CN1489201A - 半导体器件 - Google Patents
半导体器件 Download PDFInfo
- Publication number
- CN1489201A CN1489201A CNA031553168A CN03155316A CN1489201A CN 1489201 A CN1489201 A CN 1489201A CN A031553168 A CNA031553168 A CN A031553168A CN 03155316 A CN03155316 A CN 03155316A CN 1489201 A CN1489201 A CN 1489201A
- Authority
- CN
- China
- Prior art keywords
- substrate
- mentioned
- cavity
- semiconductor device
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0652—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
- H05K3/4605—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated made from inorganic insulating material
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP249646/2002 | 2002-08-28 | ||
JP2002249646 | 2002-08-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN1489201A true CN1489201A (zh) | 2004-04-14 |
Family
ID=31492588
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA031553168A Pending CN1489201A (zh) | 2002-08-28 | 2003-08-27 | 半导体器件 |
Country Status (3)
Country | Link |
---|---|
US (1) | US6794747B2 (de) |
EP (1) | EP1394857A3 (de) |
CN (1) | CN1489201A (de) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100359709C (zh) * | 2005-06-09 | 2008-01-02 | 宁波雷登照明有限公司 | 快速散热白光大功率发光二极管 |
US7616446B2 (en) | 2004-12-15 | 2009-11-10 | Nec Corporation | Mobile terminal device and method for radiating heat therefrom |
CN101316485B (zh) * | 2007-05-28 | 2012-06-20 | 松下电器产业株式会社 | 电子元器件组件及电子元器件组件的制造方法 |
CN102881665A (zh) * | 2011-07-14 | 2013-01-16 | 英飞凌科技股份有限公司 | 用于晶片级封装的系统和方法 |
CN103026806A (zh) * | 2010-07-30 | 2013-04-03 | 日立汽车系统株式会社 | 用于车载用电子设备的基板构造 |
CN103811436A (zh) * | 2012-11-09 | 2014-05-21 | 辉达公司 | 改进堆叠式封装结构中的逻辑芯片的热性能 |
CN103904047A (zh) * | 2012-12-24 | 2014-07-02 | 佳邦科技股份有限公司 | 多功能半导体封装结构及其制作方法 |
CN104851841A (zh) * | 2014-02-13 | 2015-08-19 | 台湾积体电路制造股份有限公司 | 包括嵌入式表面贴装器件的半导体封装件及其形成方法 |
CN105006459A (zh) * | 2014-04-16 | 2015-10-28 | 光颉科技股份有限公司 | 承载件及具有该承载件的封装结构 |
CN105027276A (zh) * | 2013-07-31 | 2015-11-04 | 富士电机株式会社 | 半导体装置 |
CN106057732A (zh) * | 2016-08-08 | 2016-10-26 | 中国电子科技集团公司第五十四研究所 | 基于tsv技术和ltcc技术的开关矩阵的制造方法 |
CN107834989A (zh) * | 2017-11-08 | 2018-03-23 | 中国电子科技集团公司第二十六研究所 | 一种应用于薄膜体声波器件的高散热陶瓷外壳结构 |
CN109155452A (zh) * | 2016-05-24 | 2019-01-04 | 德州仪器公司 | 具有高热导率和高表面积的高频天线结构 |
WO2022205497A1 (zh) * | 2021-03-30 | 2022-10-06 | 光华临港工程应用技术研发(上海)有限公司 | 一种功率组件 |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3789410B2 (ja) * | 2002-08-29 | 2006-06-21 | 富士通メディアデバイス株式会社 | 表面実装型電子部品モジュールおよびその製造方法 |
JP3841092B2 (ja) * | 2003-08-26 | 2006-11-01 | 住友電気工業株式会社 | 発光装置 |
US20050046003A1 (en) * | 2003-08-26 | 2005-03-03 | Chung-Che Tsai | Stacked-chip semiconductor package and fabrication method thereof |
JP2005191530A (ja) * | 2003-12-03 | 2005-07-14 | Sumitomo Electric Ind Ltd | 発光装置 |
JP4042785B2 (ja) * | 2004-02-13 | 2008-02-06 | 株式会社村田製作所 | 電子部品及びその製造方法 |
US7321098B2 (en) * | 2004-04-21 | 2008-01-22 | Delphi Technologies, Inc. | Laminate ceramic circuit board and process therefor |
JP4528062B2 (ja) * | 2004-08-25 | 2010-08-18 | 富士通株式会社 | 半導体装置およびその製造方法 |
TWI245384B (en) * | 2004-12-10 | 2005-12-11 | Phoenix Prec Technology Corp | Package structure with embedded chip and method for fabricating the same |
US7250675B2 (en) * | 2005-05-05 | 2007-07-31 | International Business Machines Corporation | Method and apparatus for forming stacked die and substrate structures for increased packing density |
US7629683B1 (en) * | 2006-02-28 | 2009-12-08 | Juniper Networks, Inc. | Thermal management of electronic devices |
JP4821537B2 (ja) * | 2006-09-26 | 2011-11-24 | 株式会社デンソー | 電子制御装置 |
JP2008289131A (ja) * | 2007-04-17 | 2008-11-27 | Panasonic Corp | 送信装置と、これを用いた電子機器 |
US7561430B2 (en) * | 2007-04-30 | 2009-07-14 | Watlow Electric Manufacturing Company | Heat management system for a power switching device |
JPWO2009113267A1 (ja) * | 2008-03-14 | 2011-07-21 | パナソニック株式会社 | 半導体装置および半導体装置の製造方法 |
US7956381B1 (en) * | 2008-08-11 | 2011-06-07 | Hrl Laboratories, Llc | Multi-layered integrated circuit and apparatus with thermal management and method |
DE102010040512B4 (de) * | 2010-09-09 | 2016-03-10 | Infineon Technologies Ag | Chip mit einer Hochfrequenzschalteranordnung und Schaltungsanordnung, Verfahren zur Herstellung einer Hochfrequenzschaltungsanordnung |
JP5668627B2 (ja) * | 2011-07-19 | 2015-02-12 | 株式会社村田製作所 | 回路モジュール |
US9282642B2 (en) * | 2012-09-28 | 2016-03-08 | KYOCERA Circuit Solutions, Inc. | Wiring board |
US8853844B2 (en) * | 2013-02-07 | 2014-10-07 | Inpaq Technology Co., Ltd. | Multifunction semiconductor package structure and method of manufacturing the same |
KR20150053592A (ko) * | 2013-11-08 | 2015-05-18 | 삼성전기주식회사 | 전자 소자 모듈 및 그 제조 방법 |
JP6341822B2 (ja) * | 2014-09-26 | 2018-06-13 | 三菱電機株式会社 | 半導体装置 |
CN104465540A (zh) * | 2014-12-22 | 2015-03-25 | 永新电子常熟有限公司 | 稳定性好的电子芯片 |
WO2018168591A1 (ja) * | 2017-03-13 | 2018-09-20 | 株式会社村田製作所 | モジュール |
CN110392926B (zh) * | 2017-03-14 | 2022-12-06 | 株式会社村田制作所 | 高频模块 |
WO2018168500A1 (ja) | 2017-03-15 | 2018-09-20 | 株式会社村田製作所 | 高周波モジュール及び通信装置 |
JP7279324B2 (ja) | 2018-09-14 | 2023-05-23 | 富士電機株式会社 | 半導体モジュール |
KR102584100B1 (ko) | 2019-07-09 | 2023-10-04 | 가부시키가이샤 무라타 세이사쿠쇼 | 고주파 모듈 및 통신 장치 |
CN112399705B (zh) * | 2020-11-10 | 2022-09-30 | 四川深北电路科技有限公司 | 一种5g通讯设备用高频高导热混压板及其制作方法 |
JP2022147628A (ja) * | 2021-03-23 | 2022-10-06 | 株式会社東芝 | 半導体装置 |
US12047744B2 (en) * | 2021-04-26 | 2024-07-23 | Rf360 Singapore Pte. Ltd. | Etch stop and protection layer for capacitor processing in electroacoustic devices |
CN114938211B (zh) * | 2022-07-25 | 2022-12-02 | 西南应用磁学研究所(中国电子科技集团公司第九研究所) | 一种驱动电路及由其组成的小型化旋磁滤波器组件 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2725637B2 (ja) * | 1995-05-31 | 1998-03-11 | 日本電気株式会社 | 電子回路装置およびその製造方法 |
JP3138215B2 (ja) | 1996-07-19 | 2001-02-26 | 松下電器産業株式会社 | 回路基板用基材とプリプレグ及びそれを用いたプリント回路基板 |
US6114413A (en) * | 1997-07-10 | 2000-09-05 | International Business Machines Corporation | Thermally conducting materials and applications for microelectronic packaging |
KR100563122B1 (ko) * | 1998-01-30 | 2006-03-21 | 다이요 유덴 가부시키가이샤 | 하이브리드 모듈 및 그 제조방법 및 그 설치방법 |
DE19808986A1 (de) * | 1998-03-03 | 1999-09-09 | Siemens Ag | Halbleiterbauelement mit mehreren Halbleiterchips |
JP3216626B2 (ja) | 1999-01-20 | 2001-10-09 | 日本電気株式会社 | 増幅装置 |
JP2000278009A (ja) * | 1999-03-24 | 2000-10-06 | Nec Corp | マイクロ波・ミリ波回路装置 |
JP3582460B2 (ja) * | 2000-06-20 | 2004-10-27 | 株式会社村田製作所 | 高周波モジュール |
-
2003
- 2003-08-23 EP EP03019120A patent/EP1394857A3/de not_active Withdrawn
- 2003-08-26 US US10/648,697 patent/US6794747B2/en not_active Expired - Fee Related
- 2003-08-27 CN CNA031553168A patent/CN1489201A/zh active Pending
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7616446B2 (en) | 2004-12-15 | 2009-11-10 | Nec Corporation | Mobile terminal device and method for radiating heat therefrom |
US7903422B2 (en) | 2004-12-15 | 2011-03-08 | Nec Corporation | Mobile terminal device and method for radiating heat therefrom |
CN100359709C (zh) * | 2005-06-09 | 2008-01-02 | 宁波雷登照明有限公司 | 快速散热白光大功率发光二极管 |
CN101316485B (zh) * | 2007-05-28 | 2012-06-20 | 松下电器产业株式会社 | 电子元器件组件及电子元器件组件的制造方法 |
CN103026806A (zh) * | 2010-07-30 | 2013-04-03 | 日立汽车系统株式会社 | 用于车载用电子设备的基板构造 |
CN102881665B (zh) * | 2011-07-14 | 2015-06-03 | 英飞凌科技股份有限公司 | 用于晶片级封装的系统和方法 |
CN102881665A (zh) * | 2011-07-14 | 2013-01-16 | 英飞凌科技股份有限公司 | 用于晶片级封装的系统和方法 |
CN103811436A (zh) * | 2012-11-09 | 2014-05-21 | 辉达公司 | 改进堆叠式封装结构中的逻辑芯片的热性能 |
CN103904047A (zh) * | 2012-12-24 | 2014-07-02 | 佳邦科技股份有限公司 | 多功能半导体封装结构及其制作方法 |
CN103904047B (zh) * | 2012-12-24 | 2016-12-28 | 佳邦科技股份有限公司 | 多功能半导体封装结构及其制作方法 |
CN105027276A (zh) * | 2013-07-31 | 2015-11-04 | 富士电机株式会社 | 半导体装置 |
CN105027276B (zh) * | 2013-07-31 | 2018-03-06 | 富士电机株式会社 | 半导体装置 |
CN104851841A (zh) * | 2014-02-13 | 2015-08-19 | 台湾积体电路制造股份有限公司 | 包括嵌入式表面贴装器件的半导体封装件及其形成方法 |
CN105006459A (zh) * | 2014-04-16 | 2015-10-28 | 光颉科技股份有限公司 | 承载件及具有该承载件的封装结构 |
CN109155452A (zh) * | 2016-05-24 | 2019-01-04 | 德州仪器公司 | 具有高热导率和高表面积的高频天线结构 |
CN106057732A (zh) * | 2016-08-08 | 2016-10-26 | 中国电子科技集团公司第五十四研究所 | 基于tsv技术和ltcc技术的开关矩阵的制造方法 |
CN106057732B (zh) * | 2016-08-08 | 2019-03-15 | 中国电子科技集团公司第五十四研究所 | 基于tsv技术和ltcc技术的开关矩阵的制造方法 |
CN107834989A (zh) * | 2017-11-08 | 2018-03-23 | 中国电子科技集团公司第二十六研究所 | 一种应用于薄膜体声波器件的高散热陶瓷外壳结构 |
CN107834989B (zh) * | 2017-11-08 | 2022-10-25 | 中电科技集团重庆声光电有限公司 | 一种应用于薄膜体声波器件的高散热陶瓷外壳结构 |
WO2022205497A1 (zh) * | 2021-03-30 | 2022-10-06 | 光华临港工程应用技术研发(上海)有限公司 | 一种功率组件 |
Also Published As
Publication number | Publication date |
---|---|
EP1394857A3 (de) | 2004-04-07 |
US6794747B2 (en) | 2004-09-21 |
US20040041256A1 (en) | 2004-03-04 |
EP1394857A2 (de) | 2004-03-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1489201A (zh) | 半导体器件 | |
CN1221029C (zh) | 高频半导体装置 | |
CN1159956C (zh) | 装有芯片封装的电路基板的端电极及其制造方法 | |
CN1224301C (zh) | 高频模块 | |
CN1021174C (zh) | 半导体组件 | |
CN1197153C (zh) | 半导体器件 | |
CN1336787A (zh) | 陶瓷叠层器件 | |
CN1340991A (zh) | 布线基板及其制造方法 | |
JP3245329B2 (ja) | 半導体素子収納用パッケージ | |
CN1468448A (zh) | 具有埋置电容器的电子封装及其制造方法 | |
CN101048863A (zh) | 电子部件模块以及无线通信设备 | |
US20070053167A1 (en) | Electronic circuit module and manufacturing method thereof | |
CN105122443A (zh) | 高频元件及具备其的高频模块 | |
CN1512578A (zh) | 半导体模块 | |
CN1441613A (zh) | 高频组件 | |
CN1229330A (zh) | 混合模块及其制造方法与其安装方法 | |
CN1551343A (zh) | 电子元件封装结构及其制造方法 | |
CN1906759A (zh) | 元器件内组装及其制造方法 | |
CN1574608A (zh) | 温度补偿晶体振荡器 | |
CN1866515A (zh) | 包含顺序堆叠的模拟半导体芯片和数字半导体芯片的sip型封装及其制造方法 | |
CN1705105A (zh) | 电路装置及其制造方法 | |
CN1815733A (zh) | 半导体装置及其制造方法 | |
CN1674278A (zh) | 电路装置 | |
CN1240255C (zh) | 电源模块和其制造方法 | |
JP2017183677A (ja) | 回路モジュールおよびその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |