CN1649043B - 电子元件 - Google Patents

电子元件 Download PDF

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Publication number
CN1649043B
CN1649043B CN2005100070378A CN200510007037A CN1649043B CN 1649043 B CN1649043 B CN 1649043B CN 2005100070378 A CN2005100070378 A CN 2005100070378A CN 200510007037 A CN200510007037 A CN 200510007037A CN 1649043 B CN1649043 B CN 1649043B
Authority
CN
China
Prior art keywords
electrode
width
electronic component
common mode
forms
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN2005100070378A
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English (en)
Chinese (zh)
Other versions
CN1649043A (zh
Inventor
伊藤知一
工藤孝洁
大友诚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Publication of CN1649043A publication Critical patent/CN1649043A/zh
Application granted granted Critical
Publication of CN1649043B publication Critical patent/CN1649043B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H01F27/027—Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
CN2005100070378A 2004-01-30 2005-01-28 电子元件 Active CN1649043B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP23365/2004 2004-01-30
JP23365/04 2004-01-30
JP2004023365A JP2005217268A (ja) 2004-01-30 2004-01-30 電子部品

Publications (2)

Publication Number Publication Date
CN1649043A CN1649043A (zh) 2005-08-03
CN1649043B true CN1649043B (zh) 2011-09-21

Family

ID=34835826

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2005100070378A Active CN1649043B (zh) 2004-01-30 2005-01-28 电子元件

Country Status (3)

Country Link
US (1) US7696849B2 (ja)
JP (1) JP2005217268A (ja)
CN (1) CN1649043B (ja)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4844045B2 (ja) * 2005-08-18 2011-12-21 Ｔｄｋ株式会社 電子部品及びその製造方法
JP4736808B2 (ja) * 2006-01-05 2011-07-27 パナソニック株式会社 積層型バルントランスおよびこれを用いた電子機器
JP4821452B2 (ja) * 2006-06-20 2011-11-24 富士電機株式会社 超小型電力変換装置およびその製造方法
JP4028884B1 (ja) * 2006-11-01 2007-12-26 Ｔｄｋ株式会社 コイル部品
JP4518103B2 (ja) * 2007-05-21 2010-08-04 Ｔｄｋ株式会社 コモンモードチョークコイル
JP4962193B2 (ja) * 2007-08-01 2012-06-27 Ｔｄｋ株式会社 チップ型電子部品及びその製造方法
JP2011071457A (ja) * 2008-12-22 2011-04-07 Tdk Corp 電子部品及び電子部品の製造方法
EP2309829A1 (en) * 2009-09-24 2011-04-13 Harman Becker Automotive Systems GmbH Multilayer circuit board
TWI474349B (zh) * 2010-07-23 2015-02-21 Cyntec Co Ltd 線圈元件
JP5614205B2 (ja) * 2010-09-24 2014-10-29 株式会社村田製作所 電子部品
CN103703524B (zh) * 2011-08-31 2016-08-17 株式会社村田制作所 电子部件及其制造方法
KR101397488B1 (ko) * 2012-07-04 2014-05-20 티디케이가부시기가이샤 코일 부품 및 그의 제조 방법
JP5737313B2 (ja) * 2013-03-28 2015-06-17 Tdk株式会社 電子部品及びその製造方法
KR101933405B1 (ko) * 2013-08-19 2018-12-28 삼성전기 주식회사 코일 부품 및 그 실장 기판
KR101558092B1 (ko) * 2014-06-02 2015-10-06 삼성전기주식회사 칩 전자부품 및 그 실장기판
KR102080659B1 (ko) * 2014-09-16 2020-02-24 삼성전기주식회사 코일 부품 및 그 실장 기판
KR101652850B1 (ko) 2015-01-30 2016-08-31 삼성전기주식회사 칩 전자부품, 그 제조방법 및 이를 구비한 기판
KR102105394B1 (ko) * 2015-03-09 2020-04-28 삼성전기주식회사 코일 부품 및 그 실장 기판
KR101832559B1 (ko) * 2015-05-29 2018-02-26 삼성전기주식회사 코일 전자부품
KR102117512B1 (ko) * 2015-07-01 2020-06-01 삼성전기주식회사 코일 부품 및 그 실장 기판
KR101762026B1 (ko) * 2015-11-19 2017-07-26 삼성전기주식회사 코일 부품 및 그 실장 기판
JP6484194B2 (ja) * 2016-03-18 2019-03-13 太陽誘電株式会社 電子部品及びその製造方法
JP6721044B2 (ja) * 2016-05-16 2020-07-08 株式会社村田製作所 電子部品
JP6520875B2 (ja) * 2016-09-12 2019-05-29 株式会社村田製作所 インダクタ部品およびインダクタ部品内蔵基板
JP6394846B1 (ja) * 2016-12-20 2018-09-26 株式会社村田製作所 電子部品およびその製造方法
KR101876878B1 (ko) * 2017-03-16 2018-07-11 삼성전기주식회사 코일 부품
US11239019B2 (en) 2017-03-23 2022-02-01 Tdk Corporation Coil component and method of manufacturing coil component
JP6828555B2 (ja) 2017-03-29 2021-02-10 Tdk株式会社 コイル部品およびその製造方法
JP6627819B2 (ja) * 2017-04-27 2020-01-08 株式会社村田製作所 電子部品およびその製造方法
JP6673298B2 (ja) * 2017-06-05 2020-03-25 株式会社村田製作所 コイル部品
JP6686991B2 (ja) * 2017-09-05 2020-04-22 株式会社村田製作所 コイル部品
JP2019096818A (ja) * 2017-11-27 2019-06-20 株式会社村田製作所 積層型コイル部品
CN110010495B (zh) * 2018-12-26 2021-05-28 浙江集迈科微电子有限公司 一种高密度侧壁互联方法
US11783992B2 (en) * 2019-09-06 2023-10-10 Cyntec Co., Ltd. Integrally-formed inductor and a fabricatin method thereof
JP7099434B2 (ja) * 2019-11-29 2022-07-12 株式会社村田製作所 コイル部品
JP7472856B2 (ja) * 2021-06-04 2024-04-23 株式会社村田製作所 インダクタ部品

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* Cited by examiner, † Cited by third party
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JP3601619B2 (ja) 1995-01-23 2004-12-15 株式会社村田製作所 コモンモードチョークコイル
JPH09153406A (ja) * 1995-09-28 1997-06-10 Toshiba Corp 平面コイルおよびそれを用いた平面磁気素子およびそれらの製造方法
JPH09270325A (ja) * 1996-03-29 1997-10-14 Tokin Corp 電子部品
US6356181B1 (en) * 1996-03-29 2002-03-12 Murata Manufacturing Co., Ltd. Laminated common-mode choke coil
JP4093327B2 (ja) 1997-09-26 2008-06-04 Ｔｄｋ株式会社 高周波部品およびその製造方法
JP3791406B2 (ja) * 2001-01-19 2006-06-28 株式会社村田製作所 積層型インピーダンス素子
JP3767437B2 (ja) * 2001-09-05 2006-04-19 株式会社村田製作所 積層型コモンモードチョークコイル
JP3724405B2 (ja) * 2001-10-23 2005-12-07 株式会社村田製作所 コモンモードチョークコイル

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开平9-153406A 1997.06.10

Also Published As

Publication number Publication date
US7696849B2 (en) 2010-04-13
JP2005217268A (ja) 2005-08-11
CN1649043A (zh) 2005-08-03
US20050181684A1 (en) 2005-08-18

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