2012-06-20 Hueck Folien Ges.m.b.H. Metallisierte Folie und Verfahren zu deren Herstellung sowie deren Anwendung
US20030170431A1 (en) * 2001-05-24 2003-09-11 Masahiro Oguni Heat-resistant resin film with metal layer and wiring board, and method for manufacturing them
KR100604819B1 (ko) * 2003-06-12 2006-07-28 삼성전자주식회사 반도체 패키지용 배선 기판, 그 제조방법 및 이를 이용한반도체 패키지

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101784165A (zh) * 2010-03-19 2010-07-21 中兴通讯股份有限公司 一种印制电路板耐腐蚀可焊涂层处理方法
CN101784165B (zh) * 2010-03-19 2014-11-05 中兴通讯股份有限公司 一种印制电路板耐腐蚀可焊涂层处理方法
CN101840988A (zh) * 2010-04-22 2010-09-22 傲迪特半导体(南京)有限公司 汽车前大灯发热pcb基台及其制作方法
CN106413240A (zh) * 2015-07-31 2017-02-15 日东电工株式会社 布线电路基板及其制造方法
CN106413240B (zh) * 2015-07-31 2022-03-04 日东电工株式会社 布线电路基板及其制造方法
CN109287072A (zh) * 2017-07-19 2019-01-29 安伦股份有限公司 电路迹线的封装
CN111182737A (zh) * 2018-11-13 2020-05-19 上海和辉光电有限公司 柔性线路板及其制造方法
CN111182737B (zh) * 2018-11-13 2021-08-03 上海和辉光电股份有限公司 柔性线路板及其制造方法

Also Published As

Publication number Publication date
KR20060047598A (ko) 2006-05-18
US20050244620A1 (en) 2005-11-03
EP1592290A1 (en) 2005-11-02
TW200601920A (en) 2006-01-01
JP2005317836A (ja) 2005-11-10

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication